Solder Paste in Electronics Packaging

Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Häftad, Engelska, 2012

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One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech nology.

Produktinformation

Utgivningsdatum2012-02-20
Mått152 x 229 x 27 mm
Vikt695 g
FormatHäftad
SpråkEngelska
Antal sidor456
FörlagSpringer
ISBN9789401160520

Tillhör följande kategorier

I—Overview.- 1 Introduction.- 2 Interdisciplinary Approach.- II—Basic Technologies.- 3 Chemical and Physical Characteristics.- 4 Metallurgical Aspects.- 5 Rheology of Solder Pastes.- III—Methodologies and Applications.- 6 Application Techniques.- 7 Soldering Methodologies.- 8 Cleaning.- IV—Reliability, Quality Control, and Tests.- 9 Solder Joint Reliability and Inspection.- 10 Special Topics in Surface Mount Soldering Problems and Other Soldering-RelatedProblems.- 11 Quality Assurance and Tests.- V—Future Tasks and Emerging Trends.- 12 Future Developments.- VI—Appendix.- I. Federal Specification QQ-S-571E and Amendment 4.- II. Ternary Phase Diagram: Pb-Ag-Sn, Sn-Pb-Bi.- III. Military Specification MIL-P-28809A: PrintedWiring Assemblies.- IV.Quantitative Determination of Rosin Residues onCleaned Electronics Assemblies.