Ceramic Integration and Joining Technologies

Mrityunjay Singh, PhD, FASM, FACerS, FAAAS, is Chief Scientist at Ohio Aerospace Institute, NASA Glenn Research Center, and is actively involved in various activities related to processing, manufacturing, joining and attachment technologies. He is Academician of World Academy of Ceramics and Governor of Acta Materialia, Inc. He has authored or coauthored more than two hundred thirty publications, edited forty two books/journal volumes, and holds several patents and technology transfers to industries. He is recipient of numerous (more than forty) national and international awards from all over the world including four R&D 100 awards, NASA Public Service Medal, and NASA Exceptional Space Act Award for outstanding and extraordinary contributions to various NASA programs.Tatsuki Ohji, PhD, FACerS, is the Prime Senior Research Scientist at Japan's National Institute of Advanced Industrial Science and Technology (AIST). His research interests include characterization of ceramics, ceramic composites and porous materials, design of advanced ceramics, and green ceramic manufacturing. He has authored or coauthored more than 320 scientific papers and nine books, and holds more than forty patents. He is a fellow of the American Ceramic Society, Academician of the World Academy of Ceramics, a Governor of Acta Materialia, Inc., and editorial board member of many international journals.Rajiv Asthana, PhD, FASM, is a professor at the University of Wisconsin-Stout where he teaches in the manufacturing engineering and engineering technology programs. His research interests include ceramic/metal joining, high-temperature capillarity and cast metal-matrix composites. He is the author or coauthor of four books and 150 refereed papers, an Associate Editor of Journal of Materials Engineering & Performance, guest editor and editorial board member of several refereed journals, and a fellow of ASM International.Sanjay Mathur, PhD, is professor at the Institute of Inorganic Chemistry at the University of Cologne, Germany. The major research thrust of his group include chemical synthesis of functional nanostructures and their processing for product and device applications. He was an Alexander von Humboldt Fellow at the Saarland University, where he accomplished his Habilitation. He has authored or coauthored over 150 publications, edited a book, holds several patents, and is and Associate Editor of International Journal of Applied Ceramic Technology and Nanomaterials.

• Preface ixContributors xiPART I INTRODUCTION 11 CERAMIC INTEGRATION ACROSS LENGTH SCALES: TECHNICAL ISSUES, CHALLENGES, AND OPPORTUNITIES 3Mrityunjay Singh, Tatsuki Ohji, Rajiv Asthana, and Sanjay MathurPART II SCIENCE AND TECHNOLOGY FOR MACROSCALE INTEGRATION 152 CERAMIC COMPONENT INTEGRATION BY ADVANCED BRAZING TECHNOLOGIES 17Jolanta Janczak-Rusch3 JOINING AND INTEGRATION ISSUES OF CERAMIC MATRIX COMPOSITES FOR THE NUCLEAR INDUSTRY 39Monica Ferraris, Milena Salvo, and Valentina Casalegno4 AIR BRAZING: A NEW METHOD OF CERAMIC–CERAMIC AND CERAMIC–METAL JOINING 91K. S. Weil, J. T. Darsell, and J. Y. Kim5 DIFFUSION BONDING OF SILICON CARBIDE AS AN ENABLING TECHNOLOGY FOR THE FABRICATION OF COMPLEX-SHAPED CERAMIC COMPONENTS 143Michael C. Halbig and Mrityunjay Singh6 INTEGRATION OF CARBON–CARBON COMPOSITE TO METALLIC SYSTEMS FOR THERMAL MANAGEMENT APPLICATIONS 163Mrityunjay Singh and Rajiv Asthana7 CONTACT INTERACTION IN CARBON–METAL SYSTEMS FOR JOINING AND INTEGRATION 193V. M. Perevertailo and O. B. LoginovaPART III INTEGRATION ISSUES IN ENERGY GENERATION AND DEVICE FABRICATION 2318 INTEGRATION TECHNOLOGIES FOR FERRITES AND POWER INDUCTORS IN CERAMIC CIRCUIT BOARDS 233Richard Matz9 OXIDE THERMOELECTRIC POWER GENERATION 267Ryoji Funahashi, Saori Urata, Atsuko Kosuga, and Delphine Flahaut10 INTEGRATION TECHNOLOGIES FOR SOLID OXIDE FUEL CELLS (SOFCS) AND OTHER ELECTROCHEMICAL REACTORS 297Yoshinobu Fujishiro, Toshio Suzuki, Toshiro Yamaguchi, Koichi Hamamoto, Masanobu Awano, and Nigel Sammes11 INTEGRATION TECHNOLOGIES FOR SENSORS 323Woosuck Shin, Maiko Nishibori, and Ichiro Matsubara12 ON-CHIP INTEGRATION OF FUNCTIONAL HYBRID MATERIALS AND COMPONENTS IN NANOPHOTONICS AND OPTOELECTRONICS 339Talha Erdem and Hilmi Volkan Demir13 INTEGRATION OF MULTIFUNCTIONAL PROPERTIES IN THERMAL BARRIER COATINGS BY CHEMICAL VAPOR DEPOSITION 393Takashi Goto14 THE CHANGING PHYSICS IN METAL INTERCONNECT RELIABILITY 415Cher Ming Tan and Yuejin Hou15 INTEGRATION ISSUES OF BARIUM STRONTIUM TITANATE THIN FILM FOR TUNABLE MICROWAVE APPLICATIONS 449Ashok Kumar, Supriya Ketkar, and Venkataraman Gurumurthy16 AEROSOL DEPOSITION (AD) INTEGRATION TECHNIQUES AND THEIR APPLICATION TO MICRODEVICES 489Jun AkedoPART IV NANO- AND BIOINTEGRATION 52117 ADVANCES IN NANOINTEGRATION METHODOLOGIES: PATTERNING, POSITIONING, AND SELF-ASSEMBLY 523Yoshitake Masuda and Kunihito Koumoto18 INTEGRATION OF NANOWIRES IN NEW DEVICES AND CIRCUIT ARCHITECTURES: RECENT DEVELOPMENTS AND CHALLENGES 575F. Hernández-Ramírez, J. D. Prades, A. Romano-Rodriguez, S. Barth, H. Shen, and S. Mathur19 INTEGRATING DIAMOND-LIKE CARBON INTO NANOSTRUCTURE DESIGNS (FABRICATING MICROSCALE AND NANOSCALE ARCHITECTURES OF DIAMOND-LIKE CARBON FILMS) 641Xijun Li and Daniel H. C. Chua20 SYNTHESIS, PROPERTIES, INTEGRATION, AND APPLICATIONS OF VERTICALLY ALIGNED CERAMIC NANOSTRUCTURES 671D. Pliszka, S. Sundarrajan, and S. Ramakrishna21 NANOINTEGRATION BASED ON THIN-FILM TECHNOLOGY 699C. Jin, W. Wei, R. Aggarwal, and R. J. Narayan22 MASS-MANUFACTURABLE NANOWIRE INTEGRATION: CHALLENGES AND RECENT DEVELOPMENTS 721Ataur Sarkar and M. Saif Islam23 USABILITY OF INK-JET PRINTING TECHNOLOGY AND NANOMATERIALS IN ELECTRICAL INTERCONNECTIONS, ELECTRONIC PACKAGING, AND SYSTEM INTEGRATION FOR MICROELECTRONICS APPLICATIONS 743Umur Caglar, Ville Pekkanen, Jani Valkama, Pauliina Mansikkamäki, and Jussi Pekkanen24 BIOINTEGRATION OF PROSTHETIC DEVICES 777Masakazu Kawashita, Toshiki Miyazaki, and Chikara OhtsukiIndex 803