Plasma Processing for Semiconductor Materials and Thin-Film Devices

Kuan Yew Cheong is a Professor in the School of Materials and Mineral Resources Engineering at Universiti Sains Malaysia. His research interests cover device fabrication, surface engineering, nanomaterials, semiconductor materials and devices, and electronic packaging materials. Behnam Akhavan is a Senior Lecturer of Biomedical Engineering at the University of Newcastle, Australia, where he heads the Plasma Bio-engineering Research Group. His Lab develops new plasma science and surface engineering solutions for a range of modern applications, including plasma surface engineering of bone implants, cardiovascular devices, and artificial nerves; plasma polymer nanoparticles for drug delivery; electrochromic coatings for wearable electronics; and micro/nano particles for toxin removal and water purification. Shih-Nan Hsiao is a Professor at the Center for Low-temperature Plasma Sciences, Nagoya University, Japan. His research interests include cryogenic plasma etching, atomic layer etching, plasma diagnostics, and simulations for semiconductor processes.Sheng-Chi Chen is a Professor in the Department of Materials Engineering and Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taiwan. His research focuses on nanotechnology applications, particularly in the fields of information storage, transparent conductive oxide and nitride films, as well as magnetic films. He specializes in plasma and thin-film processes and analyses of nanomaterial thin films deposited via sputtering, evaporation, and atomic layer deposition (ALD) processes. Phuoc Huu Le is an Associate Professor at the Center for Plasma and Thin Film Technologies, Ming Chi University of Technology, Taiwan. His research focuses on the development and characterization of thin films, including thermoelectric materials, topological insulators, transparent conducting oxides, metal oxides, and half-Heusler compounds. He is also deeply engaged in the fabrication of nanomaterials through plasma-based and physical-chemical methods, with applications spanning photochemical water splitting, electrochemical sensors, and nanophotocatalysts for the degradation of emerging pollutants and contaminants.

• Section I: Background and introduction to plasma science1. Plasma physics and applications2. Plasma diagnostic theory and methods3. Modelling of plasma chemistrySection II: Plasma processing: Thin Film Deposition4. Advanced physical vapor deposition (HiPIMS, etc)5. Advanced chemical vapor deposition (PE-ALD, etc)6. A review on plasma enhanced atomic layer deposition for advanced thin film deposition7. Plasma Jet Deposition8. Simulation of plasma model for metallic thin film depositionSection III: Plasma processing: Surface modification of thin films9. Surface functionalization of narrow bandgap semiconductors10. Surface functionalization of Si, SiGe, and Ge semiconductors11. Surface functionalization of wide bandgap semiconductors12. Surface functionalization of ultra-wide bandgap semiconductors13. Surface functionalization of advanced polymeric materials14. Surface functionalization of metallic surface modificationSection IV: Thin film etching and other plasma-enabled processes15. Low temperature plasma etching technology16. Etching technology for narrow bandgap semiconductor17. Etching technology for Si, SiGe, and Ge semiconductor18. Etching technology for wide bandgap semiconductor19. Etching technology for ultra-wide bandgap semiconductor20. Advances of plasma atomic layer etching technology21. Plasma dicing technologySection V: Energy, sensor and environmental applications of liquid plasma processing22. Synthesis of semiconductor nanomaterials for energy applications23. Environmental sensors via liquid plasma processingSection VI: Other advanced (thin film) plasma processing methods24. Cold atmospheric plasma25. Laser induced plasma26. Plasma for 3D printing27. Development of advanced plasma technology for semiconductor device thin film applications28. Advances of plasma etching technology for 3D advanced packaging for high density memory devicesSection VII: Plasmas for advanced and thin film characterization techniques29. Glow Discharge Mass Spectrometry (GD-MS)30. Glow Discharge Optical Emission Spectroscopy (GD-OES)31. Inductively Coupled Plasma Mass Spectrometry (ICP-MS)32. Inductively Coupled Plasma Optical Emission Spectroscopy (ICP-OES)Section VIII: Plasma and performance of semiconductor thin film devices33. Enhancement of device performance with plasma treatment34. Plasma induced damages and material defects related to device performance35. Plasma for wafer bonding