• Foreword on Professor Avram Bar-Cohen's Contribution to the Electronics Packaging Field; A Review of Cooling Road Maps for 3D Chip Packages; Thermal Performance Mapping of Direct Liquid Cooled 3D Chip Stacks; Dynamic Thermal Management Considering Accurate Temperature-Leakage Interdependency; Energy Reduction and Performance Maximization Through Improved Cooling; Optimal Choice of Heat Sinks From an Industrial Point of View with a Focus on LED Applications; Synthetic Jets for Heat Transfer Augmentation in Microelectronics Systems; Recent Advance in Thermoelectric Devices for Electronics Cooling; Energy Efficient Solid-State Cooling for Hot Spot Removal; An Overview of the Use of Phase Change Materials for the Thermal Management of Transient Portable Electronics: Benefits and Challenges; Estimation of Cooling Performance of Phase Change Material (PCM) Module; Optimization Under Uncertainty for Electronics Cooling Design; Hydrophilic CNT-Sintered Copper Composite Wick for Enhanced Cooling; A Cabinet Level Thermal Test Vehicle to Evaluate Hybrid Double-Sided Cooling Schemes; Energy Efficiency and Reliability Risk Mitigation of Data Centers Through Prognostics and Health Management; Damage Pre-Cursors Based Assessment of Accrued Thermo-Mechanical Damage and Remaining Useful Life in Field Deployed Electronics.

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