Häftad, Engelska, 2017
Del i serien Devices, Circuits, and Systems
Optical, Acoustic, Magnetic, and Mechanical Sensor Technologies
1719 kr
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Beskrivning
Produktinformation
- Utgivningsdatum: 2017-03-30
- Mått: 156 x 234 x 19 mm
- Vikt: 400 g
- Format: Häftad
- Språk: Engelska
- Serie: Devices, Circuits, and Systems
- Antal sidor: 358
- Förlag: Taylor & Francis Ltd
- ISBN: 9781138074811
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Mer information
Krzysztof (Kris) Iniewski manages R&D at Redlen Technologies Inc., a start-up company in Vancouver, British Columbia, Canada. Redlen’s revolutionary production process for advanced semiconductor materials is enabling a new generation of more accurate, all-digital, radiation-based imaging solutions. Dr. Iniewski is also president of CMOS Emerging Technologies, which organizes high-tech events covering communications, microsystems, optoelectronics, and sensors. Dr. Iniewski has held numerous faculty and management positions at the University of Toronto, the University of Alberta, SFU, and PMC-Sierra, Inc. He holds 18 international patents, has published more than 100 research papers in international journals and conferences, and has written and edited several books. He is frequently invited as a speaker and has consulted for several organizations around the world.
Recensioner i media
"The theory and operation of intensity and phase-based- and wavelength-based-fibers sensors are nicely reviewed. ... Coverage that may interest our readers includes scanning of magnetic fields, microsystems for sensing airflow, temperature and humidity by combining MEMS and CMOS technologies, MEMS-based hotplate devices for gas sensing applications, vibration energy harvesting methods using piezoelectric based MEMS, and self-powered wireless sensing in ground transport applications. ... Because mathematical details and in-depth theory are not thoroughly reviewed, the presented material is descriptive in nature and includes many illustrations, making this book very accessible to a general technical audience interested in sensing technology."—John J. Shea, IEEE Electrical Insulation Magazine, March/April, Vol. 29, No.2, 2013
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