Handbook of Silicon Based MEMS Materials and Technologies

Markku Tilli obtained a degree in Materials Science (Physical Metallurgy) at Helsinki University of Technology (HUT) in 1974. Until 1980 he had various research and teaching positions at HUT specializing in crystal growth technologies. From 1981 to 1984 he managed process research and development in Silicon project at HUT silicon wafer manufacturing pilot plant. Since 1985 he has had various managing positions at Okmetic in research, development and customer support areas, and held a position of Senior Vice President, Research until his retirement in 2018. His MEMS related activities started in 1982 when he developed a process to make double side polished silicon wafers for bulk micromachined sensors. Since then he has developed advanced new silicon wafer types for MEMS, including special epitaxial wafers, SOI and SOI wafers with buried cavities. His publication topics include oxygen precipitation in silicon, silicon crystal growth, wafer cleaning as well as silicon wafer manufacturing technologies and applications in MEMS. He is member of the Technology Academy of Finland and has received the honorary degree of Doctor of Science in Engineering from Aalto University. Dr. Mervi Paulasto-Kröckel is professor at Aalto University School of Electrical Engineering in Finland. She studied materials science and semiconductor technology in Helsinki University of Technology, and gradudated as MSc Tech in 1990. She continued her studies in the Technical Universities of Aachen (RWTH Aachen) and Helsinki and attained her doctoral degree in 1995. After a 2-years post-doctoral appointment at the Joint Research Centre of European Commission in the Netherlands, her professional career continued in the electronics industry. She was a Staff Principal Engineer at Motorola Semiconductor Products Sector in Munich. In 2004 Paulasto-Kröckel joined Infineon Technologies where she was the Director Package Development responsible for semiconductor assembly and interconnect development for automotive products worldwide.At the end of 2018 Dr. Paulasto-Kröckel became a professor at Helsinki University of Technology, which is now called Aalto University after a merger with two other leading universities in the Helsinki area. Her current research focus is on advanced materials and interconnect technologies for MEMS/NEMS and power electronics, as well as multi-material assemblies behavior under different loads and their characteristic failure mechanisms. Her group has extensive experience in studying interactions and interfacial reactions between dissimilar materials, such as different oxide and nitride materials, metals and semiconductors. The group has developed a combined methodology approach to solve multi-materials compatibility issues in microelectronics and microsystems. Prof. Paulasto-Kröckel has over 110 international publications in the fields of microelectronics packaging and interfacial compatibility of dissimilar materials. She is IEEE EPS Distinguished Lecturer and a member of the Finnish Academy of Technical Sciences. Matthias Petzold is Professor, Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Germany. His research focuses on physical failure analysis of semiconductor materials, on strength and reliability properties of MEMS, on material diagnostics in microelectronics packaging and on innovative methods and instrumentation for microstructure diagnostics and mechanical testing. He is currently heading the institute’s Center for Applied Microstructure Diagnostics (CAM) and is deputy director of the Fraunhofer institute for Microstructure of Materials and Systems IMWS in Halle. Horst Theuss is Lead Principal, Infineon Technologies AG, Germany, where he is today responsible for Backend predevelopments focusing on new packages for MEMS and sensors. Since 2000, he has worked on a variety of assembly technologies and concepts in the field of discrete semiconductors, wafer level packaging, cavity packaging, materials and integration concepts. Teruaki Motooka received PhD degree in 1981 in Applied Physics from Kyushu University. He was a research scientist in the Central Research Laboratory, Hitachi Ltd. for 1971-1984, a visiting research assistant professor at University of Illinois at Urbana-Champaign, USA for 1984-1988, an associate professor in the Institute of Applied Physics at University of Tsukuba, Japan for 1988-1993, and became a full professor at Kyushu University in 1993. He retired from Kyushu University in 2010.He has published more than 150 scientific papers on various international journals and these papers have been cited more than 2000 times. Veikko Lindroos is Professor Emeritus, Physical Metallurgy and Materials Science, Aalto University, Finland. His research covers a broad spectrum of materials science and technology, such as metallic materials, silicon technology and MEMS materials magnetic, electronic and composite materials as well as shape memory effect and materials.

• Part I1. Properties of silicon; Fracture toughness2. Czochralski Growth of Silicon Crystals3. Properties of Silicon Crystals4. Silicon Wafers: Preparation and Properties; Modern technologies 5. Epi Wafers: Preparation and Properties6. Thin Films on Silicon 7. Thick-Film SOI Wafers: Preparation and propertiesPart II8. Multiscale Modeling Methods9. Mechanical Properties of Silicon Microstructures10. Electrostatic and RF-Properties of MEMS Structures 11. Optical Modeling of MEMS12. Modeling of Silicon Etching13. Gas Damping in Vibrating MEMS Structures14. Recent Progress in Large-scale Electronic State Calculations and Data-driven SciencesPart III15. MEMS Lithography16. Deep Reactive Ion Etching; update17. Wet Etching of Silicon18. Porous Silicon Based MEMS19. Surface Micromachining20. Vapor Phase Etch Processes for Silicon MEMS21. Inkjet Printing, Laser-Based Micromachining and Micro 3D Printing Technologies for MEMS 22. Microfluidics and BioMEMS in SiliconPart IV23. Silicon Direct Bonding24. Anodic Bonding25. Glass Frit Bonding26. Metallic Alloy Seal Bonding27. Emerging Wafer Bonding Technologies28. Bonding of CMOS Processed Wafers29. Wafer-Bonding Equipment30. Encapsulation by Film Deposition31. Dicing of MEMS Devices32. 3D Integration of MEMS33. Own chapter for eWLP34. Through-Substrate Via Technologies for MEMS35. Outgassing and GetteringPart V36. Silicon Wafer and Thin Film Measurements37. Oxygen and Bulk Microdefects in Silicon38. Optical Measurement of Static and Dynamic Displacement in MEMS39. MEMS Residual Stress Characterization: Methodology and Perspective 40. Microscale deformation analysis41. Strength of Bonded Interfaces42. Hermeticity Tests43. MEMS testing and calibration44. MEMS ReliabilityPart VI45. Case Accelerometer46. Case Gyroscope47. Case Pressure Sensor48. Case Microphone49. Case Micromirror50. Case Optical MEMs