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Richard K. Ulrich, William D. Brown - Advanced Electronic Packaging, Inbunden

Inbunden, Engelska, 2006

Del 9 i serien IEEE Press Series on Microelectronic Systems

Advanced Electronic Packaging

Av Richard K. Ulrich, William D. Brown

2959 kr

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Beskrivning
As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.
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Richard K. Ulrich is a professor of chemical engineering at the University of Arkansas. He is a book editor and columnist on embedded passive technology, a NEMI committee member, an associate editor of IEEE Transactions on Advanced Packaging, and past chairman of chairman of the Dielectric Science and Technology Division of the Electrochemical Society. WILLIAM D. BROWN, PhD, is Associate Dean for Research, College of Engineering, and Distinguished Professor of Electrical Engineering, University of Arkansas. Since 1991, he has played an active role in sponsoring and guiding research at the University's High Density Electronics Center (HiDEC), which is dedicated to advancing the state of the art in electronics packaging materials and technologies.

Recensioner i media

"…a very nice reference." (IEEE Circuits & Devices Magazine, November/December 2006) "...offers a broad perspective on electronic packaging." (Advanced Packaging Online, August 11, 2006)"...an extremely thorough engineering textbook and an invaluable reference tool...get ready for some serious reading that will pay off." (Chip Scale Review, July 2006)"…useful to not only students but also to both new and experienced engineers working in areas related to semiconductor and electronic packaging technologies." (CircuiTree, May 1, 2006)

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