Q.-Y. TONG is Professor and Director of the Microelectronics Center at Southeast University in Nanjing, China, and Adjunct Professor at Duke University's School of Engineering. Currently, he is also the manager of the Wafer Bonding Lab at the Research Triangle Institute. He was formerly a consultant at the Max-Planck-Institute of Microstructure Physics. U. GÖSELE, PhD, is Director at the Max-Planck-Institute of Microstructure Physics in Halle, Germany, and J.B. Duke Professor of Materials Science at Duke University's School of Engineering in Durham, North Carolina.

• Basics of Interactions Between Flat Surfaces. Influence of Particles, Surface Steps, and Cavities. Surface Preparation and Room-Temperature Wafer Bonding. Thermal Treatment of Bonded Wafer Pairs. Thinning Procedures. Electrical Properties of Bonding Interfaces. Stresses in Bonded Wafers. Bonding of Dissimilar Materials. Bonding of Structured Wafers. Mainstream Applications. Emerging and Future Applications. Index.

Q.-Y. TONG is Professor and Director of the Microelectronics Center at Southeast University in Nanjing, China, and Adjunct Professor at Duke University's School of Engineering. Currently, he is also the manager of the Wafer Bonding Lab at the Research Triangle Institute. He was formerly a consultant at the Max-Planck-Institute of Microstructure Physics. U. GÖSELE, PhD, is Director at the Max-Planck-Institute of Microstructure Physics in Halle, Germany, and J.B. Duke Professor of Materials Science at Duke University's School of Engineering in Durham, North Carolina.

• Basics of Interactions Between Flat Surfaces. Influence of Particles, Surface Steps, and Cavities. Surface Preparation and Room-Temperature Wafer Bonding. Thermal Treatment of Bonded Wafer Pairs. Thinning Procedures. Electrical Properties of Bonding Interfaces. Stresses in Bonded Wafers. Bonding of Dissimilar Materials. Bonding of Structured Wafers. Mainstream Applications. Emerging and Future Applications. Index.

Q.-Y. TONG is Professor and Director of the Microelectronics Center at Southeast University in Nanjing, China, and Adjunct Professor at Duke University's School of Engineering. Currently, he is also the manager of the Wafer Bonding Lab at the Research Triangle Institute. He was formerly a consultant at the Max-Planck-Institute of Microstructure Physics. U. GÖSELE, PhD, is Director at the Max-Planck-Institute of Microstructure Physics in Halle, Germany, and J.B. Duke Professor of Materials Science at Duke University's School of Engineering in Durham, North Carolina.

• Basics of Interactions Between Flat Surfaces. Influence of Particles, Surface Steps, and Cavities. Surface Preparation and Room-Temperature Wafer Bonding. Thermal Treatment of Bonded Wafer Pairs. Thinning Procedures. Electrical Properties of Bonding Interfaces. Stresses in Bonded Wafers. Bonding of Dissimilar Materials. Bonding of Structured Wafers. Mainstream Applications. Emerging and Future Applications. Index.