Woodhead Publishing Series in Electronic and Optical Materials - Böcker

Polymer Optical Fibres

Fibre Types, Materials, Fabrication, Characterisation and Applications

Materials Characterization Using Nondestructive Evaluation (NDE) Methods

Magnetic Nano- and Microwires

Design, Synthesis, Properties and Applications

Advances in Chemical Mechanical Planarization (CMP)

Biomimetic Technologies

Principles and Applications

Directed Self-assembly of Block Co-polymers for Nano-manufacturing

Laser Additive Manufacturing

Materials, Design, Technologies, and Applications

Wireless MEMS Networks and Applications

TV White Space Communications and Networks

Principles and Applications of Organic Light Emitting Diodes (OLEDs)

Nitride Semiconductor Light-Emitting Diodes (LEDs)

Materials, Technologies and Applications

Handbook of Flexible Organic Electronics

Materials, Manufacturing and Applications

Advanced Piezoelectric Materials

Science and Technology

Waste Electrical and Electronic Equipment (WEEE) Handbook

Printed Films

Materials Science and Applications in Sensors, Electronics and Photonics

Electromigration in Thin Films and Electronic Devices

Materials and Reliability

Thin Film Growth

Physics, Materials Science and Applications

Advanced Adhesives in Electronics

Materials, Properties and Applications

High-Temperature Superconductors

Silicon-Germanium (SiGe) Nanostructures

Production, Properties and Applications in Electronics

Nanostructured Semiconductors

Nitride Semiconductor Light-Emitting Diodes (LEDs)

Materials, Technologies, and Applications

Luminescence Thermometry

Methods, Materials, and Applications

Defects in Advanced Electronic Materials and Novel Low Dimensional Structures

Smart Sensors and MEMS

Intelligent Sensing Devices and Microsystems for Industrial Applications

Waste Electrical and Electronic Equipment Recycling

Aqueous Recovery Methods

High Mobility Materials for CMOS Applications

Optical Thin Films and Coatings

From Materials to Applications

Wide Bandgap Power Semiconductor Packaging

Materials, Components, and Reliability