Del 0 - Woodhead Publishing Series in Electronic and Optical Materials
2 399 kr
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Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers.
The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques.
The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.
Christian-Alexander Bunge, Markus Beckers, Thomas Gries, Germany) Bunge, Christian-Alexander (University of Applied Sciences Leipzig (HfTL), Germany) Beckers, Markus (RWTH Aachen University, and energy and material efficiency.) Gries, Thomas (RWTH Aachen University, Germany. Textile innovation, digitalisation, sustainability, biotransformation, decarbonisation, textile recycling, circular economy, bioeconomy
2 509 kr
Gerhard Huebschen, Iris Altpeter, Ralf Tschuncky, Hans-Georg Herrmann, Germany) Huebschen, Gerhard (formerly of the Fraunhofer Institute for Nondestructive Testing (IZFP), Germany) Altpeter, Iris (formerly of the Fraunhofer Institute for Nondestructive Testing (IZFP), Germany) Tschuncky, Ralf (The Fraunhofer Institute for Nondestructive Testing (IZFP), Germany) Herrmann, Hans-Georg (Saarland University, Germany; the Fraunhofer Institute for Nondestructive Testing (IZFP)
2 509 kr
Manuel V�zquez, Manuel Vázquez, Spain) Vazquez, Manuel (Professor of Research of the Spanish National Research Council, CSIC
3 299 kr
Suryadevara Babu, Babu Suryadevara, United States) Suryadevara, Babu (Professor Emeritus, Department of Chemical and Biomolecular Engineering, Clarkson University
3 209 kr
Roel Gronheid, Paul Nealey, Belgium) Gronheid, Roel (IMEC, USA) Nealey, Paul (University of Chicago
2 509 kr
Milan Brandt, Australia) Brandt, Milan (Professor of Advanced Manufacturing, School of Aerospace, Mechanical and Manufacturing Engineering, RMIT University
3 529 kr
Deepak Uttamchandani, UK) Uttamchandani, Deepak (Professor of Microsystems Engineering, University of Strathclyde
2 149 kr
Robert Stewart, David Dr. Crawford, Andrew Sterling, David Dr Crawford, David Crawford
1 769 kr
N. Thejo Kalyani, Hendrik C. Swart, Sanjay J. Dhoble, N Thejo Kalyani, Hendrik C Swart, Sanjay J Dhoble
2 459 kr
L Ye, Y.-W. Mai, Z. Su, Australia) Ye, L (University of Sydney, Australia) Mai, Y.-W. (University Chair and Professor of Mechanical Engineering at the University of Sydney, L. Ye, Y. -W Mai, Y -W Mai
4 909 kr
Shao-yun Fu, Bernd Lauke, Y.-W. Mai, Yiu-Wing Mai, China) Fu, Shao-yun (Chinese Academy of Sciences, Germany) Lauke, Bernd (Leibniz Institute of Polymer Research, Australia) Mai, Yiu-Wing (University Chair and Professor of Mechanical Engineering at the University of Sydney, Shao-Yun Fu
2 999 kr