Avram Bar-Cohen – författare

Design and Analysis of Heat Sinks

Encyclopedia of Thermal Packaging

Set 3: Thermal Packaging Applications: (A 3–Volume Set)

ENCYCLOPEDIA OF THERMAL PACKAGING, SET 2: THERMAL PACKAGING TOOLS - VOLUME 3: COMPACT THERMAL MODELS OF ELECTRONIC COMPONENTS

ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES - VOLUME 5: ENERGY EFFICIENT SOLID STATE LIGHTING

ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES - VOLUME 6: EXPERIMENTAL THERMOFLUID CHARACTERIZATION OF ELECTRONIC COMPONENTS

ENCYCLOPEDIA OF THERMAL PACKAGING, SET 2: THERMAL PACKAGING TOOLS - VOLUME 1: COOLING OF MICROELECTRONIC AND NANOELECTRONIC EQUIPMENT: ADVANCES AND EMERGING RESEARCH

ENCYCLOPEDIA OF THERMAL PACKAGING, SET 2: THERMAL PACKAGING TOOLS - VOLUME 2: ENERGY OPTIMIZATION AND THERMAL MANAGEMENT OF DATA CENTERS

ENCYCLOPEDIA OF THERMAL PACKAGING, SET 2: THERMAL PACKAGING TOOLS - VOLUME 4: THERMALLY-INFORMED DESIGN OF MICROELECTRONIC COMPONENTS

ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES (A 6-VOLUME SET)

ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES - VOLUME 1: MICROCHANNEL HEAT SINKS FOR ELECTRONICS COOLING

ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES - VOLUME 2: AIR- AND LIQUID-COOLED COLD PLATES

ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES - VOLUME 3: DIELECTRIC LIQUID COOLING OF IMMERSED COMPONENTS