Smart Electronic Systems

Heterogeneous Integration of Silicon and Printed Electronics

Inbunden, Engelska, 2018

Av Li-Rong Zheng, Hannu Tenhunen, Zhuo Zou

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Unique in focusing on both organic and inorganic materials from a system point of view, this text offers a complete overview of printed electronics integrated with classical silicon electronics.Following an introduction to the topic, the book discusses the materials and processes required for printed electronics, covering conducting, semiconducting and insulating materials, as well as various substrates, such as paper and plastics. Subsequent chapters describe the various building blocks for printed electronics, while the final part describes the resulting novel applications and technologies, including wearable electronics, RFID tags and flexible circuit boards.Suitable for a broad target group, both industrial and academic, ranging from mechanical engineers to ink developers, and from chemists to engineers.

Produktinformation

Utgivningsdatum2018-11-07
Mått173 x 249 x 18 mm
Vikt726 g
FormatInbunden
SpråkEngelska
Antal sidor296
FörlagWiley-VCH Verlag GmbH
ISBN9783527338955

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Elektronik och kommunikationer inom Naturvetenskap och teknik

Li-Rong Zheng is professor in Media Electronics at the Swedish Royal Institute of Technology (KTH) in Stockholm, Sweden, as well as founder and director of iPack VINN Excellence Center. Since 2010, he holds the position as a distinguished professor and director of ICT School at the Fudan University in Shanghai, China. His research interests include electronic circuits, wireless sensors, systems for ambient intelligence and the internet-of-things.In 2001, he received his Ph.D. degree in electronic system design from the Swedish Royal Institute of Technology (KTH) in Stockholm, Sweden.He has authored more than 400 scientific publications. He is member of the steering board of the International Conference on Internet-of-Things. Hannu Tenhunen is professor at the Swedish Royal Institute of Technology (KTH) in Stockholm, Sweden, and holds invited and honorary professorships in Finland, USA, France, China and Hong Kong. During the last 20 years he has been actively involved in high technology policies, technology impact studies, innovations and changing the educational system. For instance, he was director of various European graduate schools and he was Education Director of the new European flagship initiative European Institute of Technology and Innovations (EIT) and the Knowledge and Innovation Community: EIT ICT Labs. He has authored more than 700 scientific publications and holds 9 patents. Furthermore, he was one of the originators of the interconnect-centric design, globally asynchronous/locally synchronous concept and network-on-chip (NoC) paradigms.

Preface xiAcknowledgment xiiiPart I Materials and Processes for Printed Electronics 11 Introduction 31.1 Connected SmartWorld 31.2 Smart Electronic Systems 41.3 Overview of the Book 6References 82 Functional Electronic Inks 112.1 Introduction 112.1.1 Printing Technologies 112.1.1.1 Screen Printing 112.1.1.2 Gravure Printing 122.1.1.3 Flexographic Printing 122.1.1.4 Offset Printing 132.1.1.5 Inkjet Printing 132.1.1.6 Aerosol Printing 152.1.2 Fluid Requirements for Inkjet Inks 152.1.2.1 Boiling Point 162.1.2.2 Surface Tension 162.1.2.3 Viscosity 162.1.2.4 Particle Size 172.2 Conductive Inks 172.2.1 Metallic Nanoparticle Inks 172.2.2 FunctionalizedMultiwalled Carbon Nanotube (f-MWCNT) Inks 202.2.2.1 Introduction 202.2.2.2 MWCNT Ink Formulation 212.2.2.3 Resistance Characterization 232.2.3 MWCNT/Polyaniline Composite Inks 252.2.3.1 Introduction 252.2.3.2 Composite Synthesis 262.2.3.3 Characterization ofWater-dispersible MWCNT/PANI Composite 282.3 Semiconductor Inks 332.3.1 Organic Semiconductor Inks 332.3.2 Single-walled Carbon Nanotube (SWCNT) Inks 362.3.2.1 SWCNTs in Organic Solvents 372.3.2.2 SWCNTs inWater 382.3.2.3 SWCNT/Polymer Composite 392.3.3 SWCNT/Polymer Composites Inks 422.4 Summary 43References 43Part II Printed Electronic Building Blocks 533 Printed Thin-film Transistors (TFTs) and Logic Circuits 553.1 Introduction 553.1.1 TFTs Versus Silicon MOSFETs 553.1.2 State-of-the-art TFT Technologies 563.1.3 New TFT Technologies 583.2 TFT Structure and Operation 603.2.1 TFT Architectures 603.2.2 Electrical Characteristics of TFTs 623.2.2.1 Carrier Mobility (𝜇) 623.2.2.2 On/Off Ratio (Ion/Ioff) 633.2.2.3 Threshold Voltage (Vt) 633.2.2.4 Sub-threshold Swing (SS) 643.3 Printed TFTs: an Overview 643.4 Carbon Nanotube (CNT)-network TFTs 713.4.1 Challenges in CNT-network TFTs 713.4.2 Percolation Transport in Nanotube Networks 733.4.3 Solution-process Fabrication of CNT-TFTs 753.4.4 Electrical Performance Enhancement in CNT-TFTs 763.4.4.1 Hysteresis Suppression 763.4.4.2 High 𝜇 and Large Ion/Ioff 793.4.4.3 Uniformity and Scalability 813.4.4.4 Ambient and Operational Stabilities 813.5 Logic Circuits Based on CNT-TFTs 823.6 Summary 84References 854 Printed PassiveWireless Sensors 914.1 Introduction 914.2 Sensing Materials 924.2.1 Carbon Nanotube-based Sensors 924.2.2 FunctionalizedMultiwalled Carbon Nanotubes as Humidity Sensing Material 934.2.2.1 Humidity Sensing Properties 944.2.2.2 Humidity Sensing Mechanism 964.2.2.3 Mechanical Flexibility 984.3 Passive UHFWireless Sensor 994.3.1 Flexible UHF Humidity Sensor Based on Carbon Nanotube 994.3.1.1 Sensor Operation Principle 994.3.1.2 Flexible Humidity Sensor Demonstration 1004.3.2 Sensor Optimization: Influence of Resistor-electrode Structure 1014.3.3 AnalyticalModel of Interdigital Electrode Capacitance 1044.3.3.1 Interdigital Electrode and Interdigital Capacitance 1044.3.3.2 Modified AnalyticalModels of IDCs 1054.4 Passive UWBWireless Sensor 1084.4.1 Sensor Operation Principle 1084.4.2 Theoretical Analysis and Data-processing Algorithm 1094.4.2.1 Theoretical Analysis 1094.4.2.2 Data-processing Algorithm 1114.4.3 Sensor Prototype 1124.4.4 Inkjet Printing of CoplanarWaveguide: Variable Ink-layer Thickness Approach 1144.4.4.1 Introduction 1144.4.4.2 Variable Ink-layer Thickness Approach 1154.5 Summary 118References 1195 Printed RFID Antennas 1255.1 Introduction 1255.1.1 Evolution of RFID-enabled Ubiquitous Sensing 1265.2 Future Trends and Challenges 1265.2.1 Design Challenges for RFID Tag Antennas 1275.3 RFID Antennas: Narrow Band 1275.3.1 Progressive Meander Line Antennas 1275.3.1.1 Antennas Design Evolution and Geometry 1285.3.1.2 Antenna Fabrication Parameters 1315.3.1.3 Parametric Analysis 1325.4 RFID Antennas:Wideband 1335.4.1 Bowtie Antenna: Rounded Corners with T-matching 1335.4.1.1 Antenna Dimensions and Parametric Optimization 1335.4.1.2 Field and Circuit Concepts Parametric Analysis 1345.4.2 Bowtie Antenna: Square Hole-matching Technique 1375.4.2.1 Antenna Design Numerical Analysis and Optimization 1385.4.2.2 Effective Aperture of Antenna 1385.4.2.3 Results, Discussion, and Analysis 1405.5 RFID Antennas: Sensor Enabled 1435.5.1 Archimedean Spiral Antenna 1435.5.1.1 Manufacturing Parametric Analysis 1455.5.1.2 Parametric Analysis of Field and Circuit Concepts 1475.5.2 RFID Antenna with Embedded Sensor and Calibration Functions 1495.5.2.1 Antenna as a Sensor Design 1505.6 Summary 152References 1526 Printed Chipless RFID Tags 1576.1 Introduction 1576.1.1 RFID History 1576.1.2 RFID System 1586.1.3 RFID Advantages 1616.1.4 RFID Applications 1626.1.4.1 Logistics 1626.1.4.2 Healthcare 1636.1.4.3 Retail 1636.1.4.4 Manufacturing 1636.1.4.5 Transportation 1636.1.4.6 Agriculture 1636.1.5 RFID Challenges 1646.2 Time-domain-based RFID Tags 1666.3 Frequency-domain-based RFID Tags 1716.4 Printing of Chipless RFID Tags 1726.4.1 Printing of Time-domain RFID Tags 1726.4.2 Printing of Frequency Domain Chipless RFID Tags 1756.5 Summary 1786.5.1 Large Coding Capacity 1796.5.2 Compact Size 1796.5.3 Configurability 179References 180Part III SystemIntegration for Printed Electronics 1837 Heterogeneous Integration of Silicon and Printed Electronics 1857.1 Introduction 1857.2 Inkjet-printed Interconnections 1867.2.1 Inkjet Printing Technology 1867.2.2 Electrical Performance and Morphology 1887.2.3 Reliability Evaluation in 85 ∘C/85% RH Ambient 1917.3 Heterogeneous Integration 1927.3.1 Introduction of Traditional Integration Approach 1927.3.2 Heterogeneous Integration Process 1947.3.3 Electrical Performance of Heterogeneous Interconnects 1987.3.4 Bendability of Heterogeneous Interconnects 2007.4 Summary 201References 2018 Intelligent Packaging: Humidity Sensing System 2058.1 Introduction 2058.2 Plastic-based Humidity Sensor Box Prototype 2078.2.1 Architecture of Humidity Sensor Box 2078.2.2 f-MWCNT-based Resistive Humidity Sensor 2088.2.3 System Integration 2088.3 Paper-based Humidity Sensor Card Prototype 2108.3.1 Fatigue of Interconnects versus Bending and Folding 2118.3.1.1 Sample Fabrication and Experimental Setups 2118.3.1.2 Fatigue Test Results and Discussion 2128.3.2 Bendability of the Humidity Sensor 2158.3.3 Demonstration of Humidity Sensor Cards 2178.4 Summary 218References 2189 Wearable Healthcare Device: Bio-Patch 2219.1 Introduction 2219.2 System Overview 2229.2.1 Bio-signals 2239.2.2 Customized Bio-sensing Chip 2259.2.3 Inkjet-printed Electrodes 2269.3 Paper-based Bio-Patch 2309.4 Polyimide-based Multi-channel Bio-Patch 2309.5 Polyimide-based Miniaturized Bio-Patch 2349.6 Summary 239References 23910 Life Cycle Assessment (LCA) for Printed Electronics 24310.1 Introduction 24310.2 Analysis Methodology 24610.3 Environmental Footprint 25210.4 Sustainable Production of Polymer- and Paper-based RFID Antennas 25810.5 Summary 264References 265Index 269