Advanced Circuits for Emerging Technologies

Krzysztof (Kris) Iniewski, PhD, manages R&D developments at Redlen Technologies. He is also an executive director at CMOS Emerging Technologies. A former associate professor in the Electrical Engineering and Computer Engineering and Computer Engineering Department at the University of Alberta, Dr. Iniewski’s Main research interest is in IC design for medical and networking applications.

• Preface xiiiContributors xvPart I Digital Design and Power Management1 Design in the Energy–Delay Space 3Massimo Alioto, Elio Consoli, and Gaetano Palumbo1.1 Introduction 31.2 Energy and Delay Modeling 41.3 Energy–Delay Space Analysis and Hardware-Intensity 141.4 Energy-Efficient Design of Digital Circuits 201.5 Design of Energy-Efficient Pipelined Systems 291.6 Conclusion 36References 372 Subthreshold Source-Coupled Logic 41Armin Tajalli and Yusuf Leblebici2.1 Introduction 412.2 Ultralow Power CMOS Logic: Design and Tradeoffs 432.3 Subthreshold Source-Coupled Logic 472.4 Power-Frequency Scaling 512.5 Conclusions 53References 553 Ultralow-Voltage Design of Nanometer CMOS Circuits for Smart Energy-Autonomous Systems 57David Bol3.1 Introduction 573.2 Impact of Technology Scaling on Subthreshold MOSFET Characteristics 613.3 Scaling Trend of the Minimum-Energy Point 633.4 Practical Energy of Nanometer ULV Circuits under Robustness and Timing Constraints 693.5 Technology/Circuit Methodology and Roadmap for ULV Design in the Nanometer Era 753.6 Conclusion 78References 794 Impairment-Aware Analog Circuit Design by Reconfiguring Feedback Systems 85Ping-Ying Wang4.1 Introduction 864.2 Theorem of Impairment-Aware Analog Design in Feedback Systems 864.3 Practical Implementations 894.4 Measured Results 964.5 Conclusions 99References 1005 Rom-Based Logic Design: A Low-Power Design Perspective 103Bipul C. Paul5.1 Introduction 1035.2 RBL Design 1055.3 RBL Adder 1085.4 RBL Multiplier 1115.5 Conclusions 116References 1176 Power Management: Enabling Technology 119Lou Hutter and Felicia James6.1 Macroeconomic Drivers for Power Technologies 1196.2 Market Trends 1226.3 Application Examples 1236.4 Technology Implications and Trends 1246.5 Current Technologies and Capabilities 1306.6 Specific Application Example 1406.7 Emerging Technologies 1426.8 Conclusion 143References 1437 Ultralow Power Management Circuit for Optimal Energy Harvesting in Wireless Body Area Network 147Yen Kheng Tan, Yuanjin Zheng, and Huey Chian Foong7.1 Introduction 1477.2 Wireless Body Area Network 1487.3 Optimal Energy Harvesting System 1597.4 Ultralow Power Management Integrated Circuit for Solar Energy Harvesting System 1637.5 Conclusions 171References 171Part II Analog and RF design8 Analog Circuit Design for SOI 177Andrew Marshall8.1 SOI Devices 1778.2 Partially Depleted SOI 1788.3 FDSOI and FinFET 1818.4 Device Considerations (FDSOI AND PDSOI) 1818.5 Analog Circuit Building Blocks 1848.6 Operational Amplifiers 1898.7 Operational Transconductance Amplifier 1938.8 Radio Frequency Low-Noise Amplifier 1978.9 Mixers and Analog Multipliers 1978.10 Analog to Digital and Digital to Analog Converters 2018.11 Summary 204References 2049 Frequency Generation and Control with Self-Referenced CMOS Oscillators 207Michael S. McCorquodale, Nathaniel Gaskin, and Vidyabhusan Gupta9.1 Introduction 2079.2 Self-Referenced CMOS Oscillators 2119.3 Packaging 2259.4 Conclusion 234References 23510 Synthesis of Static and Dynamic Translinear Circuits 239Bradley A. Minch10.1 Translinear Circuits: What Is In a Name? 23910.2 The Scope of Translinear Circuits 24210.3 Static and Dynamic Translinear Circuit Synthesis 24210.4 Static Translinear Circuit Synthesis Examples 25010.5 Dynamic Translinear Circuit Synthesis Examples 260References 27211 Microwatt Power CMOS Analog Circuit Designs: Ultralow Power LSIS for Power-Aware Applications 277Ken Ueno and Tetsuya Hirose11.1 Introduction 27711.2 Subthreshold Characteristics in a MOSFET 27911.3 Low-Power Voltage Reference Circuits 28411.4 Low-Power Current Reference Circuits 29311.5 Example of Power-Aware LSI Applications: CMOS Smart Sensor for Monitoring the Quality of Perishables 29911.6 Conclusion and Discussion 308References 31012 High-Speed Current-Mode Data Drivers for Amoled Displays 313Yong-Joon Jeon and Gyu-Hyeong Cho12.1 Introduction 31312.2 Current-Mode Drivers in Representation of the Second-Generation Current Conveyor 31612.3 Improved Transient Current Feed-Forward Output Buffer 31712.4 Push-Pull Transient Current Feedforward Output Buffer 32412.5 Conclusion 332References 33313 RF Transceivers for Wireless Applications 335Alireza Zolfaghari, Hooman Darabi, and Henrik Jensen13.1 Transmitter Architectures 33513.2 Cartesian Transmitters 33613.3 Constant-Envelope Transmitters Using Phase Modulated Loops 33913.4 Polar Transmitters 34013.5 Case Studies 346References 350Part III Device Layout and Reliability14 Technology-Aware Communication Architecture Design for Parallel Hardware Platforms 355Davide Bertozzi, Alessandro Strano, Daniele Ludovici, and Francisco Gilabert14.1 Introduction 35514.2 NoC Building Blocks: The Switch 35814.3 NoC Connectivity Pattern 36214.4 NoCs and the GALS Paradigm 37214.5 Putting Everything Together: Technology-Aware Network Connectivity 38514.6 Looking Forward: Mesochronous Synchronization 38914.7 Conclusions 390References 39015 Design and Optimization of Integrated Transmission Lines on Scaled CMOS Technologies 393Federico Vecchi, Matteo Repossi, Wissam Eyssa, Paolo Arcioni, and Francesco Svelto15.1 Introduction 39315.2 Coplanar Waveguides 39415.3 Shielded Transmission Lines 39715.4 Accurate and Fast Analysis of Periodic Lines 40215.5 Design and Experimental Results 40615.6 Conclusions 411References 41316 On-Chip Surfing Interconnect 415Suwen Yang and Mark Greenstreet16.1 Introduction 41516.2 Surfing 41716.3 Surfing DLLs 41916.4 Pipelined Clock Forwarding 42316.5 Source Synchronous Surfing 42716.6 Surfing Handshakes 43116.7 Summary 435References 43617 On-Chip Spiral Inductors with Integrated Magnetic Materials 439Wei Xu, Saurabh Sinha, Hao Wu, Tawab Dastagir, Yu Cao, and Hongbin Yu17.1 Introduction 43917.2 Previous Work 44117.3 Magnetic Materials 44317.4 Simulation Study 44717.5 Device Fabrication 45117.6 Measurement Results 45317.7 Potential Applications of On-Chip Spiral Inductors with Magnetic Materials 45517.8 Conclusion 458References 45818 Reliability of Nanoelectronic VLSI 463Milos Stanisavljevic, Alexandre Schmid, and Yusuf Leblebici18.1 Introduction 46318.2 Increased Defect Density and Reliability 46418.3 Reliability Evaluation 46618.4 Historically Important CAD Tools 46718.5 Recent Progress 46918.6 Monte Carlo Reliability Evaluation Tool 47318.7 Fault-Tolerant Computing 47618.8 Conclusions 476References 47719 Temperature Monitoring Issues in Nanometer CMOS Integrated Circuits 483Pablo Ituero and Marisa López-Vallejo19.1 Introduction 48319.2 From Where Does Heat Come in Nanometer Circuits? 48519.3 Harmful Effects Due to Temperature in VLSI Chips 48819.4 Temperature Sensing for DTM 49319.5 Thermal Modeling 49819.6 Thermal Sensor Placement and Allocation 50019.7 Temperature Monitoring Networks 50319.8 Conclusions 505References 505Part IV Circuit Testing20 Low-Power Testing for Low-Power LSI Circuits 511Xiaoqing Wen and Yervant Zorian20.1 Introduction 51120.2 Test Power Problem in Logic LSI Testing 51320.3 Basic Strategies to Test Power Reduction 51520.4 Shift Power Reduction 51720.5 Capture Power Reduction 51920.6 Toward Next-Generation Low-Power Testing Solutions 52220.7 Summary 525References 52621 Checkers for Online Self-Testing of Analog Circuits 529Haralampos-G. Stratigopoulos and Yiorgos Makris21.1 Introduction 52921.2 Time-Invariant Linear Circuits 53121.3 Fully Differential Circuits 54221.4 Conclusions 553References 55322 Design and Test of Robust CMOS RF and mm-Wave Radios 557Sleiman Bou-Sleiman and Mohammed Ismail22.1 Introduction 55722.2 Why Robust RF and mm-Wave ICs? 55822.3 Design Methodology for First-Time-Right Radio SoCs 56422.4 Robust RF and mm-Wave Radio Transceivers 57122.5 Summary 578References 57923 Contactless Testing and Diagnosis Techniques 581Selahattin Sayil23.1 Introduction 58123.2 Electron-Beam Method 58223.3 Photoemissive Probing 58323.4 Electro-Optic Probing 58423.5 Charge Density Probing 58723.6 Photoexcitation Probe Techniques 58823.7 Electric Force Microscopy 58923.8 Capacitive Coupling Method 59023.9 Dynamic Internal Testing of CMOS using Hot-Carrier Luminescence 59123.10 All-Silicon Optical Contactless Testing of Integrated Circuits 59223.11 Conclusion 596References 596Index 599