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Wspc Series In Advanced Integration And Packaging

9 produkter

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9 produkter

Del 7

Del 7 - Wspc Series In Advanced Integration And Packaging

Thermoelectric Energy Conversion Devices And Systems

AvKazuaki Yazawa,Je-hyeong Bahk m. fl.

Inbunden, Engelska, 2021

2 139 kr

Skickas inom 3-6 vardagar

Del 8

Del 8 - Wspc Series In Advanced Integration And Packaging

Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection

AvIyengar Madhusudan,IYENGAR MADHUSUDAN m. fl.

Inbunden, Engelska, 2024

2 449 kr

Skickas inom 3-6 vardagar

Del 4

Del 4 - Wspc Series In Advanced Integration And Packaging

Cost Analysis Of Electronic Systems

AvPeter Sandborn,Usa) Sandborn, Peter (Univ Of Maryland m. fl.

Inbunden, Engelska, 2017

3 389 kr

Skickas inom 3-6 vardagar

Del 5

Del 5 - Wspc Series In Advanced Integration And Packaging

Mems Packaging

AvLee Y C,LEE Y C m. fl.

Inbunden, Engelska, 2018

2 449 kr

Skickas inom 3-6 vardagar

Del 6

Del 6 - Wspc Series In Advanced Integration And Packaging

Solder Materials

AvKwang-lung Lin,Taiwan) Lin, Kwang-lung (Nat'l Cheng Kung Univ m. fl.

Inbunden, Engelska, 2018

2 509 kr

Skickas inom 3-6 vardagar

Del 1

Del 1 - Wspc Series In Advanced Integration And Packaging

Cost Analysis Of Electronic Systems

AvPeter Sandborn,Sandborn Peter m. fl.

Inbunden, Engelska, 2012

2 719 kr

Skickas inom 3-6 vardagar

Del 2

Del 2 - Wspc Series In Advanced Integration And Packaging

Design And Modeling For 3d Ics And Interposers

AvMadhavan Swaminathan,Ki Jin Han m. fl.

Inbunden, Engelska, 2013

2 369 kr

Skickas inom 3-6 vardagar

Del 3

Del 3 - Wspc Series In Advanced Integration And Packaging

Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research

AvIyengar Madhusudan,IYENGAR MADHUSUDAN m. fl.

Inbunden, Engelska, 2014

2 799 kr

Skickas inom 3-6 vardagar

Nyhet

Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability

AvChristopher Bailey,Stoyan Stoyanov m. fl.

Inbunden, Engelska, 2027

2 169 kr

Kommande

Wspc Series In Advanced Integration And Packaging

Thermoelectric Energy Conversion Devices And Systems

Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection

Cost Analysis Of Electronic Systems

Mems Packaging

Solder Materials

Cost Analysis Of Electronic Systems

Design And Modeling For 3d Ics And Interposers

Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research

Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability

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Wspc Series In Advanced Integration And Packaging

Thermoelectric Energy Conversion Devices And Systems

Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection

Cost Analysis Of Electronic Systems

Mems Packaging

Solder Materials

Cost Analysis Of Electronic Systems

Design And Modeling For 3d Ics And Interposers

Cooling Of Microelectronic And Nanoelectronic Equipment: Advances And Emerging Research

Co-design And Modelling For Advanced Integration And Packaging: Manufacturing And Reliability

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