Vetenskap & teknik
RF and Microwave Microelectronics Packaging
Ken Kuang • Franklin Kim • Sean S Cahill
Inbunden
2819:-
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- Pocket/Paperback 2819:-
RF and Microwave Microelectronics Packaging presents the latest developments in packaging for high-frequency electronics. It will appeal to practicing engineers in the electronic packaging and high-frequency electronics fields and to academic researchers interested in understanding leading issues in the commercial sector. It covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods as well as other RF/MW packaging-related fields.
- Illustratör: 15 schwarz-weiße Tabellen 100 schwarz-weiße Abbildungen
- Format: Inbunden
- ISBN: 9781441909831
- Språk: Engelska
- Antal sidor: 285
- Utgivningsdatum: 2009-11-17
- Förlag: Springer-Verlag New York Inc.