China) Zhang, Hengyun (Shanghai University of Engineering Science - Böcker
Visar alla böcker från författaren China) Zhang, Hengyun (Shanghai University of Engineering Science.
1 produkt
1 produkt
Modeling, Analysis, Design, and Tests for Electronics Packaging beyond Moore
Av Hengyun Zhang, Faxing Che, Tingyu Lin, Wensheng Zhao, China) Zhang, Hengyun (Shanghai University of Engineering Science, Singapore) Che, Faxing (Institute of Microelectronics (IME), Agency for Science, Technology and Research (A-STAR), China) Lin, Tingyu (National Centre for Advanced Packaging (NCAP), China) Zhao, Wensheng (Hangzhou Dianzi University, Hangzhou
Häftad, Engelska, 2019
2 979 kr
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