Electro Static Discharge

Michel Mardiguian is a private consultant in France, where he teaches EMI/RFI/ESD classes and consults on tasks from EMC design to firefighting. He has written or cowritten ten widely sold handbooks and has published twenty-eight conference papers and thirteen magazine articles.

• Preface to the First Edition ixPreface to the Third Edition xiAcknowledgements xiii1. The Electrostatic Discharge Phenomenon 11.1. Physics Involved 11.2. Influencing Parameters 61.3. Various Types of Electrostatic Charging with Humans and Objects 91.4. Statistics of Voltages and Currents Reached During ESD 131.4.1. Personnel ESD Statistics 151.4.2. Furniture and Objects ESD Statistics 181.5. Waveforms of Electrostatic Discharges 231.5.1. Personal ESD Waveforms 231.5.2. Furniture ESD Waveforms 281.5.3. Summary: Comparison of Dynamic Parameters for Personnel and Furniture ESD 301.5.4. Actual versus Idealized ESD Waveforms 31References 372. Effects of ESD on Electronics 392.1. Direct Discharge to an Electronic Component 392.2. Direct Discharge to Electronic Equipment Enclosure 502.3. Indirect Discharge 532.4. Coupling Mechanisms of ESD Pulse into the Victim’s Circuitry 542.4.1. Magnetic Field Coupling 552.4.2. Electric Field Coupling from Indirect ESD on Floating Parts 582.4.3. Measured E- and H-Field Values near an ESD to a Grounded Structure 602.4.4. Effect of Wave Impedance on Voltages Induced in Nearby PCBs and Small Circuits 642.4.5. Effect of a Typical Metallic Cabinet on ESD-Radiated Effects 672.4.6. Common Impedance Coupling with an ESD 692.5. Response of Victim Circuits and Type of Errors 702.5.1. Influence of Circuit Impedances 722.5.2. Specific Disturbance Created by the Hand/Metal Initial Spike 742.5.3. Errors/Malfunctions Induced in Analog Devices 742.6. Prediction of Actual ESD-Induced Error, Fast Approximation Method 752.7. Remarks on the Actual Current Paths and Associated Radiation 782.8. Personnel or Furniture ESD: Which One is Worse? 78References 793. Principal ESD Specifications 803.1. ESD Test Specifications for Device Sensitivity 823.1.1. MIL-Std 883 823.1.2. EIA/JEDEC and ESD Association Test Methods 833.2. ESD Specifications for Equipment Immunity 843.2.1. International Standard IEC 61000-4-2 843.2.2. ANSI C.63-16, ESD Test Methods, and Criteria for Electronic Equipment 853.2.3. ESD Immunity for Automobile Electronics, SAE J1113-13 and ISO 10605 853.2.4. MIL-Std 1541, ESD Immunity Requirements for Space Systems 863.3. Antistatic Control Procedures 863.3.1. Military Domain: MIL-Std 1686 and MIL 263 Handbook 863.3.2. Industry Standards for Static Control Programs 87References 884. ESD Diagnostics and Testing 894.1. ESD Simulators: How They Work 904.1.1. Arc or Direct Contact 924.1.2. Simulators for Equipment Test, Based on IEC 61000-4-2 Standard 954.1.3. Detailed Review of the IEC 61000-4-2 Simulator Definition 964.1.4. Generators with Different Networks, Very High Voltage and Field Enhancement Accessories 1054.1.5. Special Relays Required for ESD Simulators 1084.2. Furniture Versus Personnel ESD Simulation 1094.3. Other Types of ESD Simulators for Component Testing 1124.4. ESD Test Setup—Direct and Indirect ESD 1144.4.1. Ground Reference 1154.4.2. Direct versus Indirect ESD 1154.4.3. Roles of the HCP and VCP 1184.4.4. Grounding the Simulator and the EUT 1204.4.5. External Cables and System Configuration 1204.5. ESD Test Routine and Discharge Procedures 1214.5.1. Preparation of EUT for Test Readiness 1214.5.2. Application of the Discharges 1224.6. No Error/No Damage Concept: The Several Layers of Severity 1254.7. The Error per Discharge Concept or Multiple-Trials Approach 1294.7.1. Practical Application of the Error per Pulse Concept 1344.7.2. ESD Test Plan with Cost-Effectiveness Constraints 1354.8. ESD Test During Design and Development 1374.9. ESD For Field Diagnostics and Forced Crash Method 1404.10. Home-Made Investigation Tools and Diagnostic Hints 143References 1465. Design for ESD Immunity 1485.1. ESD Protection at Component Level 1505.1.1. Integrated Circuits with Internal ESD Protection 1505.1.2. Additional ESD Protection: When Is It Needed and How Much? 1535.2. ESD Protection at the PCB Level (Internal Circuitry) 1575.2.1. Reducing the Field-to-PCB Coupling Mechanisms 1585.2.2. PCB Connectors Areas 1595.2.3. Signal Ground versus Chassis Ground 1605.2.4. PCB Hardening with Plastic Products 1605.3. ESD Protection by Internal Wiring and Mechanical Packaging 1615.4. ESD Protection by Box Shielding and Envelope Design 1695.4.1. Some Shielding Basics 1705.4.2. How to Maintain Shield Integrity with Metal Housings 1785.4.3. How to Make Shield Barriers for Plastic Housings 1835.4.4. Treatment of Shield Openings 1875.4.5. Nonmetallized Plastic Boxes 1895.5. ESD Protection of External Cables and I/O Ports 1915.5.1. External Cable Shielding 1925.5.2. ESD Hardening of I/O Ports 2005.5.3. I/O Cable Entries ESD Protection with Plastic Products 2195.6. ESD Immunity by Software and Noise Inhibition Techniques 2215.7. ESD Immunity with Miniature, Portable Devices 2235.8. System ESD Immunity 2255.9. ESD Control at Installation Level 226References 2286. ESD Cases Studies 2306.1. Case 1: The Reradiating Ground Strap 2316.2. Case 2: ESD Hardening of a Printer 2326.3. Case 3: The Data Terminal with Floating Tray 2336.4. Case 4: The Safety Wire “Antenna” 2356.5. Case 5: The Touchy Watchdog 2366.6. Case 6: The Trigger-Happy Air bag Initiator 2366.7. Conclusion: Troubleshooting Hints 237Appendix A. ESD Protection by Design of Chips and Microcircuits 240Appendix B. Prediction of ESD Damage Level for a Semiconductor Junction 252Appendix C. Spark-Over Voltages 255Appendix D. Fatigue Phenomena During Repeated ESD Testing 258Appendix E. Prediction of ESD-Induced Noise by Fast Frequency-Domain Calculations 260Appendix F. More Experiments on ESD Coupling to Boxes 269Appendix G. Examples of Simple SPICE Modeling of ESD Coupling Effects 279Appendix H. Time-to-Frequency Conversion for a Single Transient 293Index 295