Failure Modes and Mechanisms in Electronic Packages

Inbunden, Engelska, 1997

AvP. Singh,Puligandla Viswanadham

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With the proliferation of packaging technology, failure and reliability have become serious concerns. This reference details processes that enable detection, analysis and the prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers, and PCB assemblies. The book should be of interest to electrical design engineers, materials and process engineers, reliability engineers and manufacturing engineers.

Produktinformation

Utgivningsdatum1997-11-30
Mått155 x 235 x 26 mm
Vikt699 g
FormatInbunden
SpråkEngelska
Antal sidor370
FörlagChapman and Hall
ISBN9780412105913

Tillhör följande kategorier

1 Introduction.- 1.1 The Technology.- 1.2 Packaging Failure.- 1.3 Approach and Methodology.- 1.4 Packaging Hierarchy.- 1.5 Failure Detection.- 1.6 Analysis.- 1.7 Modes and Mechanisms.- 1.8 Physics of failure and statistical models.- 1.9 Prevention.- 1.10 The Future.- 1.11 Suggested Readings.- 2 Electronics Packaging.- 2.1 Introduction.- 2.2 Packaging Nomenclature.- 2.3 Package Function.- 2.4 Plated-Through-Hole and Surface Mount Technology.- 2.5 Chip Level Packaging.- 2.6 Printed Circuit Board Assembly.- 2.7 Connectors, Cables, and Sockets.- 2.8 Box Level Package.- 2.9 Cost of Failures.- 2.10 Summary.- 2.11 Suggested Readings.- 2.12 References.- 3 Why Failures Occur.- 3.1 Introduction.- 3.2 Stress vs. Strength.- 3.3 Poor Design Practices.- 3.4 Manufacturing Defects.- 3.5 Electrical Design Considerations.- 3.6 Material Characteristics.- 3.7 Summary.- 3.8 References.- 4 Failure Detection.- 4.1 Introduction.- 4.2 Analytical Modeling.- 4.3 Simulation.- 4.4 Environmental Stress Tests.- 4.5 Test Methodology Innovations.- 4.6 Summary.- 4.7 Suggested Readings.- 4.8 References.- 5 Failure Analysis.- 5.1 Introduction.- 5.2 Visual Inspection.- 5.3 Decapsulation.- 5.4 Moiré Interferometry.- 5.5 Dye Penetrants.- 5.6 Metallurgical Analysis.- 5.7 Chemical Analysis.- 5.8 Atomic Absorption Emission Spectroscopies.- 5.9 UV/Visible Spectroscopy.- 5.10 Infrared Spectroscopy.- 5.11 Thermoanalytical Methods.- 5.12 Chromatography.- 5.13 Electron Beam Analysis.- 5.14 Laser Induced Ionization Mass Spectrometry (LIMS).- 5.15 Summary.- 5.16 Suggested Readings.- 5.17 References.- 6 Failure Modes and Mechanisms.- 6.1 Introduction.- 6.2 Failure Mode Types.- 6.3 Printed Circuit Board.- 6.4 Components and Packages.- 6.5 Interconnection Failures.- 6.6 Lead-Free Solders.- 6.7 Corrosion and Migration.-6.8 Connector Failures and Mechanisms.- 6.9 Solder Fatigue and Creep.- 6.10 Failures in Nonsemiconductor Components.- 6.11 Electro Static Discharge (ESD) Failures.- 6.12 PCB Laminates and Hollow Glass Fibers.- 6.13 Radiation-Induced Failures.- 6.14 Summary.- 6.15 Suggested Readings.- 6.16 References.- 7 Failure Models.- 7.1 Introduction.- 7.2 A Survey of Physical Models.- 7.3 Physics-of-Failure Based Models for Devices.- 7.4 Accelerated Factors and Transforms.- 7.5 Summary.- 7.6 References.- 8 Failure Prevention.- 8.1 Introduction.- 8.2 Concurrent Engineering and DFM.- 8.3 DFM Examples.- 8.4 Design for Assembly.- 8.5 Design for Test.- 8.6 Design for Qualification.- 8.7 Design for Reliability.- 8.8 Continuous Improvement Through Defect Management.- 8.9 Summary.- 8.10 References.