Multilayer Ceramic Substrate - Technology for VLSI Package/Multichip Module

A translation of an important Japanese work on electronic ceramics, this work is particularly concerned with the manufacturing processes of multilayer ceramic substrates for use in semiconductors. This processing technology is important in helping to create efficient high speed devices and has a wide range of applications in many areas of general electronics. In order to improve the dimensional accuracy of alumina ceramic multilayer substrate, theoretical and experimental studies are included concentrating on the process conditions of pwder preparation, mixing, casting, printing, laminating and firing. The relationship between dimensional control and process vairation is described along with an analysis of adhesion in the layers of a tungsten and aluminium substrate.