RF Circuit Design

RICHARD CHI-HSI LI has more than twenty years experience with RF circuit design and has worked for companies such as Motorola, Texas Instruments, and RCA. Professor Li has taught many courses and given more than sixty lectures on RF circuit design in recent years.

• PREFACE TO THE SECOND EDITION xix PART 1 DESIGN TECHNOLOGIES AND SKILLS 11 DIFFERENCE BETWEEN RF AND DIGITAL CIRCUIT DESIGN 31.1 Controversy 31.2 Difference of RF and Digital Block in a Communication System 61.3 Conclusions 91.4 Notes for High-Speed Digital Circuit Design 92 REFLECTION AND SELF-INTERFERENCE 152.1 Introduction 152.2 Voltage Delivered from a Source to a Load 162.3 Power Delivered from a Source to a Load 232.4 Impedance Conjugate Matching 332.5 Additional Effect of Impedance Matching 423 IMPEDANCE MATCHING IN THE NARROW-BAND CASE 613.1 Introduction 613.2 Impedance Matching by Means of Return Loss Adjustment 633.3 Impedance Matching Network Built by One Part 683.4 Impedance Matching Network Built by Two Parts 743.5 Impedance Matching Network Built By Three Parts 843.6 Impedance Matching When ZS Or ZL Is Not 50 853.7 Parts In An Impedance Matching Network 934 IMPEDANCE MATCHING IN THE WIDEBAND CASE 1314.1 Appearance of Narrow and Wideband Return Loss on a Smith Chart 1314.2 Impedance Variation Due to the Insertion of One Part Per Arm or Per Branch 1364.3 Impedance Variation Due to the Insertion of Two Parts Per Arm or Per Branch 1454.4 Partial Impedance Matching for an IQ (in Phase Quadrature) Modulator in a UWB (Ultra Wide Band) System 1514.5 Discussion of Passive Wideband Impedance Matching Network 1745 IMPEDANCE AND GAIN OF A RAW DEVICE 1815.1 Introduction 1815.2 Miller Effect 1835.3 Small-Signal Model of a Bipolar Transistor 1875.4 Bipolar Transistor with CE (Common Emitter) Configuration 1905.5 Bipolar Transistor with CB (Common Base) Configuration 2045.6 Bipolar Transistor with CC (Common Collector) Configuration 2145.7 Small-Signal Model of a MOSFET 2215.8 Similarity Between a Bipolar Transistor and a MOSFET 2255.9 MOSFET with CS (Common Source) Configuration 2355.10 MOSFET with CG (Common Gate) Configuration 2445.11 MOSFET with CD (Common Drain) Configuration 2495.12 Comparison of Transistor Configuration of Single-stage Amplifiers with Different Configurations 2526 IMPEDANCE MEASUREMENT 2596.1 Introduction 2596.2 Scalar and Vector Voltage Measurement 2606.3 Direct Impedance Measurement by a Network Analyzer 2636.4 Alternative Impedance Measurement by Network Analyzer 2726.5 Impedance Measurement Using a Circulator 2767 GROUNDING 2817.1 Implication of Grounding 2817.2 Possible Grounding Problems Hidden in a Schematic 2837.3 Imperfect or Inappropriate Grounding Examples 2847.4 'Zero' Capacitor 2907.5 Quarter Wavelength of Microstrip Line 3008 EQUIPOTENTIALITY AND CURRENT COUPLING ON THE GROUND SURFACE 3258.1 Equipotentiality on the Ground Surface 3258.2 Forward and Return Current Coupling 3358.3 PCB or IC Chip with Multimetallic Layers 3449 LAYOUT 3499.1 Difference in Layout between an Individual Block and a System 3499.2 Primary Considerations of a PCB 3509.3 Layout of a PCB for Testing 3529.4 VIA Modeling 3559.5 Runner 3609.6 Parts 3699.7 Free Space 37110 MANUFACTURABILITY OF PRODUCT DESIGN 37710.1 Introduction 37710.2 Implication of 6σ Design 37910.3 Approaching 6σ Design 38310.4 Monte Carlo Analysis 38611 RFIC (RADIO FREQUENCY INTEGRATED CIRCUIT) 40111.1 Interference and Isolation 40111.2 Shielding for an RF Module by a Metallic Shielding Box 40311.3 Strong Desirability to Develop RFIC 40511.4 Interference going along IC Substrate Path 40611.5 Solution for Interference Coming from Sky 41111.6 Common Grounding Rules for RF Module and RFIC Design 41211.7 Bottlenecks in RFIC Design 41411.8 Calculating of Quarter Wavelength 420PART 2 RF SYSTEM 42712 MAIN PARAMETERS AND SYSTEM ANALYSIS IN RF CIRCUIT DESIGN 42912.1 Introduction 42912.2 Power Gain 43112.3 Noise 44112.4 Nonlinearity 45312.5 Other Parameters 48012.6 Example of RF System Analysis 48213 SPECIALITY OF "‘ZERO IF"’ SYSTEM 50113.1 Why Differential Pair? 50113.2 Can DC Offset be Blocked out by a Capacitor? 50813.3 Chopping Mixer 51113.4 DC Offset Cancellation by Calibration 51613.5 Remark on DC Offset Cancellation 51714 DIFFERENTIAL PAIRS 52114.1 Fundamentals of Differential Pairs 52114.2 CMRR (Common Mode Rejection Ratio) 53315 RF BALUN 54715.1 Introduction 54715.2 Transformer Balun 54915.3 LC Balun 57115.4 Microstrip Line Balun 58015.5 Mixing Type of Balun 58316 SOC (SYSTEM-ON-A-CHIP) AND NEXT 61116.1 SOC 61116.2 What is Next 612PART 3 INDIVIDUAL RF BLOCKS 62517 LNA (LOW-NOISE AMPLIFIER) 62717.1 Introduction 62717.2 Single-Ended Single Device LNA 62817.3 Single-Ended Cascode LNA 66217.4 LNA with AGC (Automatic Gain Control) 68418 MIXER 69518.1 Introduction 69518.2 Passive Mixer 69818.3 Active Mixer 70618.4 Design Schemes 71719 TUNABLE FILTER 73119.1 Tunable Filter in A Communication System 73119.2 Coupling between two Tank Circuits 73319.3 Circuit Description 73819.4 Effect of Second Coupling 73919.5 Performance 74320 VCO (VOLTAGE-CONTROLLED OSCILLATOR) 74920.1 "Three-Point" Types of Oscillator 74920.2 Other Single-Ended Oscillators 75520.3 VCO and PLL (Phase Lock Loop) 75920.4 Design Example of a Single-Ended VCO 76920.5 Differential VCO and Quad-Phases VCO 77821 PA (POWER AMPLIFIER) 78921.1 Classification of PA 78921.2 Single-Ended PA 79421.3 Single-Ended PA IC Design 79821.4 Push–Pull PA Design 79921.5 PA with Temperature Compensation 82221.6 PA with Output Power Control 82321.7 Linear PA 824References 828Further Reading 828Exercises 829Answers 829INDEX 833