MILAN PAUNOVIC, PhD, was, until recently, a research staff member in the Electrodeposition Technology Department at the IBM T. J. Watson Research Center. He began work on electrochemical metal deposition in 1961 at the University of Pennsylvania, Philadelphia, and subsequently worked on metal deposition at Reynolds Metals, Kollmorgen, and Intel. He is a coauthor of the first edition of Fundamentals of Electrochemical Deposition and Modern Electroplating (both by Wiley), has edited four symposia proceedings volumes of The Electrochemical Society, published forty-one papers, and holds seven patents. MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada. He is a former associate editor of both the Journal of The Electrochemical Society and Electrochemical and Solid State Letters. He is a fellow of the American Physical Society and The Electrochemical Society. He has also been named a General Motors Academic Research Fellow. He is a coauthor of the first edition of Fundamentals of Electrochemical Deposition and of Modern Electroplating. He has published over 120 research papers and holds four patents.

• Preface to the Second Edition. Preface to the First Edition.1. Overview.2. Water and Ionic Solutions.3. Metals and Metal Sufaces.4. Metal-Solution Interphase.5. Equilibrium Electrode Potential.6. Kinetics and Mechanism of Electrodeposition.7. Nucleation and Growth Models.8. Electroless Deposition.9. Displacement Deposition.10. Effect of Additives.11. Electrodeposition of Alloys.12. Metal Deposit and Current Distribution.13. Characterization of metallic Surfaces and Thin Films.14. In Situ Characterization of Deposition.15. Mathematical Modeling in Electrochemistry.16. Structure anad Properties of Deposits.17. Electrodeposited Multilayers.18. Interdiffusion in Thin Films.19. Applications in Semiconductors Technology.20. Applications in the Fields of Magnetism and Microelectronics.21. Frontiers in Applications: Applications in the Field of Medicine.Index.

"…an excellent book for explaining electrochemical deposition to students, practicing engineers, or scientists…" (Journal of Metals Online, July 25, 2007) "…a great book for anyone who wants to learn about the fundamentals of electrochemical deposition." (IEEE Electrical Insulation Magazine, July/August 2007)"The book is a definitive treatment of the subject by two experts in the field…" (CHOICE, February 2007)

MILAN PAUNOVIC, PhD, was, until recently, a research staff member in the Electrodeposition Technology Department at the IBM T. J. Watson Research Center. He began work on electrochemical metal deposition in 1961 at the University of Pennsylvania, Philadelphia, and subsequently worked on metal deposition at Reynolds Metals, Kollmorgen, and Intel. He is a coauthor of the first edition of Fundamentals of Electrochemical Deposition and Modern Electroplating (both by Wiley), has edited four symposia proceedings volumes of The Electrochemical Society, published forty-one papers, and holds seven patents. MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada. He is a former associate editor of both the Journal of The Electrochemical Society and Electrochemical and Solid State Letters. He is a fellow of the American Physical Society and The Electrochemical Society. He has also been named a General Motors Academic Research Fellow. He is a coauthor of the first edition of Fundamentals of Electrochemical Deposition and of Modern Electroplating. He has published over 120 research papers and holds four patents.

• Preface to the Second Edition. Preface to the First Edition.1. Overview.2. Water and Ionic Solutions.3. Metals and Metal Sufaces.4. Metal-Solution Interphase.5. Equilibrium Electrode Potential.6. Kinetics and Mechanism of Electrodeposition.7. Nucleation and Growth Models.8. Electroless Deposition.9. Displacement Deposition.10. Effect of Additives.11. Electrodeposition of Alloys.12. Metal Deposit and Current Distribution.13. Characterization of metallic Surfaces and Thin Films.14. In Situ Characterization of Deposition.15. Mathematical Modeling in Electrochemistry.16. Structure anad Properties of Deposits.17. Electrodeposited Multilayers.18. Interdiffusion in Thin Films.19. Applications in Semiconductors Technology.20. Applications in the Fields of Magnetism and Microelectronics.21. Frontiers in Applications: Applications in the Field of Medicine.Index.

"…an excellent book for explaining electrochemical deposition to students, practicing engineers, or scientists…" (Journal of Metals Online, July 25, 2007) "…a great book for anyone who wants to learn about the fundamentals of electrochemical deposition." (IEEE Electrical Insulation Magazine, July/August 2007)"The book is a definitive treatment of the subject by two experts in the field…" (CHOICE, February 2007)

MILAN PAUNOVIC, PhD, was, until recently, a research staff member in the Electrodeposition Technology Department at the IBM T. J. Watson Research Center. He began work on electrochemical metal deposition in 1961 at the University of Pennsylvania, Philadelphia, and subsequently worked on metal deposition at Reynolds Metals, Kollmorgen, and Intel. He is a coauthor of the first edition of Fundamentals of Electrochemical Deposition and Modern Electroplating (both by Wiley), has edited four symposia proceedings volumes of The Electrochemical Society, published forty-one papers, and holds seven patents. MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics at the University of Windsor, Ontario, Canada. He is a former associate editor of both the Journal of The Electrochemical Society and Electrochemical and Solid State Letters. He is a fellow of the American Physical Society and The Electrochemical Society. He has also been named a General Motors Academic Research Fellow. He is a coauthor of the first edition of Fundamentals of Electrochemical Deposition and of Modern Electroplating. He has published over 120 research papers and holds four patents.

• Preface to the Second Edition. Preface to the First Edition.1. Overview.2. Water and Ionic Solutions.3. Metals and Metal Sufaces.4. Metal-Solution Interphase.5. Equilibrium Electrode Potential.6. Kinetics and Mechanism of Electrodeposition.7. Nucleation and Growth Models.8. Electroless Deposition.9. Displacement Deposition.10. Effect of Additives.11. Electrodeposition of Alloys.12. Metal Deposit and Current Distribution.13. Characterization of metallic Surfaces and Thin Films.14. In Situ Characterization of Deposition.15. Mathematical Modeling in Electrochemistry.16. Structure anad Properties of Deposits.17. Electrodeposited Multilayers.18. Interdiffusion in Thin Films.19. Applications in Semiconductors Technology.20. Applications in the Fields of Magnetism and Microelectronics.21. Frontiers in Applications: Applications in the Field of Medicine.Index.

"…an excellent book for explaining electrochemical deposition to students, practicing engineers, or scientists…" (Journal of Metals Online, July 25, 2007) "…a great book for anyone who wants to learn about the fundamentals of electrochemical deposition." (IEEE Electrical Insulation Magazine, July/August 2007)"The book is a definitive treatment of the subject by two experts in the field…" (CHOICE, February 2007)