bokomslag Reliability of Microtechnology

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204 sidor
2014

Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail. The book also includes exercises and detailed solutions at the end of each chapter.

Författare: Johan Liu, Olli Salmela, Jussi Sarkka, James E Morris, Per-Erik Tegehall
Format: Pocket/Paperback
ISBN: 9781489982117
Språk: Engelska
Antal sidor: 204
Utgivningsdatum: 2014-10-11
Förlag: Springer-Verlag New York Inc.