From 2D to 3D Photonic Integrated Circuits

Dr. Yi is currently Fellow of Optica (Optical Society of America), a full Professor of Electrical Engineering, was the founding EECE PhD program chair and Provost faculty fellow, University of Michigan, Dearborn campus, and LNF, University of Michigan, Ann Arbor campus. He received the Ph.D. degree from the Massachusetts Institute of Technology (MIT), Cambridge, MA, USA, and was a Post-Doctoral Associate with the MicroPhotonics Center, Massachusetts Institute of Technology, Cambridge, MA, USA, where he was involved in research on integrated nano optoelectronic devices and systems. He had extensive research experiences with the Los Alamos National Laboratory, and the 3M Corporate Research Laboratory. He is also a Professor Affiliate with the Microsystems Technology Laboratory at MIT. He has authored more than hundreds of top journal papers, edited four book/book chapters, and holds 33 issued patents (17 U.S. patents and 16 international patents). He has led several government/industry-funded projects, has been at review panels for NSF, DOE and DOD, and has been a reviewer for leading journals. His research interests are  Integrated/Intelligent chips, Renewable energy, Smart micro sensors; Virtual Reality/Augmented Reality, Solid state on-chip Lidar for autonomous driving/UAVs/Robotics; Telecommunications; and Solid state lighting.

• Introduction to 3D Photonics.- Fundamentals of Photonic Integrated Circuits.- The Evolution from 2D to 3D PICs.- Design and Fabrication Techniques.- Thermal Management in 3D PICs.- Alignment and Packaging of 3D PICs.- Heterogeneous and Hybrid Integration.- Applications of 3D Photonics.- Modeling and Simulation Tools.- Industry Trends and Future Directions.- Case Studies and Real-World .- Applications.- Conclusion and Vision for the Future.- References and Further Reading.- Appendix.