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John Lau – författare

Visar alla böcker från författaren John Lau.
8 produkter
John Lau - Reliability of RoHS-Compliant 2D and 3D IC Interconnects, Inbunden

2 399 kr

Skickas inom 3-6 vardagar

John Lau - Through-Silicon Vias for 3D Integration, Inbunden

3 079 kr

Skickas inom 3-6 vardagar

John Lau - 3D IC Integration and Packaging, Inbunden

AvJohn Lau

Inbunden, Engelska, 2015

2 889 kr

Skickas inom 3-6 vardagar

John Lau - Basics Fashion Design 09: Designing Accessories, Häftad

499 kr

Skickas inom 5-8 vardagar

John Lau - Thermal Stress and Strain in Microelectronics Packaging, Häftad

2 099 kr

Skickas inom 10-15 vardagar

  • Nyhet
John Lau, Kuo-Ning Chiang - Cu-Interconnects, Glass, and AI-Assisted Simulation for Chiplets and Heterogeneous Integration, Inbunden

2 799 kr

Skickas inom 10-15 vardagar

John Lau, Xuejun Fan - Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration, Inbunden

2 519 kr

Skickas inom 5-8 vardagar

  • Nyhet
John Lau, Xuejun Fan - Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration, Häftad

1 819 kr

Skickas inom 10-15 vardagar