Introduction to Microsystem Technology

Gerald Gerlach is currently a Professor for Solid-state Sensors at the Dresden University of Technology, Germany, a post he has held since 1996. His research interests include micromachined solid-state sensors (pressure, humidity, chemical) and sensor fabrication techniques, and he teaches courses in Microtechnology and Sensors. He has also held positions as a Researcher at different German companies making micromachined pressure sensors for biomedical applications, and is active in the sensor and measuring technology fields, having been Chairman of the German Association of University Professors in Measuring Technology (AHMT) and Vice-President of the German Society for Measurement and Control (GMA) since 2002. He has co-authored the German version of this book Einführung in die Mikrosystemtechnik (Hanser, 2006) and has contributed chapters to the book Functional Elements in Precision Engineering (Hanser) and Fabrication in Precision Engineering and Microtechnology (Hanser, 1995). He has also written over 250 journal and conference papers, and holds more than 35 patents. Wolfram Dötzel is currently Professor for Microsystems and Precision Engineering at Chemnitz University of Technology, also holding the position of Vice-President for Research at the university. His main research fields are in the modelling, design and simulation of micromechanical components, characterization and testing of micromechanical components by experimental methods, and adaptation of methods and principles of precision engineering for microsystems. He teaches courses in Microsystems, reliability and the design of devices and has previously co-authored Einführung in die Mikrosystemtechnik (Hanser, 2006) with Gerald Gerlach. He has also authored a chapter in the book Manual of Data Acquisition (Verlag Technik, 1984), more than 130 publications in journals and conference proceedings on micromechanical and precision engineering components as well as modelling, simulation, and characterization, and holds 8 patents.

• Preface. List of Symbols.List of Abbreviations.1 Introduction.1.1 What is a Microsystem?1.2 Microelectronics and Microsystem Technology.1.3 Areas of Application and Trends of Development.1.4 Example: Yaw Rate Sensor.2 Scaling and Similarity.2.1 Scaling.2.2 Similarity and Dimensionless Numbers.3 Materials.3.1 Overview.3.2 Single Crystalline Silicon.3.3 Glasses.3.4 Polymers.3.5 Thin Films.3.6 Comparison of Material Characteristics.4 Microfabrication.4.1 Overview.4.2 Cleanliness During Production.4.3 Lithography.4.4 Thin-film Formation.4.5 Layer Patterning.4.6 Anisotropic Wet Chemical Deep Etching.4.7 Doping.4.8 Bonding Techniques.4.9 Insulation Techniques.4.10 Surface Micromachining.4.11 Near-surface Micromachining.4.12 HARMST.4.13 Miniaturized Classical Techniques.4.14 Selection of Microtechnical Manufacturing Techniques.5 Packaging.5.1 Tasks and Requirements.5.2 Functions of Packaging.6 Function and Form Elements in Microsystem Technology.6.1 Mechanical Elements.6.2 Fluidic Elements. 6.3 Thermal Elements.7 Sensors and Actuators.7.1 Reversible and Parametric Transducers.7.2 Transducers for Sensors and Actuators.8 Design of Microsystems.8.1 Design Methods and Tools.8.2 Systems with Lumped Parameters.8.3 Systems with Distributed Parameters.9 Effect of Technological Processes on Microsystem Properties.9.1 Parameter-based Microsystem Design.9.2 Robust Microsystem Design.10 The Future of Microsystems.10.1 Status and Trends in Microsystem Technology.10.2 Microoptical Applications.10.3 Probe Tips.10.4 RF Microsystems.10.5 Actuators.10.6 Microfluidic Systems.10.7 Chemical, Biological and Medical Systems.10.8 Energy Harvesting and Wireless Communications.10.9 Micro Fuel Cells.References.Appendix A Physical Constants.Appendix B Coordinate Transformation.B.1 Elastic Coefficients.B.2 Piezoresistive Coefficients.References.Appendix C Properties of Silicon Dioxide and Silicon Nitride Layers.References.Appendix D Nomenclature of Thin-film Processes.Reference.Appendix E Adhesion of Surface Micromechanical Structures.E.1 Capillary Forces.E.2 Critical Length of Cantilever Springs.Reference.Index.