Ephraim Suhir - Böcker

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Human-in-the-Loop

Probabilistic Modeling of an Aerospace Mission Outcome

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging

Structural Dynamics of Electronic and Photonic Systems

Human-in-the-Loop

Probabilistic Modeling of an Aerospace Mission Outcome

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Volume I Materials Physics - Materials Mechanics. Volume II Physical Design - Reliability and Packaging

Structural Analysis in Microelectronic and Fiber-Optic Systems

Volume I Basic Principles of Engineering Elastictiy and Fundamentals of Structural Analysis