John H. Lau - Böcker

Visar alla böcker från författaren John H. Lau.
20 produkter
John Lau, John H. Lau, John H Lau - Reliability of RoHS-Compliant 2D and 3D IC Interconnects, Inbunden

Reliability of RoHS-Compliant 2D and 3D IC Interconnects

Av John Lau, John H. Lau, John H Lau

Inbunden, Engelska, 2010

2 459 kr

Skickas inom 3-6 vardagar
John Lau, John H. Lau, John H Lau - Through-Silicon Vias for 3D Integration, Inbunden

Through-Silicon Vias for 3D Integration

Av John Lau, John H. Lau, John H Lau

Inbunden, Engelska, 2012

3 159 kr

Skickas inom 3-6 vardagar
John Lau, John H. Lau, John H Lau - 3D IC Integration and Packaging, Inbunden

3D IC Integration and Packaging

Av John Lau, John H. Lau, John H Lau

Inbunden, Engelska, 2015

3 149 kr

Skickas inom 3-6 vardagar
John H. Lau, John H Lau - Solder Joint Reliability, Inbunden

Solder Joint Reliability

Av John H. Lau, John H Lau

Inbunden, Engelska, 1991

2 799 kr

Skickas inom 7-10 vardagar
John H. Lau - Handbook Of Tape Automated Bonding, Inbunden

Handbook Of Tape Automated Bonding

Av John H. Lau

Inbunden, Engelska, 1992

2 799 kr

Skickas inom 7-10 vardagar
John H. Lau - Thermal Stress and Strain in Microelectronics Packaging, Inbunden

Thermal Stress and Strain in Microelectronics Packaging

Av John H. Lau

Inbunden, Engelska

1 249 kr

Slutsåld
John H. Lau, John H. Law, John H Lau - Chip On Board, Inbunden

Chip On Board

Av John H. Lau, John H. Law, John H Lau

Inbunden, Engelska, 1994

2 799 kr

Skickas inom 7-10 vardagar
Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau - Mechanics of Solder Alloy Interconnects, Inbunden

Mechanics of Solder Alloy Interconnects

Av Darrel R. Frear, Steven N. Burchett, Harold S. Morgan, John H. Lau

Inbunden, Engelska, 1994

2 799 kr

Skickas inom 7-10 vardagar
John H. Lau - Solder Joint Reliability, Häftad

Solder Joint Reliability

Av John H. Lau

Häftad, Engelska, 2014

2 799 kr

Skickas inom 7-10 vardagar
John H. Lau - Fan-Out Wafer-Level Packaging, Inbunden

Fan-Out Wafer-Level Packaging

Av John H. Lau

Inbunden, Engelska, 2018

2 109 kr

Skickas inom 7-10 vardagar
John H. Lau - Fan-Out Wafer-Level Packaging, Häftad

Fan-Out Wafer-Level Packaging

Av John H. Lau

Häftad, Engelska, 2018

1 549 kr

Skickas inom 7-10 vardagar
John H. Lau - Heterogeneous Integrations, Inbunden

Heterogeneous Integrations

Av John H. Lau

Inbunden, Engelska, 2019

2 239 kr

Skickas inom 7-10 vardagar
John H. Lau - Heterogeneous Integrations, Häftad

Heterogeneous Integrations

Av John H. Lau

Häftad, Engelska

2 009 kr

Slutsåld
John H. Lau, Ning-Cheng Lee - Assembly and Reliability of Lead-Free Solder Joints, Inbunden

Assembly and Reliability of Lead-Free Solder Joints

Av John H. Lau, Ning-Cheng Lee

Inbunden, Engelska, 2020

2 239 kr

Skickas inom 7-10 vardagar
John H. Lau, Ning-Cheng Lee - Assembly and Reliability of Lead-Free Solder Joints, Häftad

Assembly and Reliability of Lead-Free Solder Joints

Av John H. Lau, Ning-Cheng Lee

Häftad, Engelska, 2021

1 619 kr

Skickas inom 7-10 vardagar
John H. Lau - Semiconductor Advanced Packaging, Inbunden

Semiconductor Advanced Packaging

Av John H. Lau

Inbunden, Engelska, 2021

2 239 kr

Skickas inom 7-10 vardagar
John H. Lau - Semiconductor Advanced Packaging, Häftad

Semiconductor Advanced Packaging

Av John H. Lau

Häftad, Engelska, 2022

1 549 kr

Skickas inom 7-10 vardagar
John H. Lau - Chiplet Design and Heterogeneous Integration Packaging, Inbunden

Chiplet Design and Heterogeneous Integration Packaging

Av John H. Lau

Inbunden, Engelska, 2023

2 919 kr

Skickas inom 7-10 vardagar
John H. Lau - Chiplet Design and Heterogeneous Integration Packaging, Häftad

Chiplet Design and Heterogeneous Integration Packaging

Av John H. Lau

Häftad, Engelska, 2024

2 119 kr

Skickas inom 7-10 vardagar
John H. Lau - Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology, Inbunden

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

Av John H. Lau

Inbunden, Engelska, 2024

2 759 kr

Skickas inom 7-10 vardagar