Based on his long-term accumulation in thermal science (phase-change heat transfer enhancement, microscale heat and mass transfer, multiphase flow) and microfluidics, Prof. Wu has mainly engaged in interdisciplinary research on efficient thermal management of chips/power electronics, electronic devices and data centers, participating in numerous research projects from various national agencies and industry in Sweden and China. He has participated in numerous papers, journals, and books from international publishers such as Springer, CRC Press, Wiley, Royal Society of Chemistry, etc. Dr. Feng is highly experienced in the industry and has carried out projects on thermal management of high-power-density converters and electric vehicles. Dr. Feng has engaged in pumped two-phase cooling and battery thermal management through both experiments and numerical simulations. Prof. Hong is a professor working on the development and application of advanced boiling heat transfer devices in Japan and China. As the project leader or subleader, she has participated in various research projects funded by the government and industry. She has published numerous papers in international journals.

• Part I: Fundamentals of Electronics Cooling1. Introduction to Electronics Cooling2. Thermodynamics and Heat Transfer Basics3. Cooling Mechanisms in ElectronicsPart II: Practical Applications in Electronics Cooling4. Cooling Strategies for AI chips5. Cooling in Power Electronics6. Thermal management in Power Battery7. Cooling in Mobile and Wearable Devices8. Thermal Management in Data CentersPart III: Emerging Trends and Innovations9. Functional Materials and Their Role in Thermal Management10. Additive Manufacturing in Thermal Management11. Machine Learning in Thermal Management12. Thermal Design, Testing and Validation of Cooling SolutionsPart IV: Future Directions and Case Studies13. Next-Generation Cooling Technologies14. Conclusion and Outlook

Based on his long-term accumulation in thermal science (phase-change heat transfer enhancement, microscale heat and mass transfer, multiphase flow) and microfluidics, Prof. Wu has mainly engaged in interdisciplinary research on efficient thermal management of chips/power electronics, electronic devices and data centers, participating in numerous research projects from various national agencies and industry in Sweden and China. He has participated in numerous papers, journals, and books from international publishers such as Springer, CRC Press, Wiley, Royal Society of Chemistry, etc. Dr. Feng is highly experienced in the industry and has carried out projects on thermal management of high-power-density converters and electric vehicles. Dr. Feng has engaged in pumped two-phase cooling and battery thermal management through both experiments and numerical simulations. Prof. Hong is a professor working on the development and application of advanced boiling heat transfer devices in Japan and China. As the project leader or subleader, she has participated in various research projects funded by the government and industry. She has published numerous papers in international journals.

• Part I: Fundamentals of Electronics Cooling1. Introduction to Electronics Cooling2. Thermodynamics and Heat Transfer Basics3. Cooling Mechanisms in ElectronicsPart II: Practical Applications in Electronics Cooling4. Cooling Strategies for AI chips5. Cooling in Power Electronics6. Thermal management in Power Battery7. Cooling in Mobile and Wearable Devices8. Thermal Management in Data CentersPart III: Emerging Trends and Innovations9. Functional Materials and Their Role in Thermal Management10. Additive Manufacturing in Thermal Management11. Machine Learning in Thermal Management12. Thermal Design, Testing and Validation of Cooling SolutionsPart IV: Future Directions and Case Studies13. Next-Generation Cooling Technologies14. Conclusion and Outlook

Based on his long-term accumulation in thermal science (phase-change heat transfer enhancement, microscale heat and mass transfer, multiphase flow) and microfluidics, Prof. Wu has mainly engaged in interdisciplinary research on efficient thermal management of chips/power electronics, electronic devices and data centers, participating in numerous research projects from various national agencies and industry in Sweden and China. He has participated in numerous papers, journals, and books from international publishers such as Springer, CRC Press, Wiley, Royal Society of Chemistry, etc. Dr. Feng is highly experienced in the industry and has carried out projects on thermal management of high-power-density converters and electric vehicles. Dr. Feng has engaged in pumped two-phase cooling and battery thermal management through both experiments and numerical simulations. Prof. Hong is a professor working on the development and application of advanced boiling heat transfer devices in Japan and China. As the project leader or subleader, she has participated in various research projects funded by the government and industry. She has published numerous papers in international journals.

• Part I: Fundamentals of Electronics Cooling1. Introduction to Electronics Cooling2. Thermodynamics and Heat Transfer Basics3. Cooling Mechanisms in ElectronicsPart II: Practical Applications in Electronics Cooling4. Cooling Strategies for AI chips5. Cooling in Power Electronics6. Thermal management in Power Battery7. Cooling in Mobile and Wearable Devices8. Thermal Management in Data CentersPart III: Emerging Trends and Innovations9. Functional Materials and Their Role in Thermal Management10. Additive Manufacturing in Thermal Management11. Machine Learning in Thermal Management12. Thermal Design, Testing and Validation of Cooling SolutionsPart IV: Future Directions and Case Studies13. Next-Generation Cooling Technologies14. Conclusion and Outlook