Solder Paste in Electronics Packaging

Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Häftad, Engelska, 1992

1 379 kr

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This guide aims to provide a working understanding of the latest solder paste principles and applications, enabling engineers to take advantage of today's surface mount technology. It shows how to use solder paste technology to improve interconnection performance and efficiency in hybrid circuits, printed circuits, and components. Coverage includes basic solder paste technologies, application techniques, reliability and testing, and solutions to specific problems. This book should be of interest to electronic engineers.

Produktinformation

Utgivningsdatum1992-09-24
Mått152 x 229 x 27 mm
Vikt695 g
FormatHäftad
SpråkEngelska
Antal sidor456
FörlagKluwer Academic Publishers Group
ISBN9780442013530

Tillhör följande kategorier

I—Overview.- 1 Introduction.- 2 Interdisciplinary Approach.- II—Basic Technologies.- 3 Chemical and Physical Characteristics.- 4 Metallurgical Aspects.- 5 Rheology of Solder Pastes.- III—Methodologies and Applications.- 6 Application Techniques.- 7 Soldering Methodologies.- 8 Cleaning.- IV—Reliability, Quality Control, and Tests.- 9 Solder Joint Reliability and Inspection.- 10 Special Topics in Surface Mount Soldering Problems and Other Soldering-Related Problems.- 11 Quality Assurance and Tests.- V—Future Tasks and Emerging Trends.- 12 Future Developments.- VI—Appendix.- I. Federal Specification QQ-S-571E and Amendment 4.- II. Ternary Phase Diagram: Pb-Ag-Sn, Sn-Pb-Bi.- III. Military Specification MIL-P-28809A: Printed Wiring Assemblies.- IV. Quantitative Determination of Rosin Residues on Cleaned Electronics Assemblies.