Handbook of Thin Film Deposition

Theory, Technology and Semiconductor Applications

Häftad, Engelska, 2024

AvDominic Schepis,Krishna Seshan,Dominic (Formally Globalfoundries) Schepis,University of Arizona) Seshan, Krishna (Former Assistant Professor, Materials Science

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Handbook of Thin Film Deposition: Theory, Technology and Semiconductor Applications, Fifth Edition, is a comprehensive reference focusing on thin film technologies and applications used in the semiconductor industry and the closely related areas of thin film deposition, thin film microproperties, ferroelectric films, LED research, and materials for memory applications, and other thin film applications.

Of particular note in this new edition is the coverage of “reduction to practice,” a phase where the idea for a technology transitions from a concept to actual implementation. This section includes chapters that review the most relevant methods to fabricate thin films toward practical applications. This book also discusses the latest applications of various thin film deposition technologies.

Handbook of Thin Film Deposition: Theory, Technology and Semiconductor Applications, Fifth Edition, is suitable for students, materials scientists, engineers, and managers working in academia or semiconductor-related R&D.

Offers a practical survey of thin film technologies including design, fabrication, and reliability
Covers core processes and applications in the semiconductor industry and discusses latest advances in new thin film development
Features new chapters that review methods on front-end and back-end thin films

Produktinformation

Utgivningsdatum2024-10-24
Mått152 x 229 x undefined mm
Vikt870 g
FormatHäftad
SpråkEngelska
Antal sidor538
Upplaga5
FörlagElsevier Science
ISBN9780443135231

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Maskinteknik och material inom Naturvetenskap och teknik

Dominic Schepis has over 35 years of experience in the semiconductor industry supporting logic and memory technologies. As a Principal Member of the Technical Staff at GlobalFoundries, Dominic worked on process development and integration for various advanced node CMOS technologies. His early work on SOI CMOS integration was instrumental to bringing this technology for use in IBM servers. He also was appointed Master Inventor at both IBM and GlobalFoundries and served on their patent evaluation boards. A graduate from Rensselaer Polytechnic Institute, he joined IBM’s Semiconductor Research and Development Center (SRDC) and has worked on a variety of advanced research and development projects and supported process sectors including reactive ion etching, epitaxial film growth, process integration, and other unit processes. During his tenure there, he coauthored over 29 technical journal papers and has over 100 issued US patents. Krishna Seshan was an Assistant Professor in Materials Science at the University of Arizona with extensive professional experience as a technologist at both IBM and Intel Corporations. Dr. Seshan passed away in 2017.

1. IntroductionPart I Reduction to Practice2. Process Integration for On-Chip Interconnects3. Sputter Processing4. Epitaxial Thin Film Growth5. CVD Processing and Processes6. CMP: Scaling Down and Stacking Up: How the Trends in Semiconductors are Affecting Chemical-Mechanical Planarization7. Limits of Gate Dielectric ScalingPart II Applications and Limitations8. Reliability Considerations for Thin Film Devices9. Thin Film Development for LED Technologies10. Emerging Ferroelectric Thin Films: Applications and Processing11. Applications of Thin Film in Semiconductor Memories12. Yield Issues and Defect Density in Thin Films