Interconnect Reliability in Advanced Memory Device Packaging

• Chapter 1: Advanced Memory and Device Packaging.- Chapter 2: Wearout Reliability-based Characterization in Memory Packaging.- Chapter 3: Recycling of Noble Metals Used in Memory Packaging.- Chapter 4: Advanced Flip Chip Packaging.- Chapter 5: Second Level Interconnect Reliability of Low Temperature Solder Materials Used in Memory Modules and Solid-State Drives (SSD).- Chapter 6: Specific Packaging Reliability Testing.- Chapter 7: Reliability Simulation and Modeling in Memory Packaging.- Chapter 8: Interconnects Reliability for Future Cryogenic Memory Applications.

“Interconnect Reliability in Advanced Memory Device Packaging, presents good technical insights of mechanical and thermal reliability for modern memory packaging, considering materials, processes, and manufacturing and integration technologies and applications, which is suitable for both industry engineering and academic practitioners. … For whom is this book most likely intended? Undoubtedly, it will be of great value to all those faced with the challenging problems created by the ever-increasing interest in first and second level interconnect reliability of memory device packaging.” (Chong Leong Gan and Chen-Yu Huang, Journal of Adhesion Science and Technology, June 5, 2024)