Electronic Packaging and Interconnection Handbook 4/E

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.

• CONTRIBUTORSPREFACEChapter 1: Plastics, Elastomers, and CompositesChapter 2: Adhesives, Underfills, and CoatingsChapter 3: Thermal ManagementChapter 4: Connector and Interconnection TechnologyChapter 5: Solder Technologies for Electronic Packaging and AssemblyChapter 6: Packaging and Interconnection of Integrated Circuits Chapter 7: Hybrid Microelectronics and Multichip ModulesChapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging TechnologiesChapter 9: Rigid and Flexible Printed Circuit Board TechnologyChapter 10: Packaging of High-Speed and Microwave Electronic SystemsINDEX

Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as Handbook of Electronic Packaging, the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies. Sci-Tech Book News 20041201