Electronics Packaging Forum

Volume One

Häftad, Engelska, 2012

AvJames E. Morris

699 kr

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The Materials Research Society and other professional scientific groups have introduced Electronics Packaging sessions into their conference programs, and the International Electronics Packaging Society (IEPS) is expanding rapidly.

Produktinformation

Utgivningsdatum2012-05-06
Mått152 x 229 x 20 mm
Vikt522 g
FormatHäftad
SpråkEngelska
Antal sidor347
FörlagSpringer
ISBN9789401092883

Tillhör följande kategorier

1. Electronics Packaging and Interconnection Technology: State of the Art and Future Developments.- 2. Structural Integrity in Electronics Packaging.- 3. Examining the Potential in Microelectronic Performance: Are We Reaching the Limits?.- 4. Electrical Performance of VLSI Interconnect Systems.- 5. The Role of Superconductivity in Electronics Packaging.- 6. Optical Interconnects: Packaging and Materials Challenges.- 7. Thermal Design and Computational Analysis Techniques.- 8. Damage Assessment for Materials in Microelectronic Interconnections.- 9. A New Method of Metal-Ceramic Joining for Microelectronic Applications.- 10. Microanalytical Techniques: Their Use in Solving Problems in the Manufacture and Reliability of Electronics Packages.- 11. Manufacturing Systems Integration: A Design Methodology.- 12. International Competitiveness.- 13. Electronics Packaging: the University Connection.

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