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John H. Lau – författare

Visar alla böcker från författaren John H. Lau.
15 produkter
John H. Lau - Solder Joint Reliability, Inbunden

Solder Joint Reliability

Theory and Applications

AvJohn H. Lau

Inbunden, Engelska, 1991

2 889 kr

Skickas inom 10-15 vardagar

John H. Lau - Handbook Of Tape Automated Bonding, Inbunden

Handbook Of Tape Automated Bonding

AvJohn H. Lau

Inbunden, Engelska, 1992

2 889 kr

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John H. Lau - Chip On Board, Inbunden

Chip On Board

Technology for Multichip Modules

AvJohn H. Lau

Inbunden, Engelska, 1994

2 809 kr

Skickas inom 10-15 vardagar

Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau - Mechanics of Solder Alloy Interconnects, Inbunden

Mechanics of Solder Alloy Interconnects

AvDarrel R. Frear,Steven N. Burchettm. fl.

Inbunden, Engelska, 1994

2 889 kr

Skickas inom 10-15 vardagar

John H. Lau - Solder Joint Reliability, Häftad

Solder Joint Reliability

Theory and Applications

AvJohn H. Lau

Häftad, Engelska, 2014

2 809 kr

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John H. Lau - Fan-Out Wafer-Level Packaging, Inbunden

Fan-Out Wafer-Level Packaging

AvJohn H. Lau

Inbunden, Engelska, 2018

2 109 kr

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John H. Lau - Fan-Out Wafer-Level Packaging, Häftad

Fan-Out Wafer-Level Packaging

AvJohn H. Lau

Häftad, Engelska, 2018

1 549 kr

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John H. Lau - Heterogeneous Integrations, Inbunden

Heterogeneous Integrations

AvJohn H. Lau

Inbunden, Engelska, 2019

2 249 kr

Skickas inom 10-15 vardagar

John H. Lau, Ning-Cheng Lee - Assembly and Reliability of Lead-Free Solder Joints, Inbunden

Assembly and Reliability of Lead-Free Solder Joints

AvJohn H. Lau,Ning-Cheng Lee

Inbunden, Engelska, 2020

2 249 kr

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John H. Lau, Ning-Cheng Lee - Assembly and Reliability of Lead-Free Solder Joints, Häftad

Assembly and Reliability of Lead-Free Solder Joints

AvJohn H. Lau,Ning-Cheng Lee

Häftad, Engelska, 2021

1 619 kr

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John H. Lau - Semiconductor Advanced Packaging, Inbunden

Semiconductor Advanced Packaging

AvJohn H. Lau

Inbunden, Engelska, 2021

2 249 kr

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John H. Lau - Semiconductor Advanced Packaging, Häftad

Semiconductor Advanced Packaging

AvJohn H. Lau

Häftad, Engelska, 2022

1 689 kr

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John H. Lau - Chiplet Design and Heterogeneous Integration Packaging, Inbunden

Chiplet Design and Heterogeneous Integration Packaging

AvJohn H. Lau

Inbunden, Engelska, 2023

2 529 kr

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John H. Lau - Chiplet Design and Heterogeneous Integration Packaging, Häftad

Chiplet Design and Heterogeneous Integration Packaging

AvJohn H. Lau

Häftad, Engelska, 2024

1 829 kr

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John H. Lau - Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology, Inbunden

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

AvJohn H. Lau

Inbunden, Engelska, 2024

2 389 kr

Skickas inom 10-15 vardagar