Ibrahim (Abe) M. Elfadel - Böcker

Machine Learning in VLSI Computer-Aided Design

IoT Physical Layer

Design and Implementation

VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things

25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers

VLSI-SoC: Opportunities and Challenges Beyond the Internet of Things

25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, Abu Dhabi, United Arab Emirates, October 23–25, 2017, Revised and Extended Selected Papers

Secure, Low-Power IoT Communication Using Edge-Coded Signaling

Secure, Low-Power IoT Communication Using Edge-Coded Signaling

Tapered Beams in MEMS

A Symbolic Modeling Framework with Applications to Energy Harvesting

VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence

31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16–18, 2023, Revised Extended Selected Papers

3D Stacked Chips

From Emerging Processes to Heterogeneous Systems

3D Stacked Chips

From Emerging Processes to Heterogeneous Systems