Vetenskap & teknik
Pocket
Materials for High-Temperature Semiconductor Devices
National Research Council • Division On Engineering And Physical Sciences • National Materials Advisory Board • Commission On Engineering And Technical Systems • Committee On Materials For High-Temperature Semiconductor Devices
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Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities. Table of Contents Front Matter Executive Summary Backgorund State of the Art of Wide Bandgap Materials Device Physics: Behavior at Elevated Temperatures Generic Technical Issues Associated with Materials for High-Temperatures... High-Temperature Electronic Packaging Device Testing for High-Temperature Electronic Materials Conclusions and Recommendations References Appendix A: Silicon as a High-Temperature Material Appendix B: Gallium Arsenide as a High Temperature Material Appendix C: High-Temperature Microwave Devices Appendix D: Biographical Sketches of Committee Members
- Format: Pocket/Paperback
- ISBN: 9780309053358
- Språk: Engelska
- Antal sidor: 136
- Utgivningsdatum: 1995-10-01
- Förlag: National Academies Press