Thermal Management for Opto-electronics Packaging and Applications

Xiaobing Luo, PhD, is a Full Professor at School of Energy and Power Engineering, Huazhong University of Science and Technology, China. He is IEEE Fellow and ASME Fellow. He has extensive research experience in thermal management field. He has published more than 200 academic papers and invented novel micro hydraulic suspension pump for liquid cooling system. Run Hu, PhD, is a Professor and Doctoral Supervisor at the School of Energy and Power Engineering at the Huazhong University of Science and Technology, China. He was the recipient of the Outstanding Youth Scholar and Chutian Scholar awards in Hubei province. Bin Xie, PhD, is an Assistant Professor at the School of Mechanical Science and Engineering at the Huazhong University of Science and Technology, China. He was the recipient of the Natural Science Prize of Hubei Province (second class) and the Outstanding Paper Award from the International Conference on Electronic Packaging Technology (ICEPT).

• List of Nomenclatures viiiAbout the Authors xixPreface xxi1 Introduction 11.1 Development History of Packaging 11.1.1 BGA 21.1.2 CSP 21.1.3 MCM 21.1.4 3D Packaging 31.2 Heat Generation in Opto-electronic Package 41.2.1 Heat Generation Due to Nonradiative Recombination 41.2.2 Heat Generation Due to Shockley–Read–Hall (SRH) Recombination 51.2.3 Heat Generation Due to Auger Recombination 51.2.4 Heat Generation Due to Surface Recombination 61.2.5 Heat Generation Due to Current Crowding and Overflow 61.2.6 Heat Generation Due to Light Absorption 81.3 Thermal Issues and Challenges 81.3.1 Thermal Management 81.3.2 Mechanical/Electrical Reliability 91.4 Organization Arrangement 10References 102 Thermal Conduction and Solutions 132.1 Concept of Thermal Conduction 132.2 Thermal Resistance 142.2.1 Basic Concept of Thermal Resistance 142.2.2 Thermal Contact Resistance 162.2.3 Thermal Spreading Resistance 172.2.4 Thermal Resistance Network 182.2.5 Transient Thermal Conduction and Thermal Impedance 192.3 High Thermal Conductivity Materials 222.3.1 Structure and Materials of Chip 222.3.1.1 Structures of Chip 232.3.1.2 Material of LED Chip 232.3.1.3 Sapphire 232.3.1.4 Silicon 242.3.1.5 Silicon Carbide 242.3.1.6 GaN 252.3.1.7 β-Ga2O3 252.3.2 Solder 252.3.3 Heat Spreader 252.3.3.1 Graphene 252.3.3.2 h-BN 272.3.4 Package Substrate Materials 272.3.5 Thermal Conductive Polymer Composite for Encapsulation 282.3.6 Coolants 292.4 Thermal Interface Materials 302.4.1 Categories of Thermal Interface Materials 302.4.1.1 Carbon–Polymer TIMs 322.4.1.2 Metal–Polymer TIMs 322.4.1.3 Ceramic–Polymer TIMs 332.4.2 Strategies for Enhancing TC of Thermal Interface Materials 342.4.2.1 Surface Treatment 342.4.2.2 Filler Hybridization 342.4.2.3 Orientation and Network Engineering 342.4.3 Models for Thermal Conductivity of Thermal Interface Materials 352.5 Heat Pipe and Vapor Chamber 362.5.1 Heat Pipe 362.5.2 Vapor Chamber 362.6 Phase-Change Materials (PCMs) 372.6.1 Categories and Applications of PCMs 372.6.2 Thermal Conductivity Enhancement of PCMs 382.7 Thermal Metamaterials 382.7.1 Concept of Thermal Metamaterials 382.7.2 Thermal Metamaterial Design 392.8 Chapter Summary 40References 403 Thermal Convection and Solutions 453.1 Basic Knowledge of Convection Heat Transfer 453.1.1 Basic Concepts of Convection Heat Transfer 453.1.2 Basic Theories of Convection Heat Transfer 463.1.2.1 Similar Theory of Convection Heat Transfer 463.1.2.2 Boundary Layer Theory of Convection Heat Transfer 473.1.3 Basic Calculation of Convection Heat Transfer 483.1.3.1 Forced Convection Heat Transfer of a Fluid Over an Object 483.1.3.2 Forced Convection Heat Transfer in the Duct 483.1.3.3 Natural Convection Heat Transfer of Vertical Plate 503.1.3.4 Pool Boiling Convection Heat Transfer 513.2 Air Cooling 533.2.1 Heat Sink Design and Optimization 533.2.2 Piezoelectric Fan Cooling 573.3 Liquid Cooling 593.3.1 Microchannel Liquid Cooling 593.3.2 Impingement Jet Liquid Cooling 603.3.3 Flow Boiling 613.3.4 Spray Cooling 623.3.5 Nanofluid 643.4 Chapter Summary 65References 654 Thermal Radiation and Solutions 714.1 Concept of Thermal Radiation 714.2 Atmospheric Transparent Window 724.3 Spectra-Regulation Thermal Radiation 734.3.1 Deep Q-Learning Network for Emissivity Spectral Regulation 734.3.2 Design and Optimization of Radiative Cooling Radiators Based on DQN 764.3.3 Colored Radiative Cooling 794.3.3.1 Color Display Characterization 804.3.3.2 Influence of Structural Parameters on Colored Radiative Cooler 814.4 Near-Field Thermal Radiation in Thermal Management 854.5 Chapter Summary 86References 865 Opto-Thermal Coupled Modeling 915.1 Opto-Thermal Modeling in Chips 915.1.1 Thermal Droop 915.1.2 Opto-Electro-Thermal Theory for LED 935.2 Opto-Thermal Modeling in Phosphor 955.2.1 Phosphor Heating Phenomenon 965.2.2 Phosphor Optical Model 985.2.3 Optical–Thermal Phosphor Model Considering Thermal Quenching 1075.3 Opto-Thermal Modeling Applications in White LEDs 1155.4 Chapter Summary 120References 1216 Thermally Enhanced Thermal Interfacial Materials 1276.1 Modeling of TIM 1276.1.1 Model of Thermal Contact Resistance 1286.1.1.1 Theoretical Background 1286.1.1.2 Topographical Analysis 1296.1.1.3 Mechanical Analysis 1306.1.2 Experiment for the Measurement of R c 1316.1.2.1 Experimental Principles 1316.1.2.2 Thermal and BLT Measurement 1316.1.2.3 Sample Preparation 1326.1.2.4 Error Analysis 1336.1.3 Validation and Discussion 1336.1.3.1 Comparison of Experimental Data with the Model 1336.1.3.2 Influence of the Parameters on the Model Results 1356.2 Thermal Conductivity Tunability of TIM 1376.2.1 Thermal Conductivity Enhancement of BN-Composites Using Magnetic Field 1396.2.1.1 Fabrication of the Composites 1396.2.1.2 Characterization and Analysis 1406.2.1.3 Thermal Properties of Composites 1436.2.2 Thermal Conductivity Enhancement of BN-Composites Using Combined Mechanical and Magnetic Stimuli 1466.2.2.1 Fabrication of the Composites 1476.2.2.2 Characterization and Analysis 1486.2.2.3 Thermal Properties of the Composites 1506.2.2.4 Theoretical Analysis of Thermal Conductivity 1506.2.3 Magnetic-Tuning TIMs for Local Heat Dissipation 1546.2.3.1 Fabrication of the Composites 1556.2.3.2 Evaluation for Thermal Performance of the Composites 1566.2.3.3 Thermal Properties of the Composites 1576.2.3.4 Finite-Element Analysis of Composites Loaded with Local Heat Source 1576.2.4 Thermal Conductivity Enhancement of CFs-Composites Using Preset Magnetic Field 1606.2.4.1 Fabrication of the Composites 1616.2.4.2 Characterization and Analysis 1626.2.4.3 Thermal and Mechanical Properties of Composites 1656.2.5 Self-Assembly Design of TIMs for Hotspot Problem 1696.2.5.1 Fabrication of the Composites 1716.2.5.2 Characterization, Analysis, and Optimization 1736.2.5.3 Thermal and Mechanical Properties of Composites 1776.2.5.4 Experiment Section 1806.3 Interfacial Thermal Transport Manipulation of TIM 1826.3.1 Synthesis of Interface Systems 1836.3.2 Measurement of Interfacial Thermal Conductance 1836.3.3 Characterization of Interfacial Bonds 1846.3.4 Importance of Covalent Bonds 1876.3.5 Manipulation of the Thermal Properties of Nanocomposites 1876.4 Chapter Summary 188References 1897 Packaging-Inside Thermal Management for Quantum Dots-Converted LEDs 1977.1 Thermally Conductive QDs Composite 1977.2 Heat Transfer Reinforcement Structures 2067.2.1 Directional Heat Conducting QDs-Polymer 2067.2.2 Thermally Conductive Composites Annular Fins 2127.2.3 Packaging Structure Optimization for Temperature Reduction 2157.3 3D-Interconnected Thermal Conduction of QDs 2207.4 Chapter Summary 232References 2328 Thermal Management in Downhole Devices 2378.1 Experimental Analysis of Passive Thermal Management Systems 2378.1.1 Experimental Setup 2388.1.2 Experimental Results 2408.1.3 Finite-element Analysis 2428.2 Thermal Modeling for Downhole Devices 2448.2.1 Thermal Modeling 2448.2.2 Experimental Setup 2478.2.3 Experimental and Simulated Results 2488.3 Phase-Change Materials Design 2558.3.1 Material Preparation 2558.3.2 Characteristics and Thermal Performance 2558.4 Distributed PCM-Based Thermal Management Systems 2608.4.1 System Design 2608.4.2 Simulated and Experimental Results 2618.5 Thermal Optimization of High-Temperature Downhole Electronic Devices 2678.5.1 Optimization Method 2678.5.2 Experimental Setup 2708.5.3 Thermal Optimization Results 2708.6 Chapter Summary 275References 2769 Liquid Cooling for High-Heat-Flux Electronic Devices 2799.1 Double-Nozzle Spray Cooling for High-Power LEDs 2799.1.1 Spray Cooling System 2809.1.2 Data Analysis Method and Uncertainty Analysis 2819.1.3 Simulations for Junction Temperature Evaluation 2829.1.4 Characteristics of High-Power LEDs Module and Spray Droplets 2839.1.5 Results and Discussion 2849.1.5.1 Effect of Nozzle Configuration and Flow Rate 2859.1.5.2 Effect of Nozzle-to-Surface Distance 2889.1.5.3 Validation Study 2899.1.5.4 Estimation of Junction Temperature 2909.2 Direct Body Liquid Cooling 2909.2.1 Calculation of Surface Heat Transfer Coefficient 2929.2.2 Body Cooling Thermal Conductive Model 2949.2.3 Experiment 2959.2.4 Numerical Simulation 2969.2.5 Performance of the Developed JIBC Device 2979.3 Integrated Piezoelectric Pump Cooling 3039.3.1 Design and Fabrication of JAICIPM 3039.3.2 Numerical Simulation 3059.3.3 Experiment 3079.3.4 Results and Discussion 3099.4 Microchannel Cooling for Uniform Chip Temperature Control 3139.4.1 Bilayer Compact Thermal Model 3149.4.2 Heat Transfer in the Solid Layer 3149.4.3 Heat Transfer in the Convection Layer 3179.4.4 Heat Flux Iteration 3189.4.5 Genetic Algorithm Optimization 3189.4.6 Validation 3199.5 Chapter Summary 327References 328Index 333