Del i serien Springer International Series in Engineering and Computer Science

Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®

Inbunden, Engelska, 2002

AvErdogan Madenci,Ibrahim Guven,Bahattin Kilic

2 339 kr

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Fatigue reliability of solder joints is an important issue in the electronics industry. There have been several attempts to accurately predict the expected service life of an electronic component. One method has emerged as the most widely used for a multitude of package configurations. However, this method requires the knowledge of finite element modelling and simulation with ANSY TM, a commercially available finite element program. Furthermore, a three-dimensional finite element modelling of any electronic package remains a formidable task even if the analyst has extensive knowledge of ANSYS TM. This text describes the method in great detail starting from the theoretical basis. The reader is supplied with an add-on software package to ANSYS TM that is designed for solder joint fatigue reliability analysis of electronic packages. Specific steps of the analysis method are discussed through examples without leaving any room for confusion.

Produktinformation

Utgivningsdatum2002-12-31
Mått155 x 235 x 17 mm
Vikt490 g
FormatInbunden
SpråkEngelska
SerieSpringer International Series in Engineering and Computer Science
Antal sidor185
Upplaga2003
FörlagKluwer Academic Publishers
ISBN9781402073304

Tillhör följande kategorier

1 Introduction.- 1.1 Numerical Modeling with Finite Element Analysis.- 1.2 Constitutive Relations.- 1.3 Failure Prediction.- 1.4 References.- 2 Thermomechanical Fatigue Life Prediction Analysis.- 2.1 Approach.- 2.2 Analysis Steps.- 2.3 Case Study: BGA-Type Package.- 2.4 References.- 3 Mechanical Bending Fatigue Life Prediction Analysis.- 3.1 Approach.- 3.2 Analysis Steps.- 3.3 Case Study: BGA-Type Package.- 3.4 References.- 4 Macro Reference Library.- 4.1 Overview.- 4.2 Preprocessor.- 4.3 Solution.- 4.4 Postprocessing.- 4.5 Reference.- Appendix A: Installation and Execution.- A.1 Steps for ReliANS Installation on a PC Platform.- A.2 Steps for Adding Working Directories for Use in ReliANS.- A.3 Demonstration of ReliANS Installation and Adding New Directories.- A.4 Installation of ReliANS on UNIX Systems.- Appendix B: Input Listings for Case Studies.- B. 1 Input Listing for the Case Study Given in Chapter 2.- B.2 Input Listing for the Case Study Given in Chapter 3.

From the reviews: "Fatigue Life Prediction of Solder Joints in Electronic Packages ... excites the interest of engineers and allows them to conduct fatigue reliability analysis of solder joints. ... there must by now be this book on the bookshelf of every one concerned with fatigue reliability analyses of solder joints which is an important issue in the electronics industry." (Current Engineering Practice, Vol. 47, 2002-2003)