Thermal Management Materials for Electronic Packaging

Preparation, Characterization, and Devices

Inbunden, Engelska, 2024

AvXingyou Tian,Xingyou Tian,Xingyou (Chinese Academy of Sciences) Tian

2 249 kr

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Thermal Management Materials for Electronic Packaging Practical resource exploring the theoretical and experimental basis as well as solutions for the development of new thermal management materials for electronic packaging Thermal Management Materials for Electronic Packaging: Preparation, Characterization, and Devices provides in-depth and systematic summaries on cutting-edge thermal management materials for high-power density electronic devices, introducing the preparation methods and application scenarios of thermal management materials for electronic packing, covering refinements of thermal conductivity theory and performance prediction models for multiphase composites, and overall focusing on key scientific issues related to the subject, such as the internal interface of new high thermal conductive substrate materials and the mechanism of spatial topology on performance. The text also discusses key issues on the design and preparation of thermal conductive substrate materials with high thermal conductive properties, including their characterization, properties, and manipulation, as well as the latest methods, techniques, and applications in this rapidly developing area. Sample topics covered in Thermal Management Materials for Electronic Packaging include: Basic concepts and laws of thermal conduction, heat conduction differential equation and finite solution, and thermal conductivity of solidsDefinition and classification of electronic packaging, thermal management in electronic equipment, and requirements of electronic packaging materialsSynthesis and surface modification of high thermal conductive filler and the synthesis of substrates and preparation of thermal conductive composites with inorganic ceramic skeleton structureAssembly of thermal conductive materials in different dimensions and preparation of composite materials, and reliability analysis and environmental performance evaluationThermal Management Materials for Electronic Packaging serves as an ideal reference for researchers and workers in related fields to significantly improve the mechanical and thermal management properties of materials, expand the material selection and design margin of substrates, and develop substrates that meet the application needs of different gradients.

Produktinformation

Utgivningsdatum2024-01-17
Mått170 x 244 x 25 mm
Vikt822 g
FormatInbunden
SpråkEngelska
Antal sidor368
FörlagWiley-VCH Verlag GmbH
ISBN9783527352425

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Xingyou Tian, Professor, is Deputy Director of Institute for Solid State Physics (ISSP), Hefei Institutes of Physical Science, Chinese Academy of Sciences and Director of the Key Laboratory of Photovoltaic and Energy-Saving Materials of the Chinese Academy of Sciences. His main research includes key functional materials for electronic devices, integrated circuit heat dissipation materials, polymer nanocomposite materials, and new energy-saving and environmentally friendly materials.

Overview of Works xvAcknowledgments xvii1 Physical Basis of Thermal Conduction 1Xian Zhang, Ping Zhang, Chao Xiao, Yanyan Wang, Xin Ding, Xianglan Liu, and Xingyou Tian1.1 Basic Concepts and Laws of Thermal Conduction 11.1.1 Description of Temperature Field 11.1.2 Temperature Gradient 21.1.3 Fourier’s Law 21.1.4 Heat Flux Density Field 21.1.5 Thermal Conductivity 31.2 Heat Conduction Differential Equation and Finite Solution 31.2.1 Heat Conduction Differential Equation 31.2.2 Definite Conditions 51.3 Heat Conduction Mechanism and Theoretical Calculation 51.3.1 Gases 61.3.2 Solids 61.3.2.1 Metals 61.3.2.2 Inorganic Nonmetals 81.3.3 Liquids 111.4 Factors Affecting Thermal Conductivity of Inorganic Nonmetals 121.4.1 Temperature 121.4.2 Pressure 131.4.3 Crystal Structure 141.4.4 Thermal Resistance 141.4.5 Others 15References 152 Electronic Packaging Materials for Thermal Management 19Xian Zhang, Ping Zhang, Chao Xiao, Yanyan Wang, Xin Ding, Xianglan Liu, and Xingyou Tian2.1 Definition and Classification of Electronic Packaging 192.1.1 Definition of Electronic Packaging 192.1.2 Functions of Electronic Packaging 202.1.3 The Levels of Electronic Packaging 212.2 Thermal Management in Electronic Equipment 222.2.1 Thermal Sources 222.2.2 Thermal Failure Rate 232.2.3 The Thermal Management at Different Package Levels 232.3 Requirements of Electronic Packaging Materials 242.3.1 Thermal Interface Material 242.3.2 Heat Dissipation Substrate 252.3.3 Epoxy Molding Compound 262.4 Electronic Packaging Materials 272.4.1 Metal Matrix Packaging Materials 272.4.2 Ceramic Matrix Packaging Materials 302.4.3 Polymer Matrix Packaging Materials 332.4.4 Carbon–Carbon Composite 36References 363 Characterization Methods for Thermal Management Materials 39Kang Zheng and Xingyou Tian3.1 Overview of the Development of Thermal Conductivity Test Methods 393.2 Test Method Classification and Standard Samples 403.2.1 Steady-State Measurement Method 413.2.2 Non-Steady-State Measurement Method 423.3 Steady-State Method 423.3.1 Longitudinal Heat Flow Method 433.3.2 Guarded Heat Flow Meter Method 443.3.3 Guarded Hot Plate Method 443.4 Non-Steady-State Method 463.4.1 Laser Flash Method 463.4.2 Hot-Wire Method 463.4.3 Transient Planar Heat Source (TPS) Method 473.5 Electrical Properties and Measurement Techniques 483.5.1 Electric Conductivity and Resistivity 493.5.1.1 Testing Resistivity of Bulk Material 503.5.1.2 Four-Probe Method 503.5.1.3 The Van der Pauw Method 513.5.2 Dielectric Constant and Its Characterization 523.6 Material Characterization Analysis Technology 543.6.1 Optical Microscope 543.6.2 X-ray Diffraction 553.6.2.1 Phase Analysis 563.6.2.2 Determination of Crystallinity 563.6.2.3 Precise Measurement of Lattice Parameters 563.6.3 Scanning Electron Microscope 573.6.4 Transmission Electron Microscope 583.6.5 Scanning Acoustic Microscope 603.6.6 Atomic Force Microscope 623.6.7 Thermal Mechanical Analysis (TMA) 643.6.8 Dynamic Mechanical Analysis (DMA) 663.7 Reliability Analysis and Environmental Performance Evaluation 683.7.1 Failure Modes and Mechanisms 693.7.1.1 Residual Stress 693.7.1.2 Stress Void 703.7.1.3 Adherence Strength 703.7.1.4 Moisture 703.7.2 Reliability Certification 713.7.2.1 Viscosity of Plastic Packaging Material 713.7.2.2 The Moisture Test 713.7.2.3 Hygroscopic Strain and Humidity Measurement 723.7.2.4 Temperature Adaptability 723.7.2.5 Tightness 723.7.2.6 Defects in Manufacturing Process Control 723.7.2.7 Quality Control Procedure for High-Reliability Plastic Packaging Devices 733.7.2.8 Selection of High-Reliability Plastic Packaging Devices 733.8 Conclusion 73References 744 Construction of Thermal Conductivity Network and Performance Optimization of Polymer Substrate 77Hua Wang, Xingyou Tian, Haiping Hong, Hao Li, Yanyan Liu, Xiaoxiao Li, Yusheng Da, Qiang Liu, Bin Yao, Ding Lou, Mingyang Mao, and Zhong Hu4.1 Synthesis and Surface Modification of High Thermal Conductive Filler and the Synthesis of Substrates 774.1.1 Synthesis of Hexagonal Boron Nitride Nanosheets by Halide-Assisted Hydrothermal Method at Low Temperature 774.1.2 Modification and Compounding of Inorganic Thermal Conductive Silicon Carbide Filler 774.1.3 Preparation and Characterization of Intrinsic Polymer with High Thermal Conductivity 784.2 Study on Polymer Thermal Conductive Composites with Oriented Structure 804.2.1 Epoxy Composites Filled with Boron Nitride and Amino Carbon Nanotubes 804.2.2 Reduction of Graphene Oxide by Amino Functionalization/Hexagonal Boron Nitride 844.2.3 The Interconnection Thermal Conductive Network of Three-Dimensional Staggered Boron Nitride Sheet/Amino-Functionalized Carbon Nanotubes 874.3 Preparation of Thermal Conductive Composites with Inorganic Ceramic Skeleton Structure 884.3.1 Preparation of Hollow Boron Nitride Microspheres and Its Epoxy Resin Composite 884.3.2 Three-Dimensional Skeleton and Its Epoxy Resin Composite 934.4 Improved Thermal Conductivity of Fluids and Composites Using Boron Nitride Nanoparticles Through Hydrogen Bonding 1004.4.1 Preparation and Characterization of Improved Thermal Conductivity of Fluids and Composites Using Boron Nitride Nanoparticles 1004.4.2 Discussion and Analysis of BN Composites as Thermal Interface Materials 1024.5 Improved Thermal Conductivity of PEG-Based Fluids Using Hydrogen Bonding and Long Chain of Nanoparticle 1074.5.1 Preparation and Characterization of Thermal Conductivity of PEG-Based Fluids Using Hydrogen Bonding and Long Chain of Nanoparticle 1074.5.2 Discussion and Analysis of PEG-Based Fluids Using Hydrogen Bonding and Long Chain of Nanoparticle 1094.6 Conclusion 114References 1145 Optimal Design of High Thermal Conductive Metal Substrate System for High-Power Devices 117Hong Guo, Zhongnan Xie, and DingBang Xiong5.1 Power Devices and Thermal Conduction 1175.2 Optimization and Adaptability Design, Preparation and Modification of High Thermal Conductive Matrix and Components 1205.2.1 Preparation and Thermal Conductivity of Gr/Cu Composites 1205.2.1.1 Gr/Cu In Situ Composite Method 1215.2.1.2 Thermal Conductivity of Gr/Cu Micro–Nano-Laminated Composites 1245.2.1.3 Coefficient of Thermal Expansion of Composite Materials 1265.2.2 Preparation and Thermal Conductivity of Graphite/Cu Composites 1305.2.2.1 Variations in the Intrinsic Thermophysical Properties of Graphite Sheets During the Compounding Process 1315.2.2.2 Orientation Modulation of Graphite Sheets in Composites 1335.2.2.3 Effect of Graphite Sheet Orientation on the Thermal Conductivity of Graphite/Cu Composites 1365.2.3 Preparation and Thermal Conductivity of Graphite/Gr/Cu Composites 1365.2.3.1 Thermal Conductivity of Graphite/Gr/Cu Composites 1405.2.3.2 Thermal Expansion Coefficient of Graphite/Gr/Cu Composites 1415.3 Formation and Evolution Rules of High Thermal Conductive Interface and Its Control Method 1435.3.1 Theoretical Calculation of High Thermal Conductive Interface Design 1435.3.2 Study on Interface Regulation of Chromium-Modified Diamond/Cu Composites 1465.3.3 Study on Interface Regulation of Boron-Modified Diamond/Cu Composites 1505.3.4 Study on Interface Regulation of Gr-Modified Diamond/Cu Composites 1535.4 Formation and Evolution Rules of High Thermal Conductive Composite Microstructure and Its Control Method 1575.4.1 Configurated Diamond/Metal Composites with High Thermal Conductivity 1575.4.2 Effect of Secondary Diamond Addition on Properties of Composites 1595.4.3 Effect of Secondary Particle Size on the Properties of Composites 1605.4.4 Thermal Expansion Behavior of Composite Materials with Different Thermal Conductive Configurations 161References 1626 Preparation and Performance Study of Silicon Nitride Ceramic Substrate with High Thermal Conductivity 165Yao Dongxu, Wang Weide, and Zeng Yu-ping6.1 Rapid Nitridation of Silicon Compact 1656.1.1 Rapid Nitridation of Silicon Compact 1656.1.1.1 Optimization (YEu)2O3 /MgO Sintering Additive 1676.1.1.2 Further Optimization of the SRBSN with 2YE5M as Sintering Additive 1736.2 Optimization of Sintering Aids for High Thermal Conductivity Si3N4 Ceramics 1816.2.1 Preparation of High Thermal Conductivity Silicon Nitride Ceramics Using ZrSi2 as a Sintering Aid 1826.2.1.1 Reaction Mechanism of ZrSi2 1826.2.1.2 Effect of ZrSi2 on the Phase Composition 1856.2.1.3 Effect of ZrSi2 on Microstructure 1866.2.1.4 Effect of ZrSi2 on Thermal Conductivity 1886.2.1.5 Effect of ZrSi2 on Mechanical Properties and Electrical Resistivity 1896.2.2 High Thermal Conductivity Si3N4 Sintered with YH2 as Sintering Aid 1906.2.2.1 Pre-sintering of the Compact 1916.2.2.2 Effect of YH2 on the Densification and Weight Loss 1946.2.2.3 Effect of YH2 on Elements Distribution and Phase Composition 1966.2.2.4 Effect of YH2 on Microstructure 1976.2.2.5 Effect of YH2 on Thermal Conductivity 2006.2.2.6 Effect of YH2 on Mechanical Properties 2016.2.2.7 Differences in the Effect of Different REH2 on the Thermal Conductivity of Silicon Nitride 2036.3 Investigation of Cu-Metalized Si3N4 Substrates Via Active Metal Brazing (AMB) Method 2046.3.1 Effect of Brazing Temperature on the Peeling Strength of Cu-Metalized Si3N4 Substrates 2046.3.2 Effect of Holding Time on the Peeling Strength of Cu-Metalized Ceramic Substrates 2056.3.3 Effect of Brazing Ball Milling Time on the Peeling Strength of Cu-Metalized Ceramic Substrates 207References 2077 Preparation and Properties of Thermal Interface Materials 211Xiaoliang Zeng, Linlin Ren, and Rong Sun7.1 Conception of Thermal Interface Materials 2117.2 Polymer-Based Thermal Interface Materials 2147.2.1 Filler Surface Functionalization 2147.2.2 Covalent Bonding Among Fillers 2157.2.3 Construction of Thermally Conductive Pathways 2157.2.3.1 In-Plane Thermally Conductive Pathways 2157.2.3.2 Out-of-Plane Thermally Conductive Pathways 2167.2.3.3 Isotropic Thermally Conductive Pathways 2207.2.4 Enhance the Bonding Force and Construct Thermally Conductive Pathways 2217.2.4.1 Non-Covalent Bonds and Thermally Conductive Pathways 2217.2.4.2 Covalent Bonds and Thermally Conductive Pathways 2217.2.4.3 Welding and Thermally Conductive Pathways 2237.3 Metal-Based Thermal Interface Materials 2237.4 Carbon-Based Thermal Interface Materials 2297.5 Molecular Simulation Study of Interfacial Thermal Transfer 2387.6 Conclusion 240References 2418 Study on Simulation of Thermal Conductive Composite Filling Theory 257Bin Wu, Peng Chen, and Jiasheng Qian8.1 Molecular Simulation Algorithms for Thermal Conductivity Calculating 2578.1.1 MD (Green–Kubo) Method 2578.1.2 NEMD Method 2588.1.3 e-DPD Method 2598.2 Molecular Simulation Study on Polymers 2618.3 Molecular Simulation Study on TC of Si3N4 Ceramic 2658.4 Molecular Simulation Study on TC of Diamond/Copper Composites 2688.5 Simulation Study on Polymer-Based Composites 2708.5.1 Simulation Analysis in Heat Transfer Pathways Construction 2708.5.2 Simulation Analysis of Low Thermal Resistance Interface Structure Construction 2758.5.2.1 Covalent Bonding Construct Interface Structure 2758.5.2.2 Non-covalent Construct Bonding Interface Structure 283References 2839 Market and Future Prospects of High Thermal Conductivity Composite Materials 287Chen Hongda and Zhang Xu9.1 Basic Concept of Composite Materials 2879.1.1 The History of Composite Materials 2879.1.2 The Introduction of Composite Materials 2889.1.3 The Application of Composite Materials 2889.2 Thermal Conductivity Mechanism and Thermal Conductivity Model 2909.2.1 Electron Conduction Mechanism 2909.2.2 Phonon Heat Conduction Mechanism 2919.2.3 Thermal Conduction Mechanism 2919.2.4 Thermal Conductivity Model 2939.3 Composite Materials in Electronic Devices 2949.3.1 Electronic Heat Dissipation and Thermal Adaptation Materials 2959.3.2 Preparation and Application of Thermally Adaptive Composites 2969.4 Thermal Functional Composites 2989.4.1 Thermally Conductive Composites 2999.4.1.1 Review of the Latest Research Progress 2999.4.1.2 Comparative Analysis at Home and Abroad 2999.4.2 Heat-Resistant Composite Materials 2999.4.2.1 Review of the Latest Research Progress 2999.4.2.2 Comparative Analysis at Home and Abroad 3009.4.3 Thermal Storage Composites 3009.4.3.1 Review of the Latest Research Progress 3009.4.3.2 Domestic and Foreign Comparative Analysis 3019.4.4 Application Foresight 3019.4.5 Future Forecast 3029.5 The Modification of Composite Materials 3029.6 The New Packaging Material 3109.6.1 Third-Generation Packaging Material-Near-Net Shape of High-Volume-Fraction SiCp/Al Composites 3109.6.2 Fourth-Generation Electronic Packaging Material—Diamond/Cu(AI) Composite Material 3119.7 Thermal Management of Electronic Devices 3129.7.1 Electronic Device Heat Dissipation Technology 3139.7.1.1 Direct Liquid Cooling 3149.7.1.2 Indirect Liquid Cooling 3149.7.1.3 Liquid Jet Cooling and Spraying, Drop Cooling 3159.7.1.4 Microchannel Heat Transfer Microchannel 3159.7.2 Phase Change Temperature Control 3169.7.2.1 Inorganic Energy Storage Materials 3179.7.2.2 Organic Energy Storage Materials 3179.8 Methods for Improving Thermal Conductivity of Composite Materials 3209.8.1 Choose a Reasonable Filling Amount 3209.8.2 Change the Structure and Morphology of the Filling Phase 3229.8.3 Change the Surface Morphology of the Filling Phase 3229.8.4 Improving the Dispersion Form of Filling Phase 3239.9 The Application of Composite Materials 3249.9.1 Classification of Potting Materials 3249.9.2 Research Status of Potting Materials 3249.9.3 Research Status of Thermally Conductive Potting Composite Materials 3269.9.4 Research on Fillers 3279.9.4.1 The Effect of Filler Thermal Conductivity on Thermal Conductivity 3279.9.4.2 The Effect of Filler Particle Size on Thermal Conductivity 3289.9.4.3 Effect of Filler Surface Modification Treatment on Thermal Conductivity 3299.9.4.4 Effects of Mixed Particle-Size Fillers on Thermal Conductivity 3299.10 Conclusion 329References 330Index 335