Materials Science and Technology of Optical Fabrication

Inbunden, Engelska, 2018

AvTayyab I. Suratwala,Tayyab I Suratwala

1 969 kr

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Covers the fundamental science of grinding and polishing by examining the chemical and mechanical interactions over many scale lengthsManufacturing next generation optics has been, and will continue to be, enablers for enhancing the performance of advanced laser, imaging, and spectroscopy systems. This book reexamines the age-old field of optical fabrication from a materials-science perspective, specifically the multiple, complex interactions between the workpiece (optic), slurry, and lap. It also describes novel characterization and fabrication techniques to improve and better understand the optical fabrication process, ultimately leading to higher quality optics with higher yield.Materials Science and Technology of Optical Fabrication is divided into two major parts. The first part describes the phenomena and corresponding process parameters affecting both the grinding and polishing processes during optical fabrication. It then relates them to the critical resulting properties of the optic (surface quality, surface figure, surface roughness, and material removal rate). The second part of the book covers a number of related topics including: developed forensic tools used to increase yield of optics with respect to surface quality (scratch/dig) and fracture loss; novel characterization and fabrication techniques used to understand/quantify the fundamental phenomena described in the first part of the book; novel and recent optical fabrication processes and their connection with the fundamental interactions; and finally, special techniques utilized to fabricate optics with high damage resistance. Focuses on the fundamentals of grinding and polishing, from a materials science viewpoint, by studying the chemical and mechanical interactions/phenomena over many scale lengths between the workpiece, slurry, and lapExplains how these phenomena affect the major characteristics of the optic workpiece—namely surface figure, surface quality, surface roughness, and material removal rateDescribes methods to improve the major characteristics of the workpiece as well as improve process yield, such as through fractography and scratch forensicsCovers novel characterization and fabrication techniques used to understand and quantify the fundamental phenomena of various aspects of the workpiece or fabrication processDetails novel and recent optical fabrication processes and their connection with the fundamental interactionsMaterials Science and Technology of Optical Fabrication is an excellent guidebook for process engineers, fabrication engineers, manufacturing engineers, optical scientists, and opticians in the optical fabrication industry. It will also be helpful for students studying material science and applied optics/photonics.

Produktinformation

Utgivningsdatum2018-11-30
Mått152 x 231 x 23 mm
Vikt771 g
FormatInbunden
SpråkEngelska
Antal sidor416
FörlagJohn Wiley & Sons Inc
ISBN9781119423683

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TAYYAB I. SURATWALA, PhD, is Program Director for Optics and Materials Science & Technology (OMST) in the NIF & Photon Science Directorate at Lawrence Livermore National Laboratory. He directs and oversees OMST operations, which include the optics supply for laser programs in the directorate, the NIF optics recycle loop, and the accompanying materials science and technology (including laser damage science & mitigation and optical fabrication).

Preface xiAcknowledgments xviiGlossary of Symbols and Abbreviations xixPart I Fundamental Interactions – Materials Science 11 Introduction 31.1 Optical-Fabrication Processes 31.2 Major Characteristics of the Optical-Fabrication Process 71.3 Material Removal Mechanisms 11References 122 Surface Figure 152.1 The Preston Equation 152.2 The Preston Coefficient 162.3 Friction at Interface 192.4 Kinematics and Relative Velocity 222.5 Pressure Distribution 252.5.1 Applied Pressure Distribution 262.5.2 Elastic Lap Response 272.5.3 Hydrodynamic Forces 282.5.4 Moment Forces 312.5.5 Viscoelastic and Viscoplastic Lap Properties 342.5.5.1 Viscoelastic Lap 342.5.5.2 Viscoplastic Lap 382.5.6 Workpiece–Lap Mismatch 382.5.6.1 Workpiece Shape 412.5.6.2 PadWear/Deformation 422.5.6.3 Workpiece Bending 442.5.6.4 Residual Grinding Stress 472.5.6.5 Temperature 512.5.6.6 Global Pad Properties 562.5.6.7 Slurry Spatial Distribution 582.5.6.8 Local Nonlinear Material Deposits 602.6 Deterministic Surface Figure 63References 683 Surface Quality 753.1 Subsurface Mechanical Damage 753.1.1 Indentation Fracture Mechanics 763.1.1.1 Static Indentation 763.1.1.2 Edge Chipping and Bevels 813.1.1.3 Sliding Indentation 843.1.1.4 Impact Indentation Fracture 873.1.2 SSD During Grinding 923.1.2.1 Subsurface Mechanical Depth Distributions 923.1.2.2 Relationship of Roughness and Average Crack Length to the Maximum SSD Depth 973.1.2.3 Fraction of Abrasive Particles Mechanically Loaded 983.1.2.4 Relationship Between the Crack Length and Depth 1003.1.2.5 SSD Depth-distribution Shape 1023.1.2.6 Effect of Various Grinding Parameters on SSD Depth Distributions 1043.1.2.7 Rogue Particles During Grinding 1063.1.2.8 Conclusions on Grinding SSD 1083.1.3 SSD During Polishing 1093.1.4 Effect of Etching on SSD 1183.1.4.1 Topographical Changes of SSD During Etching 1203.1.4.2 Influence of SDD Distribution on Etch Rate and Roughness 1233.1.5 Strategies to Minimize SSD 1273.2 Debris Particles and Residue 1293.2.1 Particles 1303.2.2 Residue 1323.2.3 Cleaning Strategies and Methods 1343.3 The Beilby Layer 1363.3.1 K Penetration by Two-step Diffusion 1403.3.2 Ce Penetration by Chemical Reactivity 1423.3.3 Chemical–Structural–Mechanical Model of the Beilby Layer and Polishing Process 145References 1484 Surface Roughness 1574.1 Single-Particle Removal Function 1574.2 Beilby Layer Properties 1664.3 Slurry PSD 1674.4 Pad Mechanical Properties and Topography 1704.5 Slurry Interface Interactions 1744.5.1 Slurry Islands and μ-roughness 1744.5.2 Colloidal Stability of Particles in Slurry 1804.5.3 Glass Reaction Product Buildup at Polishing Interface 1844.5.4 Three-Body Forces at Polishing Interface 1854.6 Slurry Redeposition 1874.7 Predicting Roughness 1924.7.1 EHMG – The Ensemble Hertzian Multi-gap Model 1924.7.1.1 Pad Deflection and Fraction of Pad Area Making Contact 1944.7.1.2 Asperity Stress, Interface Gap, Load/Particle Distribution, and Fraction of Active Particles 1944.7.1.3 Single Particle Removal Function and Load per Particle Distribution 1964.7.1.4 Monte Carlo Workpiece Roughness Simulation 1964.7.2 IDG Island-distribution Gap Model 1994.8 Strategies to Reduce Roughness 2044.8.1 Strategy 1: Reduce or Narrow the Load-per-particle Distribution 2044.8.2 Strategy 2: Modify the Removal Function of a Given Slurry 204References 2075 Material Removal Rate 2115.1 Grinding Material Removal Rate 2115.2 Polishing Material Removal Rate 2175.2.1 Deviations from Macroscopic Preston Equation 2175.2.2 Macroscopic Material Removal Trends from Microscopic/Molecular Phenomena 2195.2.3 Factors Affecting Single-particle Removal Function 2265.2.3.1 Nanoplastic Effects: Workpiece Hardness 2265.2.3.2 Chemical Effects: Condensation Rate and Partial-charge Model 228References 238Part II Applications – Materials Technology 2416 Increasing Yield: Scratch Forensics and Fractography 2436.1 Fractography 101 2436.2 Scratch Forensics 2486.2.1 Scratch Width 2496.2.2 Scratch Length 2516.2.3 Scratch Type 2516.2.4 Scratch Number Density 2526.2.5 Scratch Orientation and Trailing-indent Curvature 2526.2.6 Scratch Pattern and Curvature 2526.2.7 Location on Workpiece 2536.2.8 Scratch Forensics Example 2546.3 Slow Crack Growth and Lifetime Predictions 2546.4 Fracture Case Studies 2576.4.1 Temperature-induced Fracture 2576.4.1.1 Laser-Phosphate-glass Thermal Fracture 2596.4.1.2 KDP Crystal-Workpiece Thermal Fracture 2626.4.1.3 Thermal Fracture of Multilayers 2656.4.2 Blunt Loading with Friction 2676.4.3 Glass-to-metal Contact and Edge Chipping 2696.4.4 Glue Chipping Fracture 2716.4.5 Workpiece Failure from Differential Pressure 2736.4.6 Chemical Interactions and Surface Cracking 2766.4.6.1 Surface Cracking of Phosphate Glass 2766.4.6.2 Surface Cracking of the DKDP Crystals 279References 2827 Novel Process and Characterization Techniques 2857.1 Process Techniques 2867.1.1 Stiff Versus Compliant Blocking 2867.1.2 Strip Etch and Bulk Etch 2907.1.3 Pad Wear Management with Septum or Conditioner 2917.1.4 Hermetically Sealed, High-humidity Polishing Chamber 2947.1.5 Engineered Filtration System 2957.1.6 Slurry Chemical Stabilization 2967.1.7 Slurry Lifetime and Slurry Recycling 3007.1.8 Ultrasonic Pad Cleaning 3017.2 Workpiece Characterization Techniques 3047.2.1 Single-particle Removal Function Using Nanoscratching 3047.2.2 Subsurface Damage Measurement Using a Taper Wedge 3057.2.3 Stress Measurement Using the Twyman Effect 3067.2.4 Beilby Layer Characterization Using SIMS 3077.2.5 Surface Densification Using Indentation and Annealing 3087.2.6 Crack Initiation and Growth Constants Using Static Indentation 3097.3 Polishing- or Grinding-system Characterization Techniques 3097.3.1 Tail End of Slurry PSD Using SPOS 3097.3.2 Pad Topography Using Confocal Microscopy 3117.3.3 Slurry Stability Using Zeta Potential 3117.3.4 Temperature Distribution During Polishing Using IR Imaging 3137.3.5 Slurry Spatial Distribution and Viscoelastic Lap Response Using a Nonrotating Workpiece 3147.3.6 Slurry Reactivity Versus Distance Using Different Pad Grooves 315References 3168 Novel Polishing Methods 3198.1 Magnetorheological Finishing (MRF) 3198.2 Float Polishing 3268.3 Ion Beam Figuring (IBF) 3298.4 Convergent Polishing 3318.5 Tumble Finishing 3368.6 Other Subaperture Polishing Methods 344References 3479 Laser Damage Resistant Optics 3539.1 Laser Damage Precursors 3569.2 Reduction of SSD in Laser Optics 3629.3 Advanced Mitigation Process 363References 369Index 371

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