bokomslag Novel Structured Metallic and Inorganic Materials
Vetenskap & teknik

Novel Structured Metallic and Inorganic Materials

Yuichi Setsuhara Toshio Kamiya Shin-Ichi Yamaura

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Andra format:

  • 620 sidor
  • 2020
This book describes a series of research topics investigated during the 6 years from 2010 through 2015 in the project "Advanced Materials Development and Integration of Novel Structured Metallic and Inorganic Materials". Every section of the book is aimed at understanding the most advanced research by describing details starting with the fundamentals as often as possible. Because both fundamental and cutting-edge topics are contained in this book, it provides a great deal of useful information for chemists as well as for materials scientists and engineers who wish to consider future prospects and innovations. The contents of Novel Structured Metallic and Inorganic Materials are unique in materials science and technology. The project was carried out through the cooperation of research groups in the following six institutes in Japan: the Institute for Materials Research (IMR), Tohoku University; the Materials and Structures Laboratory (MSL), Tokyo Institute of Technology; the Joining and Welding Research Institute (JWRI), Osaka University; the Eco-Topia Science Institute (EST), Nagoya University; the Institute of Biomaterials and Bioengineering (IBB), Tokyo Medical and Dental University; and the Institute for Nanoscience and Nanotechnology (INN), Waseda University. Major objectives of the project included creation of advanced metallic and inorganic materials with a novel structure, as well as development of materials-joining technologies for development of cutting-edge applications as environmental and energy materials, biomedical materials, and electronic materials for contributing to the creation of a safer and more secure society.
  • Författare: Yuichi Setsuhara, Toshio Kamiya, Shin-Ichi Yamaura
  • Format: Pocket/Paperback
  • ISBN: 9789811376139
  • Språk: Engelska
  • Antal sidor: 620
  • Utgivningsdatum: 2020-08-14
  • Förlag: Springer Verlag, Singapore