Modeling and Simulation for Microelectronic Packaging Assembly

Manufacturing, Reliability and Testing

Inbunden, Engelska, 2011

Av Shen Liu, Yong Liu, China) Liu, Shen (Huazhong University of Science and Technology, Wuhan, Hubei

1 969 kr

Beställningsvara. Skickas inom 5-8 vardagar

Fri frakt för medlemmar vid köp för minst 249 kr.

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first timeProvides the skills necessary for virtual prototyping and virtual reliability qualification and testingDemonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic productsCovers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnectsAppendix and color images available for download from the book's companion websiteLiu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource.Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

Produktinformation

Utgivningsdatum2011-10-21
Mått175 x 252 x 36 mm
Vikt1 134 g
FormatInbunden
SpråkEngelska
Antal sidor576
FörlagJohn Wiley & Sons Inc
ISBN9780470827802

Tillhör följande kategorier

Sheng Liu is a ChangJiang Professor of Mechanical Engineering at Huazhong University of Science and Technology. He holds a dual appointment at Wuhan National Laboratory for Optoelectronics, and has served as tenured faculty at Wayne State University. He has over 14 years experience in LED/MEMS/IC packaging and extensive experience in consulting with many leading multi-national and Chinese companies. Liu was awarded the White House/NSF Presidential Faculty Fellowship in 1995, ASME Young Engineer Award in 1996, and China NSFC Overseas Young Scientist in 1999. He is currently one of the 11 National Committee Members in LED under Ministry of Science and Technology. He obtained a Ph.D. from Stanford in 1992, and got MS and BS in flight vehicle design, Nanjing University of Aeronautics and Astronautics, and he had three years industrial experience in China and USA. He has filed more than 70 patents in China and the USA, and has published more than 300 technical articles. Yong Liu is a global team leader of electrical, thermal-mechanical modeling and analysis at Fairchild Semiconductor Corp in South Portland, Maine. His main interest areas are IC packaging, modeling and simulation, reliability and material characterization. He has previously served as Professor at Zhejiang University of Technology, and has worked as an opto package engineer at Nortel Networks in Boston. Liu has co-authored over 100 papers in journals and conferences, has filed over 40 US patents in the area of IC packaging and power device, and has won numerous awards and fellowships in academia and industry: the Fairchild President Award, Fairchild Key Technologist, Fairchild New Product Innovation Award, the Alexander von Humboldt European Fellowship for study at Braunschweig University of Technology and University of Cambridge. Liu holds a PhD from Nanjing University of Science and Technology.

Foreword by C. P. Wong xiii Foreword by Zhigang Suo xvPreface xviiAcknowledgments xixAbout the Authors xxiPart I Mechanics and Modeling 11 Constitutive Models and Finite Element Method 31.1 Constitutive Models for Typical Materials 31.1.1 Linear Elasticity 31.1.2 Elastic-Visco-Plasticity 51.2 Finite Element Method 91.2.1 Basic Finite Element Equations 91.2.2 Nonlinear Solution Methods 121.2.3 Advanced Modeling Techniques in Finite Element Analysis 141.2.4 Finite Element Applications in Semiconductor Packaging Modeling 171.3 Chapter Summary 18References 192 Material and Structural Testing for Small Samples 212.1 Material Testing for Solder Joints 212.1.1 Specimens 212.1.2 A Thermo-Mechanical Fatigue Tester 232.1.3 Tensile Test 242.1.4 Creep Test 262.1.5 Fatigue Test 312.2 Scale Effect of Packaging Materials 322.2.1 Specimens 332.2.2 Experimental Results and Discussions 342.2.3 Thin Film Scale Dependence for Polymer Thin Films 392.3 Two-Ball Joint Specimen Fatigue Testing 412.4 Chapter Summary 41References 433 Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution 453.1 Constitutive Model for Tin-Lead Solder Joint 453.1.1 Model Formulation 453.1.2 Determination of Material Constants 473.1.3 Model Prediction 493.2 Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills 503.2.1 Constitutive Modeling of Underfills 503.2.2 Identification of Material Constants 553.2.3 Model Verification and Prediction 553.3 A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys 563.3.1 Damage Coupling Thermodynamic Framework 563.3.2 Large Deformation Formulation 623.3.3 Identification of the Material Parameters 633.3.4 Creep Damage 663.4 User-Supplied Subroutines for Solders Considering Damage Evolution 673.4.1 Return-Mapping Algorithm and FEA Implementation 673.4.2 Advanced Features of the Implementation 693.4.3 Applications of the Methodology 713.5 Chapter Summary 76References 764 Accelerated Fatigue Life Assessment Approaches for Solders in Packages 794.1 Life Prediction Methodology 794.1.1 Strain-Based Approach 804.1.2 Energy-Based Approach 824.1.3 Fracture Mechanics-Based Approach 824.2 Accelerated Testing Methodology 824.2.1 Failure Modes via Accelerated Testing Bounds 834.2.2 Isothermal Fatigue via Thermal Fatigue 834.3 Constitutive Modeling Methodology 834.3.1 Separated Modeling via Unified Modeling 834.3.2 Viscoplasticity with Damage Evolution 844.4 Solder Joint Reliability via FEA 844.4.1 Life Prediction of Ford Joint Specimen 844.4.2 Accelerated Testing: Insights from Life Prediction 874.4.3 Fatigue Life Prediction of a PQFP Package 914.5 Life Prediction of Flip-Chip Packages 934.5.1 Fatigue Life Prediction with and without Underfill 934.5.2 Life Prediction of Flip-Chips without Underfill via Unified and Separated Constitutive Modeling 954.5.3 Life Prediction of Flip-Chips under Accelerated Testing 964.6 Chapter Summary 99References 995 Multi-Physics and Multi-Scale Modeling 1035.1 Multi-Physics Modeling 1035.1.1 Direct-Coupled Analysis 1035.1.2 Sequential Coupling 1045.2 Multi-Scale Modeling 1065.3 Chapter Summary 107References 1086 Modeling Validation Tools 1096.1 Structural Mechanics Analysis 1096.2 Requirements of Experimental Methods for Structural Mechanics Analysis 1116.3 Whole Field Optical Techniques 1126.4 Thermal Strains Measurements Using Moire Interferometry 1136.4.1 Thermal Strains in a Plastic Ball Grid Array (PBGA) Interconnection 1136.4.2 Real-Time Thermal Deformation Measurements Using Moire Interferometry 1166.5 In-Situ Measurements on Micro-Machined Sensors 1166.5.1 Micro-Machined Membrane Structure in a Chemical Sensor 1166.5.2 In-Situ Measurement Using Twyman–Green Interferometry 1186.5.3 Membrane Deformations due to Power Cycles 1186.6 Real-Time Measurements Using Speckle Interferometry 1196.7 Image Processing and Computer Aided Optical Techniques 1206.7.1 Image Processing for Fringe Analysis 1206.7.2 Phase Shifting Technique for Increasing Displacement Resolution 1206.8 Real-Time Thermal-Mechanical Loading Tools 1236.8.1 Micro-Mechanical Testing 1236.8.2 Environmental Chamber 1246.9 Warpage Measurement Using PM-SM System 1246.9.1 Shadow Moire and Project Moire Setup 1256.9.2 Warpage Measurement of a BGA, Two Crowded PCBs 1276.10 Chapter Summary 131References 1317 Application of Fracture Mechanics 1357.1 Fundamental of Fracture Mechanics 1357.1.1 Energy Release Rate 1367.1.2 J Integral 1387.1.3 Interfacial Crack 1397.2 Bulk Material Cracks in Electronic Packages 1417.2.1 Background 1417.2.2 Crack Propagation in Ceramic/Adhesive/Glass System 1427.2.3 Results 1467.3 Interfacial Fracture Toughness 1487.3.1 Background 1487.3.2 Interfacial Fracture Toughness of Flip-Chip Package between Passivated Silicon Chip and Underfill 1507.4 Three-Dimensional Energy Release Rate Calculation 1597.4.1 Fracture Analysis 1607.4.2 Results and Comparison 1607.5 Chapter Summary 165References 1658 Concurrent Engineering for Microelectronics 1698.1 Design Optimization 1698.2 New Developments and Trends in Integrated Design Tools 1798.3 Chapter Summary 183References 183Part II Modeling in Microelectronic Packaging and Assembly 1859 Typical IC Packaging and Assembly Processes 1879.1 Wafer Process and Thinning 1889.1.1 Wafer Process Stress Models 1889.1.2 Thin Film Deposition 1899.1.3 Backside Grind for Thinning 1919.2 Die Pick Up 1939.3 Die Attach 1989.3.1 Material Constitutive Relations 2009.3.2 Modeling and Numerical Strategies 2019.3.3 FEA Simulation Result of Flip-Chip Attach 2049.4 Wire Bonding 2069.4.1 Assumption, Material Properties and Method of Analysis 2079.4.2 Wire Bonding Process with Different Parameters 2089.4.3 Impact of Ultrasonic Amplitude 2109.4.4 Impact of Ultrasonic Frequency 2129.4.5 Impact of Friction Coefficients between Bond Pad and FAB 2149.4.6 Impact of Different Bond Pad Thickness 2179.4.7 Impact of Different Bond Pad Structures 2179.4.8 Modeling Results and Discussion for Cooling Substrate Temperature after Wire Bonding 2219.5 Molding 2239.5.1 Molding Flow Simulation 2239.5.2 Curing Stress Model 2309.5.3 Molding Ejection and Clamping Simulation 2369.6 Leadframe Forming/Singulation 2419.6.1 Euler Forward versus Backward Solution Method 2429.6.2 Punch Process Setup 2429.6.3 Punch Simulation by ANSYS Implicit 2449.6.4 Punch Simulation by LS-DYNA 2469.6.5 Experimental Data 2489.7 Chapter Summary 252References 25210 Opto Packaging and Assembly 25510.1 Silicon Substrate Based Opto Package Assembly 25510.1.1 State of the Technology 25510.1.2 Monte Carlo Simulation of Bonding/Soldering Process 25610.1.3 Effect of Matching Fluid 25610.1.4 Effect of the Encapsulation 25810.2 Welding of a Pump Laser Module 25810.2.1 Module Description 25810.2.2 Module Packaging Process Flow 25810.2.3 Radiation Heat Transfer Modeling for Hermetic Sealing Process 25910.2.4 Two-Dimensional FEA Modeling for Hermetic Sealing 26010.2.5 Cavity Radiation Analyses Results and Discussions 26210.3 Chapter Summary 264References 26411 MEMS and MEMS Package Assembly 26711.1 A Pressure Sensor Packaging (Deformation and Stress) 26711.1.1 Piezoresistance in Silicon 26811.1.2 Finite Element Modeling and Geometry 27011.1.3 Material Properties 27011.1.4 Results and Discussion 27111.2 Mounting of Pressure Sensor 27311.2.1 Mounting Process 27311.2.2 Modeling 27411.2.3 Results 27611.2.4 Experiments and Discussions 27711.3 Thermo-Fluid Based Accelerometer Packaging 27911.3.1 Device Structure and Operation Principle 27911.3.2 Linearity Analysis 28011.3.3 Design Consideration 28411.3.4 Fabrication 28511.3.5 Experiment 28511.4 Plastic Packaging for a Capacitance Based Accelerometer 28811.4.1 Micro-Machined Accelerometer 28911.4.2 Wafer-Level Packaging 29011.4.3 Packaging of Capped Accelerometer 29611.5 Tire Pressure Monitoring System (TPMS) Antenna 30311.5.1 Test of TPMS System with Wheel Antenna 30411.5.2 3D Electromagnetic Modeling of Wheel Antenna 30611.5.3 Stress Modeling of Installed TPMS 30711.6 Thermo-Fluid Based Gyroscope Packaging 31011.6.1 Operating Principle and Design 31211.6.2 Analysis of Angular Acceleration Coupling 31311.6.3 Numerical Simulation and Analysis 31411.7 Microjets for Radar and LED Cooling 31611.7.1 Microjet Array Cooling System 31911.7.2 Preliminary Experiments 32011.7.3 Simulation and Model Verification 32211.7.4 Comparison and Optimization of Three Microjet Devices 32411.8 Air Flow Sensor 32711.8.1 Operation Principle 32911.8.2 Simulation of Flow Conditions 33111.8.3 Simulation of Temperature Field on the Sensor Chip Surface 33311.9 Direct Numerical Simulation of Particle Separation by Direct Current Dielectrophoresis 33511.9.1 Mathematical Model and Implementation 33511.9.2 Results and Discussion 33911.10 Modeling of Micro-Machine for Use in Gastrointestinal Endoscopy 34111.10.1 Methods 34311.10.2 Results and Discussion 34811.11 Chapter Summary 353References 35412 System in Package (SIP) Assembly 36112.1 Assembly Process of Side by Side Placed SIP 36112.1.1 Multiple Die Attach Process 36112.1.2 Cooling Stress and Warpage Simulation after Molding 36512.1.3 Stress Simulation in Trim Process 36612.2 Impact of the Nonlinear Materials Behaviors on the Flip-Chip Packaging Assembly Reliability 36912.2.1 Finite Element Modeling and Effect of Material Models 37112.2.2 Experiment 37412.2.3 Results and Discussions 37512.3 Stacked Die Flip-Chip Assembly Layout and the Material Selection 38112.3.1 Finite Element Model for the Stack Die FSBGA 38312.3.2 Assembly Layout Investigation 38512.3.3 Material Selection 38912.4 Chapter Summary 393References 393Part III Modeling in Microelectronic Package Reliability and Test 39513 Wafer Probing Test 39713.1 Probe Test Model 39713.2 Parameter Probe Test Modeling Results and Discussions 40013.2.1 Impact of Probe Tip Geometry Shapes 40113.2.2 Impact of Contact Friction 40313.2.3 Impact of Probe Tip Scrub 40313.3 Comparison Modeling: Probe Test versus Wire Bonding 40613.4 Design of Experiment (DOE) Study and Correlation of Probing Experiment and FEA Modeling 40913.5 Chapter Summary 411References 41214 Power and Thermal Cycling, Solder Joint Fatigue Life 41314.1 Die Attach Process and Material Relations 41314.2 Power Cycling Modeling and Discussion 41314.3 Thermal Cycling Modeling and Discussion 42014.4 Methodology of Solder Joint Fatigue Life Prediction 42614.5 Fatigue Life Prediction of a Stack Die Flip-Chip on Silicon (FSBGA) 42714.6 Effect of Cleaned and Non-Cleaned Situations on the Reliability of Flip-Chip Packages 43414.6.1 Finite Element Models for the Clean and Non-Clean Cases 43514.6.2 Model Evaluation 43514.6.3 Reliability Study for the Solder Joints 43714.7 Chapter Summary 438References 43915 Passivation Crack Avoidance 44115.1 Ratcheting-Induced Stable Cracking: A Synopsis 44115.2 Ratcheting in Metal Films 44515.3 Cracking in Passivation Films 44715.4 Design Modifications 45215.5 Chapter Summary 452References 45216 Drop Test 45316.1 Controlled Pulse Drop Test 45316.1.1 Simulation Methods 45416.1.2 Simulation Results 45716.1.3 Parametric Study 45816.2 Free Drop 46016.2.1 Simulated Drop Test Procedure 46016.2.2 Modeling Results and Discussion 46116.3 Portable Electronic Devices Drop Test and Simulation 46716.3.1 Test Set-Up 46716.3.2 Modeling and Simulation 46816.3.3 Results 47016.4 Chapter Summary 470References 47117 Electromigration 47317.1 Basic Migration Formulation and Algorithm 47317.2 Electromigration Examples from IC Device and Package 47717.2.1 A Sweat Structure 47717.2.2 A Flip-Chip CSP with Solder Bumps 48017.3 Chapter Summary 496References 49718 Popcorning in Plastic Packages 49918.1 Statement of Problem 49918.2 Analysis 50118.3 Results and Comparisons 50318.3.1 Behavior of a Delaminated Package due to Pulsed Heating-Verification 50318.3.2 Convergence of the Total Strain Energy Release Rate 50418.3.3 Effect of Delamination Size and Various Processes for a Thick Package 50518.3.4 Effect of Moisture Expansion Coefficient 51418.4 Chapter Summary 515References 516Part IV Modern Modeling and Simulation Methodologies: Application to Nano Packaging 51919 Classical Molecular Dynamics 52119.1 General Description of Molecular Dynamics Method 52119.2 Mechanism of Carbon Nanotube Welding onto the Metal 52219.2.1 Computational Methodology 52219.2.2 Results and Discussion 52319.3 Applications of Car–Parrinello Molecular Dynamics 53019.3.1 Car–Parrinello Simulation of Initial Growth Stage of Gallium Nitride on Carbon Nanotube 53019.3.2 Effects of Mechanical Deformation on Outer Surface Reactivity of Carbon Nanotubes 53419.3.3 Adsorption Configuration of Magnesium on Wurtzite Gallium Nitride Surface Using First-Principles Calculations 53919.4 Nano-Welding by RF Heating 54419.5 Chapter Summary 548References 548Index 553