Tingyu Lin - Böcker

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Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore

AvHengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao,China) Zhang, Hengyun (Shanghai University of Engineering Science,Singapore) Che, Faxing (Institute of Microelectronics (IME), Agency for Science, Technology and Research (A-STAR),China) Lin, Tingyu (National Centre for Advanced Packaging (NCAP),China) Zhao, Wensheng (Hangzhou Dianzi University, Hangzhou,Zhang,Hengyu

Häftad, Engelska, 2019

2 839 kr

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