Harsh Environment Electronics

Ahmed Sharif, PhD, has been working as faculty in the Department of Materials and Metallurgical Engineering at the Bangladesh University of Engineering and Technology since 1999. He is an international renowned scientist in joining technology, and has published more than fifty peer-reviewed papers in leading international journals in soldering and ferroelectric materials research. A part of his PhD research has led to the award of an international prize, the "IEEE CPMT Young Scientist Award", for his paper presentation in an IEEE conference held in Japan in 2004.

• Preface xv1 Wide-Bandgap Semiconductor Device Technologies for High-Temperature and Harsh Environment Applications 1Md. Rafiqul Islam, Roisul H. Galib,Montajar Sarkar, and Shaestagir Chowdhury1.1 Introduction 11.2 Crystal Structures and Fundamental Properties of Different Wide-Bandgap Semiconductors 31.2.1 Relevant Properties of GaN, SiC, and Si 31.2.2 Structure of SiC 31.2.2.1 Polytypism in SiC 31.2.2.2 Modification of SiC Structures with Dopant 61.2.3 III–V Nitride-Based Structure 61.2.3.1 Fundamental Properties of GaN and AlN 71.2.3.2 Nitride Crystal Growth 71.2.3.3 Polytypism in the III–V Nitrides 81.2.3.4 Electrical Properties of Undoped Nitride Thin films 91.2.3.5 Properties of Doped GaN 91.2.4 Alloys and Heterostructures 101.2.4.1 GaInN 101.3 Devices ofWide-Bandgap Semiconductors 101.3.1 SiC in Junction Field-Effect Transistors (JFETs) 101.3.1.1 Specific Contact Resistance (;;c) 111.3.2 SiC in Metal Oxide Semiconductor Field-Effect Transistors (MOSFETs) 121.3.2.1 1200-V, 60-A SiC Power Module MOSFET 121.3.2.2 Design of the 1200-V, 60-A Phase-leg Module 131.3.2.3 Blocking Capability 141.3.2.4 Static Characteristics 151.3.2.5 Transfer Characteristics 151.3.2.6 Evaluation of the Gate Oxide Stability 161.3.3 Six-Pack SiC MOSFET Modules Paralleled in a Half-Bridge Configuration 161.3.4 4H-SiC Metal Semiconductor Field-Effect Transistor (MESFET) for Integrated Circuits (ICs) 181.3.4.1 Design of 4H-SiC MESFET 181.3.4.2 I–V Characteristics 191.3.5 SiC Capacitive Pressure Sensor 201.3.5.1 Sensor Characteristics at High Temperature 211.3.6 Ni2+-doped ZnO as Diluted Magnetic Semiconductors (DMSs) 221.3.6.1 Saturation Magnetization (Ms) at High Temperatures 221.3.6.2 The Coercivity (Hc) and Effective MagneticMoment (;;eff) at High Temperatures 231.3.7 Thermomechanical Stability of SiC, GaN, AlN, ZnO, and ZnSe 241.4 Conclusion 25References 262 High-Temperature Lead-free Solder Materials and Applications 31Mohd F. M. Sabri, Bakhtiar Ali, and Suhana M. Said2.1 Introduction 312.2 High-Temperature Solder Applications 322.2.1 Die-Attach Material 322.2.2 BGA Technology 332.2.3 Flip-Chip Technology 342.2.4 MCM Technology 342.2.5 CSP Technology 352.3 Requirements for a Candidate Solder in High-temperature Applications 352.4 High-Pb-Content Solders 372.5 Zn-Based Solders 382.5.1 Zn–Al 382.5.2 Zn–Sn 392.6 Bi-Based Solders 422.6.1 Bi–Ag 422.6.2 Bi–Sb 442.7 Au-Based Solders 472.7.1 Au–Sn 472.7.2 Au–Ge 492.8 Sn-Based Solders 512.8.1 Sn–Sb 512.8.2 Sn–Ag–Cu/Sn–Cu/Sn–Ag 532.9 Conclusion and Future Research Directions 56References 603 Role of Alloying Addition in Zn-Based Pb-Free Solders 67Khairul Islam and Ahmed Sharif3.1 Introduction 673.2 Zn-Al-Based Solders 683.3 Zn–Sn-Based Solders 753.4 Zn-Based Alloys with Minor Addition 803.5 Zn–Ni-Based Solders 813.6 Zn–Mg-Based Solders 823.7 Zn–In-Based Solders 833.8 Zn–Ag-Based Solders 843.9 Conclusion 84Acknowledgment 85References 854 Effect of Cooling Rate on the Microstructure, Mechanical Properties, and Creep Resistance of a Cast Zn–Al–Mg High-temperature Lead-Free Solder Alloy 91Reza Mahmudi, Davood Farasheh, and Seyyed S. Biriaie4.1 Introduction 914.2 Experimental Procedures 934.2.1 Materials and Processing 934.2.2 Mechanical Property Measurements 934.3 Results and Discussion 944.3.1 Shear Strength and Hardness 944.3.2 Microstructural Observations 974.3.3 Impression Creep 1004.3.4 Creep Mechanisms 1034.3.5 Microstructure–Property Relationships 1104.4 Conclusions 111References 1125 Development of Zn–Al–xNi Lead-Free Solders for High-Temperature Applications 115Sanjoy Mallick, Md Sharear Kabir, and Ahmed Sharif5.1 Introduction 1155.2 Experimental 1165.3 Results and Discussions 1185.4 Conclusions 130Acknowledgments 131References 1316 Study of Zn–Mg–Ag High-Temperature Solder Alloys 135Roisul H. Galib, Md. Ashif Anwar, and Ahmed Sharif6.1 Introduction 1356.2 Materials and Methods 1366.3 Results and Discussions 1376.3.1 Chemical Composition 1376.3.2 Microstructural Analysis 1376.3.3 Mechanical Properties 1416.3.4 Electrical Properties 1426.3.5 Thermal Properties 1426.4 Conclusions 143Acknowledgments 144References 1447 Characterization of Zn–Mo and Zn–Cr Pb-Free Composite Solders as a Potential Replacement for Pb-Containing Solders 147Khairul Islam and Ahmed Sharif7.1 Introduction 1477.2 Experimental 1497.3 Results and Discussion 1507.3.1 Zn–xMo System 1507.3.1.1 Differential Thermal Analysis (DTA) 1507.3.1.2 Microstructure of Zn–xMo System 1517.3.1.3 Brinell Hardness 1537.3.1.4 Tensile Strength 1537.3.1.5 Tensile Fracture Surface Analysis 1547.3.1.6 TMA Analysis 1547.3.1.7 Electrical Conductivity Analysis 1567.3.2 Zn–xCr System 1567.3.2.1 Differential Thermal Analysis 1567.3.2.2 Microstructure of Zn–xCr System 1577.3.2.3 Brinell Hardness 1587.3.2.4 Tensile Strength 1597.3.2.5 Fracture Surface Analysis 1607.3.2.6 TMA Analysis 1607.3.2.7 Electrical Conductivity Analysis 1627.3.3 Comparison of Zn–xMo and Zn–xCr Solders with Conventional Solders 1627.4 Conclusion 163Acknowledgments 163References 1648 Gold-Based Interconnect Systems for High-Temperature and Harsh Environments 167Ayesha Akter, Ahmed Sharif, and Rubayyat Mahbub8.1 Introduction 1678.2 High-Temperature Solder System 1688.2.1 Au as High-Temperature Solder 1698.3 Various Au-Based Solder Systems 1698.3.1 Au–Sn System 1708.3.1.1 Au-Rich Side of the Au–Sn System 1718.3.1.2 Sn-Rich Side of the Au–Sn System 1728.3.2 Au–Ge System 1748.3.3 Au–In System 1768.3.4 Au–Si System 1778.4 Other Interconnecting Systems 1788.4.1 Wire Bonding 1788.4.2 Au-enriched SLID 1798.4.3 Nanoparticle-Stabilized Composite Solder 1808.4.4 Solderable Coatings 1818.5 Applications 1828.5.1 Electronic Connectors 1828.5.2 Optoelectronic Connectors 1828.5.3 Medical Field 1838.5.4 Jewelry 1838.5.5 Au Stud Bump 1848.6 Substitutes for Au and Reductions in Use 1848.7 Future Uses of Au 1858.8 Conclusions 185Acknowledgments 185References 1859 Bi-Based Interconnect Systems and Applications 191Manifa Noor and Ahmed Sharif9.1 Introduction 1919.2 Various Bi-Based Solder Systems 1929.2.1 Bi–Ag Alloys 1929.2.2 Bi–Sb Alloy 1969.2.3 Bi–Sb–Cu Alloy 1989.2.4 Bi–Cu-Based Alloys 1999.2.5 Bi–Sn 2019.2.6 Bi–La 2049.2.7 Bi-Based Transient Liquid Phase Bonding 2049.2.8 Bi-Based Composite System 2059.3 Conclusion 206Acknowledgments 206References 20610 Recent Advancement of Research in Silver-Based Solder Alloys 211Ahmed Sharif10.1 Introduction 21110.2 Overview of Different Ag-Based Systems 21310.2.1 Ag Pastes 21310.2.1.1 Micron-Ag Paste 21310.2.1.2 Nano-Ag Paste 21510.2.1.3 Hybrid Silver Pastes 21610.2.1.4 Ag-Based Bimetallic Paste 21710.2.1.5 Composite Micron-Ag Pastes 21810.2.2 Ag Laminates 21910.2.3 Plated Ag 21910.2.4 Silver Foil 22010.2.5 Ag Columns 22210.2.6 Ag–In System 22310.3 Conclusions 223Acknowledgments 224References 22411 Silver Nanoparticles as Interconnect Materials 235Md. Ashif Anwar, Roisul Hasan Galib, and Ahmed Sharif11.1 Introduction 23511.2 Synthesis of Ag Nanoparticles 23611.2.1 Carey Lea’s Colloidal 23611.2.2 e-Beam IrradiationMethod 23711.2.3 Chemical Reduction Method 23711.2.4 Thermal Decomposition Method 23811.2.5 Laser Ablation Method 23911.2.6 Microwave Radiation Method 23911.2.7 Solid–Liquid Extraction Method 24011.2.8 Tollens Method 24011.2.9 Biological Method 24111.2.10 Polyoxometalate Method 24111.2.11 Solvated Metal Atom Dispersion Method 24111.3 Composition of Ag Nanopaste 24111.4 Joining Methods 24211.5 Properties of Nano-Ag Joints 24311.5.1 Shear Properties of Nano-Ag Joints 24511.5.2 Thermal Properties 24611.5.3 Rheological Properties 24711.6 Factors Affecting the Properties of Nano-Ag Joints 24811.6.1 Particle Size and Composition of the Paste 24811.6.2 Effect of Sintering Temperature, Time, and Pressure on Ag Joints 25211.6.3 Bonding Substrate 25411.7 Applications of Ag Nanoparticles 25511.7.1 Die-Attach Material 25511.7.2 Solar Cell 25511.7.3 Nano-Ag as a Potent Bactericidal Agent 25611.7.4 Nano-Ag in Antifungal Therapy 25611.8 Conclusions and Future Trends 257References 25712 Transient Liquid Phase Bonding 263Tariq Islam and Ahmed Sharif12.1 Introduction 26312.2 History and Development of TLP 26412.3 Theoretical Aspects of TLP 26612.3.1 TLP Process, Types, and Relevance with Phase Diagram 26612.3.2 Classification of TLP Bonding Based on Interlayer Composition 27212.3.3 Variants of TLP Bonding 27212.4 Development and Applicable Trends of TLP Using Alloy Systems (Phase Diagrams) with Special Features 27312.4.1 Cu–Sn System 27312.4.2 Ni–Sn System 27612.4.3 Ag–Sn System 28012.4.4 Au–Sn System 28112.4.5 Miscellaneous Systems 28312.4.5.1 Cu–Ga System 28312.4.5.2 Au–(Ge, Si) System 28412.5 Applications and Materials Used in TLPB 28412.6 Future of TLP and Conclusion 285References 28513 All-Copper Interconnects for High-Temperature Applications 293Ahmed Sharif13.1 Introduction 29313.2 Direct Cu-to-Cu Bonding 29413.2.1 Thermocompression Bonding 29413.2.2 Surface-Activated Bonding (SAB) 29613.2.3 Self-Assembled Monolayers (SAMs) 29613.2.4 Capping with Metal Layer 29713.3 Cu Paste Bonding 29913.3.1 Cu Nanoparticle (Cu NP) 29913.3.1.1 Bonding with Cu NP Under Pressure 29913.3.1.2 Cu NP Bonding Without Pressure 30113.3.2 Cu Microparticles 30113.3.3 Cu Hybrid Particles 30313.3.4 Cu–Sn TLP System 30313.3.5 Cu–Ag Composite Systems 30413.4 Conclusions 306Acknowledgments 306References 30614 Glass-Frit-Based Die-Attach Solution for Harsh Environments 313|Ahmed Sharif14.1 Introduction 31314.1.1 Basic Criteria of the Glass Composition for Glass Frit 31414.2 Overview of Different Glass Frit Systems 31514.2.1 Pb-Containing Glass Frit 31614.2.2 Pb-Free Glass Frit 31614.2.2.1 Borosilicate Glasses 31714.2.2.2 Phosphate Glasses 31814.2.2.3 Bi-Based Lead-Free Frit 31914.2.2.4 Vanadate Glasses 31914.2.2.5 Tellurite Glasses 31914.2.3 Conductive Glass Frit 32014.3 Bonding Process 32014.4 Bond Characteristics 32214.5 Conclusions 324Acknowledgments 325References 32515 Carbon-Nanotube-Reinforced Solders as Thermal Interface Materials 333Md Muktadir Billah15.1 Introduction 33315.2 Typical Thermal Interface Materials 33415.3 Solders as Thermal Interface Materials 33415.4 Literature Study: Different Fabrication Techniques 33615.4.1 Mechanical Alloying/Sonication and Sintering 33615.4.2 Reflow Process 33815.4.3 Electrochemical Co-deposition Method 33915.4.4 Using Metal-Coated Nanotubes 33915.4.5 Sandwich Method 34115.4.6 Melting Route 34115.5 Challenges and Future Scope 342References 34216 Reliability Study of Solder Joints in Electronic Packaging Technology 345Ahmed Sharif and Sushmita Majumder16.1 Introduction 34516.2 Reliability Tests 34616.2.1 Destructive Shear Test 34616.2.2 Pull Test 34716.2.3 Bending Test 34816.2.4 Board-Level Drop Test 34916.2.5 Thermal Cycling 35116.2.6 Shock Impact 35416.2.7 Fatigue Test 35516.2.8 Pressure Cooker Test 35616.2.9 Thermal Shock Testing 35716.2.10 Acoustic Microscopy 35816.2.11 Thermography 35816.2.12 X-ray Computed Tomography 35916.3 Conclusion 360Acknowledgments 360References 361Index 367