Modern Electroplating

MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada. He has published over 120 research papers, holds four patents, and has served as associate editor for the Journal of The Electrochemical Society, Electrochemical and Solid-State Letters, and as coeditor of the Canadian Journal of Physics. Schlesinger is coauthor, with Milan Paunovic, of the first and second editions of Fundamentals of Electrochemical Deposition and the previous edition of Modern Electroplating (both by Wiley).MILAN PAUNOVIC, PhD, had, until his recent retirement, worked on electrochemical metal deposition for over four decades, most recently in the Electrodeposition Technology Department at IBM's T. J. Watson Research Center, and previously at the University of Pennsylvania, Reynolds Metals, Kollmorgen, and Intel. In addition to coauthoring, with Mordechay Schlesinger, the first and second editions of Fundamentals of Electrochemical Deposition and the previous edition of Modern Electroplating, Dr. Paunovic has edited symposia proceedings for The Electrochemical Society, published forty-one research papers, and holds seven patents.

• Preface viiPreface to the Fourth Edition ixContributors xiConversion Factors xiiiGraphical Conversions xvThe Electrochemical Society Series xvii1 Fundamental Considerations 1Milan Paunovic, Mordechay Schlesinger, and Dexter D. Snyder2 Electrodeposition of Copper 33Jack W. Dini and Dexter D. Snyder3 Electrodeposition of Nickel 79George A. Di Bari4 Electrodeposition of Gold 115Paul A. Kohl5 Electroless and Electrodeposition of Silver 131Mordechay Schlesinger6 Tin and Tin Alloys for Lead-Free Solder 139Yun Zhang7 Electrodeposition of Chromium 205Nenad V. Mandich and Donald L. Snyder8 Electrodeposition of Lead and Lead Alloys 249Manfred Jordan9 Electrodeposition of Tin–Lead Alloys 265Manfred Jordan10 Electrodeposition of Zinc and Zinc Alloys 285René Winand11 Electrodeposition of Iron and Iron Alloys 309Masanobu Izaki12 Palladium Electroplating 327Joseph A. Abys13 Electrochemical Deposition Process for ULSI Interconnection Devices 369Tetsuya Osaka and Masahiro Yoshino14 Electrodeposition of Semiconductors 383T. E. Schlesinger, Krishnan Rajeshwar, and Norma R. De Tacconi15 Deposition on Nonconductors 413Mordechay Schlesinger16 Conductive Polymers: Electroplating of Organic Films 421Tetsuya Osaka, Shinichi Komaba, and Toshiyuki Momma17 Electroless Deposition of Copper 433Milan Paunovic18 Electroless Deposition of Nickel 447Mordechay Schlesinger19 Electrochemical Synthesis of Metal Alloys for Magnetic Recording Systems 459Atsushi Sugiyama, Masahiro Yoshino, Takuma Hachisu, and Tetsuya Osaka20 Electroless Deposition of Palladium and Platinum 477Izumi Ohno21 Electroless Deposition of Gold 483Yutaka Okinaka and Masaru Kato22 Electroless Deposition of Alloys 499Izumi Ohno23 Preparation for Deposition 507Dexter D. Snyder24 Manufacturing Tools 513Tom Ritzdorf25 Monitoring and Control 527Tom Ritzdorf26 Environmental Aspects of Electrodeposition 555Micha Tomkiewicz27 Applications to Magnetic Recording and Microelectronic Technologies 573Stanko R. Brankovic, Natasa Vasiljevic, and Nikolay Dimitrov28 Microelectromechanical Systems 617Giovanni Zangari29 Analysis of Electroplated Films Using Dual-Beam FIB/SEM and TEM Techniques 637Xianying Meng-Burany30 Ionic Liquid Treatments for Enhanced Corrosion Resistance of Magnesium-Based Substrates 665Robert Petro, Mordechay Schlesinger, and Guang-Ling SongAppendix 687Index 701

"This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical , the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject." (Digital Post Production, 23 November 2010) "With advances in information-age technologies, the field of electroplating has seen dramatic growth in the decade since the previous edition of Modern Electroplating was published. This expanded new edition addresses these developments, providing a comprehensive, one-stop reference to the latest methods and applications of electroplating of metals, alloys, semiconductors, and conductive polymers. With special emphasis on electroplating and electrochemical plating in nanotechnologies, data storage, and medical applications, the Fifth Edition boasts vast amounts of new and revised material, unmatched in breadth and depth by any other book on the subject". (GNT, 23 November 2010)'This will be a very long-lasting popular reference book, now in it's 5th edition. (IEEE Electrical insulation magazine 2016)