Fatigue Life Prediction of Solder Joints in Electronic Packages with Ansys®
Häftad, Engelska, 2012
2 399 kr
Finns i fler format (1)
Produktinformation
- Utgivningsdatum2012-10-14
- Mått155 x 235 x 12 mm
- Vikt324 g
- SpråkEngelska
- SerieSpringer International Series in Engineering and Computer Science
- Antal sidor185
- FörlagSpringer-Verlag New York Inc.
- EAN9781461349891
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