Materials and Failures in MEMS and NEMS

Dr. Atul Tiwari is a research faculty member in the Department of Mechanical Engineering at the University of Hawaii, USA. He has received Ph.D. in Polymer Materials Science along with the bestowed Chartered Chemist and Chartered Scientist status from the Royal Society of Chemistry, UK. Dr. Tiwari is an active member of several professional bodies in the UK, USA, and India. Being an organic chemist and mechanical engineer his research work tends to bridge the gap between the science and engineering. Dr. Tiwari has published more than sixty peer reviewed research publications. His area of research interest includes the development of smart materials including silicones, graphene and bio-inspired biomaterials for industrial applications. Dr. Tiwari zeal to develop new materials and has generated six international patented/pending technologies that have been transferred to the industries. He is an active consultant to renowned companies and acts as associate editor of international journals.Baldev Raj is a distinguished scientist and former director of Indira Gandhi Centre of Atomic Research, India. He has pioneered the application of Non Destructive Testing (NDT) for basic research using acoustic and electromagnetic techniques in a variety of materials and components. He is currently President, International Institute of Welding, President, Indian National Academy of Engineering and President-Research PSG Institutions, Coimbatore. He is a member of the Scientific Advisory Council to Prime Minister, Scientific Advisory Council to Cabinet, Nano Mission Council of India and Apex Advisory Committee, Ministry of Human Resources Development. He is Chairman, Board of Governors, IIT, Gandhinagar & NIT, Puduchery.He has authored of more than 850 publications in referred journals, 60 books and special journal volumes, more than 20 contributions to encyclopaedia and handbooks, as well as the owner of 21 patents. He has been recognized with more than 100 international and national awards.

• 1 Carbon as a MEMS Material 1Amritha Rammohan and Ashutosh Sharma1.1 Introduction 11.2 Structure and Properties of Glassy Carbon 31.3 Fabrication of C-MEMS Structures 41.4 Integration of C-MEMS Structures with Other Materials 151.5 Conclusion 182 Intelligent Model-Based Fault Diagnosis of MEMS 21Afshin Izadian2.1 Introduction 212.2 Model-Based Fault Diagnosis 292.3 Self-Tuning Estimation 493 MEMS Heat Exchangers 63B. Mathew and L. Weiss3.1 Introduction 633.2 Fundamentals of Thermodynamics, Fluid Mechanics, and Heat Transfer 673.3 MEMS Heat Sinks 863.4 MEMS Heat Pipes 923.6 Need for Microscale Internal Flow Passages 1134 Application of Porous Silicon in MEMS and Sensors Technology 121L. Sujatha, Chirasree Roy Chaudhuri and Enakshi Bhattacharya4.1 Introduction 1214.2 Porous Silicon in Biosensors 1314.3 Porous Silicon for Pressure Sensors 1554.4 Conclusion 1655 MEMS/NEMS Switches with Silicon to Silicon (Si-to-Si) Contact Interface 173Chengkuo Lee, Bo Woon Soon and You Qian5.1 Introduction 1735.2 Bi-Stable CMOS Front End Silicon Nanofin (SiNF) Switch for Non-volatile Memory Based On Van Der Waals Force 1755.3 Vertically Actuated U-Shape Nanowire NEMS Switch 1845.4 A Vacuum Encapsulated Si-to-Si MEMS Switch for Rugged Electronics 1875.5 Summary 1976 On the Design, Fabrication, and Characterization of cMUT Devices 201J. Jayapandian, K. Prabakar, C.S. Sundar and Baldev Raj6.1 Introduction 2016.2 cMUT Design and Finite Element Modeling Simulation 2036.3 cMUT Fabrication and Characterization 2056.4 Summary and Conclusions 2167 Inverse Problems in the MEMS/NEMS Applications 219Yin Zhang7.1 Introduction 2197.2 Inverse Problems in the Micro/Nanomechanical Resonators 2227.3 Inverse Problems in the MEMS Stiction Test 2318 Ohmic RF-MEMS Control 239M. Spasos and R. Nilavalan8.1 Introduction 2398.2 Charge Drive Control (Resistive Damping) 2518.3 Hybrid Drive Control 2558.4 Control Under High-Pressure Gas Damping 2588.5 Comparison between Different Control Modes 2589 Dynamics of MEMS Devices 263Vamsy Godthi, K. Jayaprakash Reddy and Rudra Pratap9.1 Introduction 2639.2 Modeling and Simulation 2669.3 Fabrication Methods 2739.4 Characterization 2769.5 Device Failures 28010 Buckling Behaviors and Interfacial Toughness of a Micron-Scale Composite Structure with a Metal Wire on a Flexible Substrate 285Qinghua Wang, Huimin Xie and Yanjie Li10.1 Introduction 28510.2 Buckling Behaviors of Constantan Wire under Electrical Loading 28910.3 Interfacial Toughness between Constantan Wire and Polymer Substrate 30510.4 Buckling Behaviors of Polymer Substrate Restricted by Constantan Wire 31010.5 Conclusions 32111 Microcantilever-Based Nano-Electro-Mechanical Sensor Systems: Characterization, Instrumentation, and Applications 325Sheetal Patil and V. Ramgopal Rao11.1 Introduction 32511.2 Operation Principle and Fundamental Models 32711.3 Microcantilever Sensor Fabrication 33011.4 Mechanical and Electrical Characterization of Microcantilevers 33511.5 Readout Principles 33911.6 Application of Microcantilever Sensors 34411.7 Energy Harvesting for Sensor Networks 34911.8 Conclusion 35112 CMOS MEMS Integration 361Thejas and Navakanta Bhat12.1 Introduction 36112.2 State-of-the-Art inertial Sensor 36212.3 Capacitance Sensing Techniques 36612.4 Capacitance Sensing Architectures 36712.5 Continuous Time Voltage Sensing Circuit 36812.6 CMOS ASIC Design 37112.7 Test Results of CMOS–MEMS Integration 37712.8 Electrical Reliability Issues 37813 Solving Quality and Reliability Optimization Problems for MEMS with Degradation Data 381Yash Lundia, Kunal Jain, Mamanduru Vamsee Krishna, Manoj Kumar Tiwari and Baldev Raj13.1 Introduction 38213.2 Notations and Assumptions 38413.3 Reliability Model 38513.4 Numerical Example 39513.5 Conclusions 397References 397