Reliability and Failure of Electronic Materials and Devices
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The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise.
- Discusses reliability and failure on both the chip and packaging levels
- Handles the role of defects in yield and reliability
- Includes a tutorial chapter on the mathematics of reliability
- Focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints
- Considers defect detection methods and failure analysis techniques
Produktinformation
- Utgivningsdatum1998-06-12
- Mått152 x 229 x undefined mm
- Vikt1 090 g
- FormatInbunden
- SpråkEngelska
- Antal sidor720
- FörlagElsevier Science
- ISBN9780125249850