John Lau - Böcker

Visar alla böcker från författaren John Lau.
8 produkter
John Lau, C.P. Wong, Ning-Cheng Lee, Ricky Lee - Electronics Manufacturing, Inbunden

Electronics Manufacturing

Av John Lau, C.P. Wong, Ning-Cheng Lee, Ricky Lee

Inbunden, Engelska, 2002

2 619 kr

Slutsåld
John Lau, Cheng Lee, C. Premachandran, Yu Aibin - Advanced MEMS Packaging, Inbunden

Advanced MEMS Packaging

Av John Lau, Cheng Lee, C. Premachandran, Yu Aibin

Inbunden, Engelska, 2009

2 619 kr

Slutsåld
John Lau, John H. Lau, John H Lau - Reliability of RoHS-Compliant 2D and 3D IC Interconnects, Inbunden

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Av John Lau, John H. Lau, John H Lau

Inbunden, Engelska, 2010

2 449 kr

Skickas inom 3-6 vardagar
John Lau, John H. Lau, John H Lau - Through-Silicon Vias for 3D Integration, Inbunden

Through-Silicon Vias for 3D Integration

Av John Lau, John H. Lau, John H Lau

Inbunden, Engelska, 2012

3 149 kr

Skickas inom 3-6 vardagar
John Lau, John H. Lau, John H Lau - 3D IC Integration and Packaging, Inbunden

3D IC Integration and Packaging

Av John Lau, John H. Lau, John H Lau

Inbunden, Engelska, 2015

3 069 kr

Skickas inom 3-6 vardagar
John Lau, John (London College of Fashion) Lau - Basics Fashion Design 09: Designing Accessories, Häftad

Basics Fashion Design 09: Designing Accessories

Av John Lau, John (London College of Fashion) Lau

Häftad, Engelska, 2019

469 kr

Skickas inom 7-10 vardagar
John Lau - Thermal Stress and Strain in Microelectronics Packaging, Häftad

Thermal Stress and Strain in Microelectronics Packaging

Av John Lau

Häftad, Engelska, 2012

2 109 kr

Skickas inom 10-15 vardagar
John Lau, Xuejun Fan - Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration, Inbunden

Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Av John Lau, Xuejun Fan

Inbunden, Engelska, 2025

2 919 kr

Skickas inom 10-15 vardagar