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Li Tao, Deji Akinwande - Emerging 2D Materials and Devices for the Internet of Things, Häftad

Häftad, Engelska, 2020

Del i serien Micro and Nano Technologies

Emerging 2D Materials and Devices for the Internet of Things

Information, Sensing and Energy Applications

Av Li Tao, Deji Akinwande

2609 kr

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Beskrivning

Emerging 2D Materials and Devices for the Internet of Things: Information, Sensing and Energy Applications summarizes state-of-the-art technologies in applying 2D layered materials, discusses energy and sensing device applications as essential infrastructure solutions, and explores designs that will make internet-of-things devices faster, more reliable and more accessible for the creation of mass-market products. The book focuses on information, energy and sensing applications, showing how different types of 2D materials are being used to create a new generation of products and devices that harness the capabilities of wireless technology in an eco-efficient, reliable way.

This book is an important resource for both materials scientists and engineers, who are designing new wireless products in a variety of industry sectors.



  • Explores how 2D materials are being used to create faster and more reliable wireless network solutions
  • Discusses how graphene-based nanocomposites are being used for energy harvesting and storage applications
  • Outlines the major challenges for integrating 2D materials in electronic sensing devices
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Li Tao is a Professor in the School of Materials Science and Engineering at Southeast University, Nanjing, China. His research interests focus on 2D materials and flexible devices, microsystem and nanoengineering platforms. He is a co-inventor of mono- and multi-layer silicene transistors, 12’’ wafer-scale graphene on evaporated Cu and GHz flexible graphene electronics. Deji Akinwande is Associate Professor in the Department of Electrical and Computer Engineering at the University of Texas – Austin, USA. His research explores materials and electronic systems based on 2D atomic layers. He is a co-inventor of a high-frequency chip-to-chip interconnect and an electrically small antenna for bioelectronics

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