Michael G. Pecht - Böcker

Encapsulation Technologies for Electronic Applications

Nature-Inspired Computing Paradigms in Systems

Reliability, Availability, Maintainability, Safety and Cost (RAMS+C) and Prognostics and Health Management (PHM)

Influence of Temperature on Microelectronics and System Reliability

A Physics of Failure Approach

IC Component Sockets

Parts Selection and Management

Soldering Processes and Equipment

Quality Conformance and Qualification of Microelectronic Packages and Interconnects

Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines

A Focus on Reliability

Lead-free Electronics

China's Electronics Industry

The Definitive Guide for Companies and Policy Makers with Interest in China

Encapsulation Technologies for Electronic Applications

Influence of Temperature on Microelectronics and System Reliability

A Physics of Failure Approach

Strategies to the Prediction, Mitigation and Management of Product Obsolescence

Reliability Engineering

Prognostics and Health Management of Electronics

Fundamentals, Machine Learning, and the Internet of Things

Electrical Connectors

Design, Manufacture, Test, and Selection

Safety Challenges and Strategies of Using Lithium-Ion Batteries

Safety Challenges and Strategies

Optimum Cooling of Data Centers

Application of Risk Assessment and Mitigation Techniques

Copper Wire Bonding

Optimum Cooling of Data Centers

Application of Risk Assessment and Mitigation Techniques

Copper Wire Bonding

Risk-Based Engineering

An Integrated Approach to Complex Systems—Special Reference to Nuclear Plants