Springer Series in Advanced Microelectronics - Böcker

Bonding in Microsystem Technology

Power Management of Digital Circuits in Deep Sub-Micron CMOS Technologies

Advanced Materials for Thermal Management of Electronic Packaging

Advanced Materials for Thermal Management of Electronic Packaging

System-level Test and Validation of Hardware/Software Systems

System-level Test and Validation of Hardware/Software Systems

Silicon Optoelectronic Integrated Circuits

Microwave Electronics

Introduction to the Theory of Dielectric Resonators

Advanced Materials for Integrated Optical Waveguides

Lattices of Dielectric Resonators

Optoelectronic Circuits in Nanometer CMOS Technology

Lattices of Dielectric Resonators

Advanced Materials for Integrated Optical Waveguides

Solid-State-Drives (SSDs) Modeling

Simulation Tools & Strategies

Field Emission Electronics

Microwave Electronics

Optoelectronic Circuits in Nanometer CMOS Technology

3D Microelectronic Packaging

From Fundamentals to Applications

Solid-State-Drives (SSDs) Modeling

Simulation Tools & Strategies

Field Emission Electronics

Lock-in Thermography

Basics and Use for Evaluating Electronic Devices and Materials

Current Sense Amplifiers for Embedded SRAM in High-Performance System-on-a-Chip Designs

Integrated CMOS Circuits for Optical Communications

High Dielectric Constant Materials

VLSI MOSFET Applications

Low Power VCO Design in CMOS

Gettering Defects in Semiconductors

Continuous-Time Sigma-Delta A/D Conversion

Fundamentals, Performance Limits and Robust Implementations

Detection and Signal Processing

Technical Realization